BS EN 140401-2009 Blank Detail Specification Fixed low power film surface mount (SMD) resistors.pdf
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1、raising standards worldwide NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW BSI British Standards Blank Detail Specification: Fixed low power film surface mount (SMD) resistors BS EN 140401:2009 National foreword This British Standard is the UK implementation of EN 140401:2009
2、. It super- sedes BS EN 140401:2002 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/40X, Capacitors and resistors for electronic equipment. A list of organizations represented on this committee can be obtained on request to its secretary. This pub
3、lication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. BSI 2009 ISBN 978 0 580 64032 2 ICS 31.040.10 Compliance with a British Standard cannot confer immunity from legal obligations. This British Standard was published unde
4、r the authority of the Standards Policy and Strategy Committee on 30 June 2009 Amendments issued since publication Amd. No. Date Text affected BRITISH STANDARDBS EN 140401:2009 EUROPEAN STANDARD EN 140401 NORME EUROPENNE EUROPISCHE NORM April 2009 CENELEC European Committee for Electrotechnical Stan
5、dardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: avenue Marnix 17, B - 1000 Brussels 2009 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 140401:2009
6、 E ICS 31.040.10 Supersedes EN 140401:2002 English version Blank Detail Specification: Fixed low power film surface mount (SMD) resistors Spcification particulire cadre: Rsistances fixes couches et faible dissipation pour montage en surface (CMS) Vordruck fr Bauartspezifikation: Oberflchenmontierbar
7、e (SMD) Schicht-Festwiderstande niedriger Belastbarkeit This European Standard was approved by CENELEC on 2009-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard witho
8、ut any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other languag
9、e made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denma
10、rk, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 140401:2009 EN 140401:2009 2 Foreword This European
11、Standard was prepared by the Technical Committee CENELEC TC 40XB, Resistors. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 140401 on 2009-03-01. This European Standard supersedes EN 140401:2002. Preceding documents on the subject covered by
12、this specification have been EN 140401:1996, CECC 40 401:1989. Compared to the superseded standard, the following changes have been implemented: modification of the title; introduction of a test on the resistance to electrostatic discharge (ESD) in 1.6 and Annex A; introduction of description and te
13、st methods for lead-free soldering in 1.8, 1.10.3 and Annex A; introduction of code letters for the temperature coefficient (TCR) as in EN 60062:2005; revision of ordering information in 1.9.4; adoption of the IECQ rules of procedure, IEC QC 001002-3; revision of the sample quantities and the sequen
14、ce of tests in Annex A; editorial revision. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2010-03-01 latest date by which the national standards conflicting with the EN have
15、 to be withdrawn (dow) 2012-03-01 This specification supports the building of a series of documents describing fixed low power film resistors as follows: EN 60115-1 Fixed resistors for use in electronic equipment Part 1: Generic specification (IEC 60115-1, mod.) EN 140400 Sectional specification: Fi
16、xed low power surface mount (SMD) resistors EN 140401-xxx Relevant detail specification(s) written on the basis of this blank detail specification _ BS EN 140401:2009 w w w . b z f x w . c o m 3 EN 140401:2009 Contents Introduction . 4 1 Characteristics and ratings . 5 1.1 Dimensions and ratings. 5
17、1.2 Derating curve . 6 1.3 Resistance range and tolerance on rated resistance . 7 1.3.1 Version A 7 1.3.2 Version E 7 1.4 Variation of resistance with temperature and temperature rise 8 1.5 Climatic categories 8 1.6 Limits for change of resistance at tests . 9 1.7 Non-linearity 9 1.8 Tests related t
18、o soldering 10 1.8.1 Severities for solderability testing . 10 1.8.2 Severities for testing resistance to soldering heat . 11 1.9 Marking, packaging and ordering designation 11 1.9.1 Marking of the component 12 1.9.2 Packaging . 12 1.9.3 Marking of the packaging . 12 1.9.4 Ordering information. 12 1
19、.10 Additional information (not for inspection purpose) 13 1.10.1 Storage . 13 1.10.2 Mounting . 13 1.10.3 Soldering process . 13 1.10.4 Use of cleaning solvents 13 2 Quality assessment procedures . 13 2.1 General 13 2.1.1 Zero defect approach . 13 2.1.2 100 % Test . 14 2.1.3 0 Resistors 14 2.1.4 Ce
20、rtificate of Conformity (CoC) 14 2.1.5 Certified test records 14 2.1.6 Failure rate level . 15 2.2 Qualification approval 15 2.2.1 Version A 15 2.2.2 Version E 15 2.3 Quality conformance inspection 15 2.3.1 Qualification approval according to IEC QC 001002-3:2005, Clause 3 . 15 2.3.2 Technology appr
21、oval according to IEC QC 001002-3:2005, Clause 6 15 2.3.3 Non-conforming items 16 Annex A (normative) Fixed sample size Qualification Approval and Quality Conformance . Inspection test schedule for fixed low power film resistors 17 Annex B (informative) Letter symbols and abbreviations 27 Bibliograp
22、hy 29 BS EN 140401:2009 w w w . b z f x w . c o m EN 140401:2009 4 Introduction Blank detail specification A blank detail specification is a supplementary document to the sectional specification and contains requirements for style and layout and minimum content of detail specifications. Detail speci
23、fications not complying with these requirements shall not be considered as being in accordance with European standards nor shall they be so described. In the preparation of the detail specification the content of EN 140400:2003, 1.2 shall be taken into account. The detail specification should be wri
24、tten by using the preferred values given in EN 140400. The detail specification should contain a table of contents prior the first page of the actual specification. For the use of SI units refer to ISO 1000, for the use of letter symbols to be used in electrical technology, refer to EN 60027-1. Note
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