08-30190026-DC.pdf
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1、a Date: 1 December 2008 Origin: International Latest date for receipt of comments: 6 February 2009 Project no.: 2008/03003 Responsible committee: EPL/47 Semiconductors Interested committees: Title: Draft BS EN 60191-6-20 PNW 47D-721 Ed.1 (Future IEC 60191-6-20): General rules for the preparation of
2、outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) Supersession information: If this document is published as a standard, the UK implementation of it will supersede NONE and partially supersede. NONE If
3、you are aware of a current national standard which may be affected, please notify the secretary (contact details below). WARNING: THIS IS A DRAFT AND MUST NOT BE REGARDED OR USED AS A BRITISH STANDARD. THIS DRAFT IS NOT CURRENT BEYOND 6 February 2009. This draft is issued to allow comments from inte
4、rested parties; all comments will be given consideration prior to publication. No acknowledgement will normally be sent. See overleaf for information on commenting. No copying is allowed, in any form, without prior written permission from BSI except as permitted under the Copyright, Designs and Pate
5、nt Act 1988 or for circulation within a nominating organization for briefing purposes. Electronic circulation is limited to dissemination by e-mail within such an organization by committee members. Further copies of this draft may be purchased from BSI Customer Services, Tel: +44(0) 20 8996 9001 or
6、email . British, International and foreign standards are also available from BSI Customer Services. Information on the co-operating organizations represented on the committees referenced above may be obtained from the responsible committee secretary. Cross-references The British Standards which impl
7、ement International or European publications referred to in this draft may be found via the British Standards Online Service on the BSI web site http:/. Direct tel: 020 8996 7009 Responsible Committee Secretary: Committee Service Centre (BSI) E-mail: Draft for Public Comment Head Office 389 Chiswic
8、k High Road London W4 4AL Telephone: +44(0)20 8996 9000 Fax: +44(0)20 8996 7001 Form 36 Version 8.0 DPC: 08/30190026 DC Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI b Introduction This draft standard is based on international discus
9、sions in which the UK has taken an active part. Your comments on this draft are welcome and will assist in the preparation of the consequent standard. There is a high probability that this text could be adopted by CENELEC as a reference document for harmonization or as a European Standard. Recipient
10、s of this draft are requested to comment on the text bearing in mind this possibility. UK Vote Please indicate whether you consider the UK should submit a negative (with reasons) or positive vote on this draft. Submission The guidance given below is intended to ensure that all comments receive effic
11、ient and appropriate attention by the responsible BSI committee. Annotated drafts are not acceptable and will be rejected. All comments must be submitted, preferably electronically, to the Responsible Committee Secretary at the address given on the front cover. Comments should be compatible with Ver
12、sion 6.0 or Version 97 of Microsoft Word for Windows, if possible; otherwise comments in ASCII text format are acceptable. Any comments not submitted electronically should still adhere to these format requirements. All comments submitted should be presented as given in the example below. Further inf
13、ormation on submitting comments and how to obtain a blank electronic version of a comment form are available from the BSI web site at: http:/ Template for comments and secretariat observations Date: xx/xx/200x Document: ISO/DIS xxxxx 1 2 (3) 4 5 (6) (7) MB Clause No./ Subclause No./ Annex (e.g. 3.1)
14、 Paragraph/ Figure/Table/ Note (e.g. Table 1) Type of com- ment Comment (justification for change) by the MB Proposed change by the MB Secretariat observations on each comment submitted 3.1 Definition 1 ed Definition is ambiguous and needs clarifying. Amend to read . so that the mains connector to w
15、hich no connection . 6.4 Paragraph 2 te The use of the UV photometer as an alternative cannot be supported as serious problems have been encountered in its use in the UK. Delete reference to UV photometer. Microsoft and MS-DOS are registered trademarks, and Windows is a trademark of Microsoft Corpor
16、ation. Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI FORM CD (IEC) 2008-08-01 47D/732/CD COMMITTEE DRAFT (CD) IEC/TC or SC: SC 47D Project number IEC 60191-6-20 Ed.1.0 2/07037 Title of TC/SC: Mechanical Standardization of Semiconduct
17、or Devices Date of circulation 2008-11-28 Closing date for comments 2009-03-06 Also of interest to the following committees Supersedes document 47D/721/NP - 47D/727A/RVN Proposed horizontal standard Other TC/SCs are requested to indicate their interest, if any, in this CD to the TC/SC secretary Func
18、tions concerned: Safety EMC Environment Quality assurance Secretary: Hiroyoshi Yoshida THIS DOCUMENT IS STILL UNDER STUDY AND SUBJECT TO CHANGE. IT SHOULD NOT BE USED FOR REFERENCE PURPOSES. RECIPIENTS OF THIS DOCUMENT ARE INVITED TO SUBMIT, WITH THEIR COMMENTS, NOTIFICATION OF ANY RELEVANT PATENT R
19、IGHTS OF WHICH THEY ARE AWARE AND TO PROVIDE SUPPORTING DOCUMENTATION. Title: IEC 60191-6-20 Ed.1.0: Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package
20、 dimensions of small outline J-lead packages (SOJ) (Titre) : Introductory note Copyright 2008 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this electronic file, to make a copy and to print out the content for the sole purpose of preparing National
21、Committee positions. You may not copy or “mirror“ the file or printed version of the document, or any part of it, for any other purpose without permission in writing from IEC. Licensed Copy: London South Bank University, South Bank University, 31/01/2009 04:08, Uncontrolled Copy, (c) BSI 60191-6-20,
22、 Ed. 1 IEC:200X 2 47D/732/CD INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of small outline J-l
23、ead packages (SOJ) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning sta
24、ndardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their prepara
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