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1、BRITISH STANDARD BS CECC 90114:1990 Incorporating Amendment No. 1 Specification for Harmonized system of quality assessment for electronic components Blank detail specification Programmable logic arrays (PLA) Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27
2、:41 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90114:1990 BSI 03-2000 ISBN 0 580 35845 3 Amendments issued since publication Amd. No.Date of issueComments 8166March 1994Indicated by a sideline in the margin Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09
3、 01:27:41 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90114:1990 BSI 03-2000i Contents Page National forewordii Forewordii General1 Scope1 Related documents1 Structure of Detail Specifications1 Units, symbols and terminology1 Application of Quality Assessment Procedures1 2Operating characteri
4、stics3 3Identification of the device types7 4Test and measurement procedures7 5Structural similarity of PLA9 6Qualification approval procedures9 7Capability approval procedures9 8Screening procedures9 9Inspection requirements9 Annex for programmingInside back cover Licensed Copy: London South Bank U
5、niversity, London South Bank University, Sat Dec 09 01:27:41 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90114:1990 ii BSI 03-2000 National foreword This British Standard has been prepared under the direction of the Electronic Components Standards Policy Committee. It is identical with CENELE
6、C Electronic Components Committee CECC 90114:1990 “Harmonized system of quality assessment for electronic components. Blank detail specification: Programmable logic arrays (PLA)”. This standard is a harmonized specification within the CECC System. Cross-references. The British Standard which impleme
7、nts CECC 00100 is BS 9000 General requirements for a system for electronic components of assessed quality Part 2:1983 Specification for national implementation of CECC basic rules and rules of procedure. The Technical Committee has reviewed the provisions of IEC 747, and IEC 748 to which reference i
8、s made in the text, and has decided that they are acceptable for use in conjunction with this standard. Scope. This standard lists the ratings, characteristics and inspection requirements which shall be included as mandatory requirements in accordance with BS CECC 90100 in any detail specification f
9、or these devices. Detail specification layout. The front page of detail specifications released to BS CECC family or blank detail specification will be in accordance with BS 9000 Circular Letter No. 15. A British Standard does not purport to include all the necessary provisions of a contract. Users
10、of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. International StandardsaCorresponding British Standards IEC 617-12:1983BS 3939 Guide for graphical symbols for electrical power, telecommu
11、nications and electronics diagrams Part 12:1985 Binary logic elements (Identical) IEC 68-2-30:1980BS 2011 Environmental testing Part 2.1 Db:1981 Test Db and guidance: Damp heat, cyclic (12 + 12 hour cycle) (Identical) CECC 90000:1985BS CECC 90000:1985 Harmonized system of quality assessment for elec
12、tronic components. Generic specification: Monolithic integrated circuits (Identical) CECC 90100:1986BS CECC 90100:1986 Harmonized system of quality assessment for electronic components: Sectional specification: Digital monolithic integrated circuits (Identical) a Undated in text. Summary of pages Th
13、is document comprises a front cover, an inside front cover, pages i and ii, the CECC title page, page ii , pages 1 to 12, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table
14、 on the inside front cover. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:41 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:41 GMT+00:00 2006, Uncontrolled Copy, (c)
15、BSI CECC 90114:1990 ii BSI 03-2000 Foreword The CENELEC Electronic Components Committee (CECC) is composed of those member countries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to take part in a harmonized System for electronic components of assessed quality. Th
16、e object of the System is to facilitate international trade by the harmonization of the specifications and quality assessment procedures for electronic components, and by the grant of an internationally recognized Mark, or Certificate, of Conformity. The components produced under the System are ther
17、eby acceptable in all member countries without further testing. This specification has been formally approved by the CECC, and has been prepared for those countries taking part in the System who wish to issue national harmonized specifications for PROGRAMMABLE LOGIC ARRAYS (PLA). It should be read i
18、n conjunction with the current regulations for the CECC System. At the date of printing of this specification the member countries of the CECC are Austria, Belgium, Denmark, Finland, France, Germany, Ireland, Italy, the Netherlands, Norway, Portugal, Spain, Sweden, Switzerland, and the United Kingdo
19、m, and copies of it can be obtained from the addresses shown on the blue fly-sheet. Preface This blank detail specification (BDS) was prepared by CECC WG 9 “Integrated circuits”. It is based, wherever possible, on the Publications of the International Electrotechnical Commission and in particular on
20、 IEC 747: Semiconductor devices Discrete devices and integrated circuits. The text of this BDS was circulated to the CECC for voting in the documents indicated below and was ratified by the President of the CECC for printing as a CECC specification. It is recognized that the layout proposed cannot b
21、e applied to all detail specifications based on this document. For instance, it may be preferable to indicate the limiting values in the form of a table when several similar devices appear in the same detail specification. In accordance with the decision of the CECC Management Committee this specifi
22、cation is published initially in English and French. The German text will follow as soon as it has been prepared. DocumentsDate of VotingReport on the Voting CECC(Secretariat)2343February 1989CECC(Secretariat)2446 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09
23、01:27:41 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 90114:1990 BSI 03-20001 General The following information is given for guidance. Scope This BDS relates to Programmable Logic Arrays (PLA) with irreversible programming in accordance with IEC 748: Semiconductor devices: Integrated Circuits. A
24、PLA is: an integrated circuit with two arrays of programmable combinatorial elements or an integrated circuit with one programmable array and one fixed array of predefined logic. However the Programmable Read Only memories are excluded from the scope. Related documents See 2.1 of CECC 90100 and 2.2
25、of CECC 90000 Structure of Detail Specifications Clause numbering of DS shall be in accordance with that of this document. Units, symbols and terminology See 2.3 of CECC 90100 and 2.3 of CECC 90000 Application of Quality Assessment Procedures See 3 of CECC 90100 and CECC 90000. Licensed Copy: London
