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1、BRITISH STANDARD BS CECC 23100-801:1998 Harmonized system of quality assessment for electronic components Capability detail specification: Single and double-sided printed boards with plain holes ICS 31.180 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:19
2、 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23100-801:1998 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 June 1998 BSI 06-1999 ISBN 0 580 29893 0 Natio
3、nal foreword This British Standard is the English language version of CECC 23100-801:1998 published by the European Electronic Components Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). It supersedes BS EN 123100-800:1992 which is withdrawn. This standard s
4、hould be read in conjunction with the most recent editions of BS EN 123000 and BS EN 123100. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to: aid enquirers to understand the text; present to the res
5、ponsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained on
6、request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility
7、of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations
8、. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the CECC title page, pages 2 to 23 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the ins
9、ide front cover. Amendments issued since publication Amd. No.DateComments Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:19 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23100-801:1998 BSI 06-1999i Contents Page National forewordInside front cover Fo
10、reword2 Text of CECC 23 100-8013 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:19 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ii blank Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:19 GMT+00:00 2006, Uncontrol
11、led Copy, (c) BSI EUROPEAN STANDARD NORM EUROPENNE EUROPISCHE NORM CECC 23 100-801 February 1998 Supersedes EN 123100-800:1992 English version Capability Detail Specification: Single and double-sided printed boards with plain holes Spcification particulire dAgrment: Cartes imprimes simple ou double
12、face trous non mtalliss Bauartspezifikation zur Anerkennung der Befhigung: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten ohne metallisierte Lcher This Capability Detail Specification was approved on 1997-08-06. Up-to-date lists and bibliographical references of other detail specif
13、ications relating to EN 123000:1991 and EN 123100:1992 may be obtained on application to the Central Secretariat or to any CENELEC member. This CECC Detail Specification exists in three official versions (English, French, German). A version in any other language made by translation under the respons
14、ibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy
15、, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050
16、 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. CECC 23 100-801:1998 E Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:19 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23 100
17、-801:1998 BSI 06-1999 2 Foreword This Capability Detail Specification has been prepared by CENELEC/TC CECC/SC 52, Printed Boards (formerly designated CECC Working Group 23). It was approved as CECC 23 100-801 on 1997-08-06. This Capability Detail Specification replaces EN 123100-800:1992. It should
18、be read in conjunction with EN 123000:1991 and EN 123100:1992 and with the current regulations for the CECC System. Contents Page Foreword2 1General3 1.1Scope3 1.2Object3 2Capability qualifying component3 2.1Materials3 2.2Surface finishes4 2.2.1Metallic finishes4 2.2.1.1Accelerated ageing4 2.2.2Orga
19、nic finishes4 2.3Variant designation5 3Capability approval5 3.1Range of capability approval5 3.2QPL information5 4Capability test programme5 4.1Capability demonstration5 4.1.1Other metallic surface finishes5 4.1.2Organic surface finishes6 4.1.3Demonstration of Impedance Control6 5Additional capabili
20、ty6 6Traceability6 Annex A Suitable test pattern for marking inks15 Annex B Suitable test pattern for solder masks16 Annex C Edge connector imperfections17 Annex D Determination of characteristic impedance by TDR17 Figure D.1 Possible equipment configuration (see D.4.2)21 Figure D.2 Schematic showin
