Philips Communication IC Designand IC Application.ppt
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1、Communication IC Design and IC Application,The Philips approach Low-cost/high-performance system solutions Single-chip MM baseband for feature phones Mobile multimedia solutions Portable DTV/GPRS solution Software solutions Summary,Communication IC Design and IC Application - Agenda -,Differentiatin
2、g technology,Leadership in Systems and Platforms Leveraging Philips core competencies in R&D and CE heritage Nexperia: The Solution for Video and Mobile applications Shipping now in GSM handsets, digital televisions and DVD recorders Rich IP portfolio with fully integrated re-use concept Excellence
3、in RF RF is crucial for wireless applications QUBiC4 low cost, high performance RF And now, best-in-class CMOS 120 nm now, 90 nm first full lots now, 65 nm first silicon in Q4 2003 Ramp-up of 300 mm wafers pilot line in Crolles on target 0.18 m non-volatile EE/Flash for encryption technology in smar
4、t cards,Nexperia solutions build on comprehensive collective expertise in the Philips Group, particularly Philips consumer AV IP At the heart of all of our future system products across the markets we serve Modular hardware and software Support for industry standard operating systems Two application
5、 areas: Nexperia Home for Connected Home / Digital Home applications including digital television, home entertainment hubs, media servers, DVD recorders, PVRs, wireless displays and media adapters Nexperia Mobile for mobile multimedia handsets, wireless PDAs, other portable wireless devices,Nexperia
6、,The Philips approach Low-cost/high-performance system solutions Single-chip MM baseband for feature phones Mobile multimedia solutions Portable DTV/GPRS solution Software solutions Summary,Communication IC Design and IC Application - Agenda -,Nexperia Cellular System Solutions,Everything but the pl
7、astic: Complete reference designs for GSM/GPRS/EDGE mobile handhelds Full IOT validated system including Nexperia Cellular Multimedia Baseband, power management unit, RF, power amplifier and software Tailored for target applications Add multimedia with minimal cost, risk and time-to-market All you n
8、eed for multimedia handsets,Well on our way to 1 out of 10 GSM/GPRS phones based on Nexperia Cellular System Solution,Scope of Philips mobile applications,2003,2004,2005,2006/7,2008/9,Memory,Baseband,PMU/Charge,Transceiver,ASW/PA,FEM/GSM module,Analog IC RFCMOS,Single die CMOS,Step 1,Step 2,Step 3,R
9、F-CMOS Development,Audio,SySol,Baseband IC CMOS,SySol,Analog IC BiCMOS,Single package ME3,Single die ME4,System solutions: from sysol ME3 to ME4,Step 1: 2 dies in 2 technologies,Analog,Digital,High Power,Low Power,RF power amplifier,Batt charge switch,Analog pwr supply,RF power supply,Dig pwr supply
10、,Ref. Oscillator,Auxiliar ADCs,Transmitter + Synth,Memories Ram/ROM/Flash,DSP + CPU,JTAG + Peripherals,GMSK mod, Pre-dist.,BAI Audio sign. proc.,32 kHz clock unit,RTC + alarm,On/off control,CMOS 090,QUBIC4+,Auxiliary DACs,Analogue Audio,Micbias+ Audio det,RF power control,Receiver chain,Rx ADC,Step
11、2: 2 dies in 1 technology,Analog,Digital,High Power,Low Power,RF power amplifier,Batt charge switch,Analog pwr supply,RF power supply,Dig pwr supply,Ref. Oscillator,Auxiliar ADCs,Transmitter + Synth,Memories Ram/ROM/Flash,DSP + CPU,JTAG + Peripherals,GMSK mod, Pre-dist.,BAI Audio sign. proc.,32 kHz
12、clock unit,RTC + alarm,On/off control,CMOS090,RFCMOS090,Auxiliary DACs,Analog Audio,Micbias+ Audio det,RF power control,Receiver chain,Rx ADC,Analog,Digital,High Power,Low Power,RF power amplifier,Batt charge switch,Analog pwr supply,RF power supply,Dig pwr supply,Ref. Oscillator,Auxiliar ADCs,Trans