26、 South Bank University, London South Bank University, Sat Dec 09 01:27:41 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 90114:1990 2 BSI 03-2000 Layout of front page of detail specification Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:41 GMT+00:00 200
27、6, Uncontrolled Copy, (c) BSI CECC 90114:1990 BSI 03-20003 The front page of the DS shall be laid out as shown on the page before. The numbers between square brackets correspond to the following indications which shall be given: Identification of the DS and of the component: Identification of the co
28、mponent and supplementary information: Description of the materials for the package (for example, glass, ceramic, metal, plastic) and information relating to the mounting (welding, soldering), lead material and finish. The package type, the terminal connections to the inputs, outputs or other import
29、ant points of the circuit shall be identified. This can be shown by a functional block diagram. Numbering and identification of the terminals. Marking on the device in accordance with the GS (see 2.5 of CECC 90000). 2 Operating characteristics The following characteristics shall apply over the full
30、operating temperature range and the supply voltage range unless otherwise specified. 2.1 General description The following characteristics shall be given if they are not adequately defined in clause 1: “Type description” in front page. Technology of programmable matrix(ces). Possible particular oper
31、ating modes. 1 The name of the National Standards Organization under whose authority the DS is published and, if applicable, the organization from whom the DS is available. 2 The CECC Symbol and the CECC number allotted to the DS by the CECC General Secretariat. 3 The number and issue number of the
32、CECC generic or sectional specification as relevant; also national reference if different. 4 If different from the CECC number, the national number of the DS, date of issue and any further information required by the national system, together with any amendment numbers. 5 Type number, a short descri
33、ption of the type by: function performance, for example variants based on speed, temperature, power etc. 6 Information on typical construction material and type of construction (silicon, monolithic, bipolar, MOS) For 5 and 6 the text to be given in the DS should be suitable for an entry in CECC 0020
34、0 (QPL) and CECC 00300 (Library List). 7 An outline drawing with main dimensions which are of importance for interchangeability, and/or reference to the appropriate national or international document for outlines. Alternatively, this drawing may be given in an annex to the DS. 8 Quality assessment l
35、evel(s) 9 Reference data giving information on the most important properties of the component, which allow comparison between the various component types intended for the same, or for similar, applications. The DS shall give a brief description including the following: Structure (number of inputs an
36、d outputs) The type of output circuit (for example three state) Essential functions Type of logic Size of array The PLA which are described in this BDS are not re-programmable. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:41 GMT+00:00 2006, Uncontrolled
37、 Copy, (c) BSI CECC 90114:1990 4 BSI 03-2000 Electrical compatibility (if appropriate): it shall be stated whether the integrated circuit is electrically compatible with other particular integrated circuits or families of integrated circuits, or whether special interfaces are required. Block diagram
38、: the block diagram shall be sufficiently detailed to enable the individual functional units within the device to be identified with their main input and output paths and the identification of their external connections (chip enable, address decode .). The function(s) performed by each terminal. A g
39、raphical symbol in accordance with IEC 617-12 shall be given. Basic programming methods shall be given. 2.2 Detailed Specification of the function 2.2.1 Function description The logic diagram shall be given. This clause defines the following characteristics matrix size; inputs and outputs; internal
40、logic; combinatorial elements (if applicable); sequential elements (if applicable); feed-back (if applicable); chip select (if applicable); output enable (if applicable); 2.2.2 Programming Detailed programming methods and conditions shall be described in an Annex of the DS. The parameters may be sho
41、wn as organigrams or equations or programming sequences. The different signal configurations and logic levels needed for programming shall be described. Programming may be performed by the manufacturer at customers request. For this purpose the manufacturer shall supply all the necessary information
42、. 2.2.3 Functional Interchangeability Products which differ only in the conditions of programming may be covered by the same DS. These conditions shall be described in the Annex of the DS. After programming to the same function, these products may be considered interchangeable. 2.3 Limiting conditio
43、ns of use (ratings) Limiting conditions (ratings) are not for inspection purposes. Values of limiting conditions of use shall be given as follows: Any cautionary statement unique to an individual integrated circuit shall be included, for example: any difference between the limiting conditions applic
44、able to the programming and read operations shall be given. Any interdependence of limiting conditions shall be specified. If externally connected elements have an influence on the values of the ratings, the ratings shall be given for the integrated circuit with the specified elements connected, for
45、 example heatsinks. If transient overloads are permitted, their magnitude and durations shall be specified. Where minimum and maximum values differ during programming this shall be stated. The values for the limiting conditions of use, given in the following Table are not related to programming cond
46、itions (for informations on programming see Annex to this BDS). Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:41 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 90114:1990 BSI 03-20005 All voltages are referenced to a reference terminal (GND, etc.), whic
47、h shall be stated. 2.4 Recommended conditions of use and associated characteristics (In accordance with 5.3.8 of CECC 90100) Not for inspection purpose. The values shall apply over the full operating temperature range, unless otherwise specified. Where the stated performance of the circuit varies ov
48、er the operating temperature range, the values of the input and output voltages and their associated currents shall be stated at 25 C and at the extremes of the operating temperature range. Values of current and voltage shall be given for each functionally different type of input and/or output. Spec
49、ial characteristics and timing requirements shall be specified. 2.4.1 Recommended conditions of use All voltages are referenced to a reference terminal (GND, etc.), which shall be stated. 2.4.2 Associated characteristics (if applicable) CharacteristicsSymbolmin.max.Unit Supply voltage rangeVCCV Input voltagesVIV Output voltagesVOV Off-state voltage (Note 1) VOZV Output currents (Note 1) IOmA Input currents (Note 1) IImA Max. power dissipation (Note 1) PD max.n.a.W Operating temperatureTa
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