21、g undisturbed interval (see D.4.3)21 Figure D.3 Schematic showing undisturbed interval; in situ method (see D.4.3)22 Figure D.4 Incident Wave Voltage showing (2 x) Air Line delay (see D.4.3)22 Figure D.5 Test specimen details (see D.4.2)23 Table I Capability approval test schedule7 Table IIa Additio
22、nal metallic conductor finishes10 Table IIb Additional contact finishes12 Table III Permanent organic finishes13 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:19 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23 100-801:1998 BSI 06-19993 1 General 1.1 S
23、cope This Capability Detail Specification (CapDS) is based upon EN 123100. It relates to rigid single and double-sided printed boards with plain holes, made with materials and surface finishes as specified in clause 2 . 1.2 Object To specify the Capability Qualifying Component (CQC), its characteris
24、tics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and extended capability. 2 Capability Qualifying Component (CQC) Test boards to be used as CQCs for basic capability shall: be made from one of the copper-clad base materials speci
25、fied in 2.1 of this CapDS, base material thickness of 1,6 mm 0,14 mm and 35 4m copper foil on both sides. bear the composite test pattern (CTP) specified in 8.2 of EN 123100 (or equivalent CTP). have one of the surface finishes specified by groups 11, 12, 13, 14, 15, 16, 17 or 18 in 2.2 of this CapD
26、S. Requirements for test boards to be used as modified CQCs for the demonstration of additional capability are detailed in clause 5 of this CapDS. 2.1 Materials Material group designation SpecificationBase MaterialBase Material thickness range Cu thickness TypeGrade(mm)(4m) EN 60249-2-1 Phenolic pap
27、erHigh Electrical EN 60249-2-2 Phenolic PaperEconomic EN 60249-2-6 Phenolic PaperDefined flammability (horizontal) 0,2 6,418, 35, 70, 105 A EN 60249-2-7 Phenolic PaperDefined flammability (vertical) EN 60249-2-3 Epoxide paperDefined flammability (vertical) EN 60249-2-4 Epoxide Woven Glass General pu
28、rpose B0,2 6,418, 35, 70, 105 EN 60249-2-5 Epoxide Woven Glass Defined flammability (vertical) Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:19 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23 100-801:1998 4 BSI 06-1999 2.2 Surface finishes 2.2.1 Metal
29、lic finishes The demonstration of metallic group finishes 21, 22, 23 or 24 shall be combined with a finish from groups 11, 12, 13, 14, 15, 16, 17 or 18. Each claimed combination of metallic finishes shall be tested separately. Selective and non-selective finishes of the same material, where claimed,
30、 must be demonstrated separately. 2.2.1.1 Accelerated ageing The ability of finish groups 11, 12, 13, 14, 15, 16, 17 or 18 to solder after extended or adverse storage conditions is demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is cla
31、imed. Each finish that has complied with the requirements of the ageing test is highlighted by the inclusion of an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the QPL. 2.2.2 Organic finishes (where claimed) The demonstration of organic finish grou
32、ps a, b, c or d shall be over a finish from groups 11, 12, 13, 14, 15, 16, 17 or 18. All claimed types of solder resist shall be tested separately. Finish group Designation Surface finishAbbreviation for QPL Remarks 11Bare copperCu 12Copper with solderable organic protective coatingCu(opc) 13Copper
33、with oxideCu(CuO) 14Tin, Tin-LeadSn, SnPb 15Tin-Lead (fused)SnPb(f) 16Tin-Lead (dipped and levelled)SnPb(dl) 17Tin-Lead (roller coated)SnPb(rt) 18Immersion Gold over Electroless NickelAuNi(smt) 19not assigned 20not assigned 21Specimen K 5 4m, gold plated on copper, remainder using finish group 1117
34、(see below) 5AuCu 22Specimen K 0,7 4m, gold plated on nickel, remainder using finish group 1117 (see below) 0,7AuNi 23Specimen K 2,5 4m, gold plated on copper, remainder using finish group 1117 (see below) 2,5AuCu 24Specimen K 2,5 4m, gold plated on nickel, remainder using finish group 1117 (see bel
35、ow) 2,5AuNi Finish group designation Organic finishAbbreviation for QPL aDry film solder maskDSM bWet resist solder maskWSM cLiquid photopolymer solder maskLSM dMarking inkMI eConductive inkCI Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:19 GMT+00:00 20
