硫酸铜填孔电镀理论.ppt
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1、硫酸銅填孔電鍍理論-有機物質成分,Organic additives Organic additive species Brightener/accelerator Carrier/suppressor Leveller,電鍍反應 : ( 摘要) 可溶解性陽極,Function 1 Reduce the activation energy and increase Cu deposition rate Additive can be monitored by CVS using standard addition method or Hull Cell,Additive Chemistry,F
2、unction 2 The side chains on the additive molecule has a barrier for Cu+ to deposit onto the surface. The probability to fill in steps and vacancies on the surface increases.,Additive Chemistry (Cont.),Function 3 The coverage of the additive on the surface enhanced nucleation and formation of random
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- 硫酸铜 电镀 理论
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