07-30172404-DC.pdf
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1、a Date: 5 December 2007 Origin: European Latest date for receipt of comments: 31 January 2008 Project no.: 2007/02675 Responsible committee: EPL/47 Semiconductors Interested committees: Title: Draft BS EN 62047-9 Semiconductor devices - Micro-electromechanical devices Part 9: Wafer to wafer bonding
2、strength measurement for MEMS Supersession information: If this document is published as a standard, the UK implementation of it will supersede NONE and partially supersede. NONE If you are aware of a current national standard which may be affected, please notify the secretary (contact details below
3、). WARNING: THIS IS A DRAFT AND MUST NOT BE REGARDED OR USED AS A BRITISH STANDARD. THIS DRAFT IS NOT CURRENT BEYOND 31 January 2008. This draft is issued to allow comments from interested parties; all comments will be given consideration prior to publication. No acknowledgement will normally be sen
4、t. See overleaf for information on commenting. No copying is allowed, in any form, without prior written permission from BSI except as permitted under the Copyright, Designs and Patent Act 1988 or for circulation within a nominating organization for briefing purposes. Electronic circulation is limit
5、ed to dissemination by e-mail within such an organization by committee members. Further copies of this draft may be purchased from BSI Customer Services, Tel: +44(0) 20 8996 9001 or email ordersbsi-. British, International and foreign standards are also available from BSI Customer Services. Informat
6、ion on the co-operating organizations represented on the committees referenced above may be obtained from the responsible committee secretary. Cross-references The British Standards which implement International or European publications referred to in this draft may be found via the British Standard
7、s Online Service on the BSI web site http:/www.bsi-. Direct tel: 020 8996 7009 Responsible Committee Secretary: Committee Service Centre (BSI) E-mail: cscbsi- Draft for Public Comment Head Office 389 Chiswick High Road London W4 4AL Telephone: +44(0)20 8996 9000 Fax: +44(0)20 8996 7001 Form 36 Versi
8、on 7.0 DPC: 07/30172404 DC Licensed Copy: London South Bank University, London South Bank University, Thu Dec 20 02:51:11 GMT+00:00 2007, Uncontrolled Copy, (c) BSI b Introduction This draft standard is based on European discussions in which the UK took an active part. Your comments on this draft ar
9、e welcome and will assist in the preparation of the consequent British Standard. If no comments are received to the contrary, then the UK will approve this draft and implement it as a British Standard. Comment is particularly welcome on national legislative or similar deviations that may be necessar
10、y. Even if this draft standard is not approved by the UK, if it receives the necessary support in Europe, the UK will be obliged to publish the official English Language text unchanged as a British Standard and to withdraw any conflicting standard. UK Vote Please indicate whether you consider the UK
11、 should submit a negative (with reasons) or positive vote on this draft. Submission The guidance given below is intended to ensure that all comments receive efficient and appropriate attention by the responsible BSI committee. Annotated drafts are not acceptable and will be rejected. All comments mu
12、st be submitted, preferably electronically, to the Responsible Committee Secretary at the address given on the front cover. Comments should be compatible with Version 6.0 or Version 97 of Microsoft Word for Windows, if possible; otherwise comments in ASCII text format are acceptable. Any comments no
13、t submitted electronically should still adhere to these format requirements. All comments submitted should be presented as given in the example below. Further information on submitting comments and how to obtain a blank electronic version of a comment form are available from the BSI web site at: htt
14、p:/www.bsi- Template for comments and secretariat observations Date: xx/xx/200x Document: ISO/DIS xxxxx 1 2 (3) 4 5 (6) (7) MB Clause No./ Subclause No./ Annex (e.g. 3.1) Paragraph/ Figure/Table/ Note (e.g. Table 1) Type of com- ment Comment (justification for change) by the MB Proposed change by th
15、e MB Secretariat observations on each comment submitted 3.1 Definition 1 ed Definition is ambiguous and needs clarifying. Amend to read . so that the mains connector to which no connection . 6.4 Paragraph 2 te The use of the UV photometer as an alternative cannot be supported as serious problems hav
16、e been encountered in its use in the UK. Delete reference to UV photometer. Microsoft and MS-DOS are registered trademarks, and Windows is a trademark of Microsoft Corporation. Licensed Copy: London South Bank University, London South Bank University, Thu Dec 20 02:51:11 GMT+00:00 2007, Uncontrolled
17、 Copy, (c) BSI 47/1947/CD COMMITTEE DRAFT (CD) IEC/TC or SC: 47 Project number IEC 62047-9, Ed. 1 Title of TC/SC: Semiconductor devices Date of circulation 2007-11-30 Closing date for comments 2008-02-29 Also of interest to the following committees Supersedes document 47/1907/NP 47/1932A/RVN Functio
18、ns concerned: Safety EMC Environment Quality assurance Secretary: Cheoulung Cha, Korea E-mail cuchaketi.re.kr THIS DOCUMENT IS STILL UNDER STUDY AND SUBJECT TO CHANGE. IT SHOULD NOT BE USED FOR REFERENCE PURPOSES. RECIPIENTS OF THIS DOCUMENT ARE INVITED TO SUBMIT, WITH THEIR COMMENTS, NOTIFICATION O
19、F ANY RELEVANT PATENT RIGHTS OF WHICH THEY ARE AWARE AND TO PROVIDE SUPPORTING DOCUMENTATION. Title: IEC 62047-9, Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Titre) : Introductory note Recipients of this draft are inv
20、ited to submit, with their comments, notification of any relevant patent rights of which they are aware and to provide supporting documentation FORM CD (IEC) 2002-08-08 Copyright 2007 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this electronic fil
21、e, to make a copy and to print out the content for the sole purpose of preparing National Committee positions. You may not copy or “mirror“ the file or printed version of the document, or any part of it, for any other purpose without permission in writing from IEC. Licensed Copy: London South Bank U
22、niversity, London South Bank University, Thu Dec 20 02:51:11 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 62047-9, Ed. 1 IEC:200X 2 47/1947/CD CONTENTS 1 Scope Error! Bookmark not defined. 2 Normative references .3 3 Terms, definitions and symbols.3 3.1 General terms3 3.2 Symbols 5 4 Measurement metho
23、ds .5 4.1 General 5 4.2 Visual test .5 4.3 Pull test (or tensile test).5 4.4 Blade test.6 4.5 Electrostatic test .7 4.6 Blister test .9 Licensed Copy: London South Bank University, London South Bank University, Thu Dec 20 02:51:11 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 62047-9, Ed. 1 IEC:200X 3
24、47/1947/CD Wafer to wafer bonding strength measurement for MEMS 1 Scope This standard describes terms, definition, symbols and bonding strength measurement method of wafer to wafer bonding during MEMS processing/assembly. 2 Normative references The following normative documents contain provisions wh
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