Low Alpha Materials and Metrology in the IC Industry.ppt
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1、Low Alpha Materials and Metrology in the IC Industry,Current Status and Future Requirements,http:/ errors & IC development Current Status Materials Types Purity / Activity requirements Metrology Alpha emissivity Instrument capability Future Requirements Material specifications Changes on the horizon
2、 Purity /Activity requirements become more stringent Metrology Improvements,Integrated Circuits and Soft Error Upsets,Energetic particles depositing energy/charge in critical nodes Radioisotopes in component materials Cosmic ray contributions Microelectronic design trends Flip Chip Smaller geometrie
3、s/decreasing line widths Increased vulnerability to soft error mechanisms,Soft errors = significant issue in the future,IC Materials Overview,High purity metals and alloys Cu, Al, Ta, W, Ti, Pb, Sn, Ag, Ru Range in purity from 99.99% to 99.9999% Alpha Activity Requirements 0.02 hr1cm2 : early 1990s
4、0.01 hr1cm2 : late 1990s 0.002 hr1cm2: 2001 0.0002 hr1cm2:2006 Primary alpha emitters 210Pb in Pb/Sn solders U & Th,Material purity critical to reliability,Current Material Challenges: Contamination,Any material with U and/or Th above 1 ppb Some 99.99% materials fail Sn, In Possible contaminants Ref
5、ractory materials and ceramics Abrasives Atmospheric dust and debris Commercial metals & alloys All stages of manufacturing & processing must be controlled & monitored,Assume any material is an alpha contamination hazard until proven otherwise,Current Instrumentation Capability,Industry uses Gas Pro
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