13、mitter + Synth,Memories Ram/ROM/Flash,DSP + CPU,JTAG + Peripherals,GMSK mod, Pre-dist.,BAI Audio sign. proc.,32 kHz clock unit,RTC + alarm,On/off control,CMOS090 with RF option,Step 3: 1 die in 1 technology ME4,Auxiliary DACs,Analogue Audio,Micbias+ Audio det,RF power control,Receiver chain,Rx ADC,H
14、igh-level requirements for ME3,Low to mid tier phone with EDGE capability Main technologies CMOS090 and QUBiC4+ Target 1 package, maximum 2 packages Enabling the path to1 die in CMOS for ME4 Main focus on size, component count and process diversity reduction, reaching BOM reduction at the same time,
15、Baseband - one page guideline,System target: GSM/EGPRS modem with integrated MRAM Integrated MRAM, which satisfies the mainstream Architecture: SC ARM9xx, DSP RD16025 DSP and SC memory concept to be revisited in the light of MRAM concept Technology: CMOS090 Typical implementation: Package option for
16、 external bus interface (EBI) for higher tier(s) On-chip integrated voltage regulators Stereo Audio and AUX ADCs on die Digital RF interface, USB OTG Digital interface options for GPS (GIU), camera, etc.,Transceiver - one page guideline,System target: GMSK and 8PSK modulation Architecture: TX: Polar
17、 modulation concept RX: Near Zero IF receiver Technology: QUBiC4+ 4.5 mm target die size Typical implementation: SD FracN PLL for PM and AM by PA-control DAC High dynamic RX ADC to relax analog requirements (filtering and # of AGC-steps) Digital RF interface Passive integration (PICS) Integrated pow
18、er supply,PA/antenna switch - one page guideline,System target: GPRS/ EGPRS, MSC 12, QB Architecture: Polar modulation; feed forward AM AM and AM/PM pre-distortion may be needed Technology: CMOS control + GaAs RF + Passi Si alternative: QUBiC4+ and Passi Si (passive integration) cost/performance tra
19、de-off Typical implementation: Saturated QB PA for GPRS and EGPRS Integrated QB, low-loss antenna switch Wide dynamic, high accurate AM control via analog AM control signal Phase pre-distortion via look-up tables Digital RF; control interface part (only) tbd Integrated power supply regulator,Power m
20、anagement - one page guideline,Distributed power supplies (RF and BB) Bulk of the power management on QUBiC4+ die Adaptive Voltage Scaling for BB part PowerWise Tube (post regulation LDOs on CMOS090) Partitioning for extra functionality has to be studied: Charging driver transistor (up to 20 V, incl
21、uding charge via USB) Backlight management (fun lighting, flash light, 20 V) USB OTG transceiver Battery connected supplies (voltage limitation or pre-regulation for RF and BB needed),Sysol software one page guideline,The Philips approach Low-cost/high-performance system solutions Single-chip MM bas
22、eband for feature phones Mobile multimedia solutions Portable DTV/GPRS solution Software solutions Summary,Communication IC Design and IC Application - Agenda -,2.5/3G Nexperia PNX5220 MM baseband IC,Contains ARM926 system controller (SC) with rich set of peripherals Telecom DSP Speech/Audio DSP Sev
23、eral intercore and and top-level blocks analog baseband and audio interface (BAI) Process 0.09 m CMOS process for digital 0.25 m CMOS process for analog Packages Production: TFBGA, 320 balls, 4 rows, 0.5 mm pitch Development: BGA376, 1mm for digital; LQFP80 for analog,I&Q,Burst FLASH, SRAM/PSRAM,Fro
24、nt end,hands free,MMC Memory Stick,PC, Mouse, USB Stick, Camera, .,Sensor OM6802,Charger,Charge IC UBA2008,Battery,LCD PCF8880/90,PNX5220,RF DAC,ARM926,UART,USIM,IIC,EBI NFI SDI,Stereo ADC Stereo DAC,RFCU,GIU,SPI3,UART,FCI MSI,SIM card,USB-OTG,PNX5220 application diagram,IOM2,UMTS Modem PCF0501,UAA3
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