36、06, Uncontrolled Copy, (c) BSI CECC 23 100-801:1998 BSI 06-19995 2.3 Variant designation The combination of any material group designated in 2.1 and any of the surface finishes designated in 2.2 constitutes a variant. The variant is designated by the combination of both material and finish group des
37、ignations, e.g. A12(b) or A12/21(c). 3 Capability approval 3.1 Range of capability approval Capability approval granted on the testing of one variant is valid within the limits specified in 3.7 of EN 123000 for metal clad base material within one group designation, all base material thicknesses and
38、all foil thicknesses of the material in accordance with 2.1 of this CapDS; and all metallic surface finishes within one surface finish group as given in 2.2.1 of this CapDS, that is: 3.2 QPL information Information for the QPL (published as CECC 00 200) shall be given in accordance with 3.4 of EN 12
39、3000, and shall contain the following details relative to the CapDS: 4 Capability test programme NOTEIn all cases the number of failures permitted is zero. 4.1 Capability demonstration Capability shall be demonstrated using 9 CTPs of one variant from each material group claimed. Testing shall be in
40、accordance with Table I. 4.1.1 Other metallic surface finishes If claimed, other metallic surface finishes, as designated in 2.2.1 shall be demonstrated by the manufacture and testing of 3 CTPs plus sufficient extra A and H specimens to meet the requirements of Table II. The maximum active board siz
41、e for the finish shall be demonstrated. See also clause 5 . finish group 11covers finish group 11 only finish group 12covers finish group 11 and 12 finish group 13covers finish group 11 and 13 finish group 14covers finish group 11 and 14 finish group 15covers finish group 11 and 15 finish group 16co
42、vers finish group 11 and 16 finish group 17covers finish group 17 only finish group 18covers finish group 18 only finish group 21covers finish group 21 only finish group 22covers finish group 22 and 24 finish group 23covers finish group 21 and 23 finish group 24covers finish group 24 only reference
43、to the CECC Generic SpecificationEN 123000 reference to the CECC Sectional SpecificationEN 123100 reference to the CECC CapDSCECC 23 100-801 base material for which approval is grantedas given in 2.1 of this CapDS the surface finishes for which approval is grantedas given in 2.2 of this CapDS any ad
44、ditional capability3.5.3 of EN 123000 refers Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:19 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23 100-801:1998 6 BSI 06-1999 4.1.2 Organic surface finishes Each claimed organic surface finish, as designated
45、in 2.2.2, shall be demonstrated by the manufacture and testing of 3 CTPs using the pattern specified in Annex A (marking inks) or Annex B (solder masks). Testing shall be in accordance with Table III. 4.1.3 Demonstration of impedance control Special CQCs shall be constructed in accordance with Figur
46、e D.5, configured as either a “stripline” or “microstrip”. Demonstrations shall be made for the following variants, as required and defined by the approved manufacturer: Each base material type (e.g. woven glass epoxide); Each impedance extreme, and a 50 7 mandatory demonstration; Conductor width an
47、d lateral separation minima; Each metallic surface finish. Tolerances at 50 7 and each impedance extreme shall be claimed prior to demonstration, and achieved. For each solder resist type and thickness claimed, impedance value derating factors shall be declared. Impedance control shall be shown on t
48、he Capability Approval certificate as a separate annex. 5 Additional capability 6 Traceability Traceability of all specimens to the original product shall be maintained. The method used to identify individual test specimens shall not prejudice the test result. Maximum active board sizesee 8.3 of EN
49、123000 Minimum conductor width and spacing Specimen F of the CTP to be modified to provide additionally 5 conductors and 4 spacings, each of the claimed minimum. Initial foil thickness of less than 35 4m may be used for this demonstration, but the thickness used shall be declared. Metallic conductor finishesManufacturers are permitted to demonstrate conductor finishes other than those detailed in 2.2.1. The finish shall be demonstrated in accordance with Table IIa and detailed in the manufacturers Capability
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