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1、BRITISH STANDARD BS CECC 23800-801:1998 Harmonized system of quality assessment for electronic components Capability detail specification: Flexible multilayer printed boards with through connections ICS 31.180 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:2
2、3:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23800-801:1998 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 June 1998 BSI 05-1999 ISBN 0 580 29889 2 N
3、ational foreword This British Standard is the English language version of CECC 23800-801:1998 published by the European Electronic Components Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). This standard should be read in conjunction with the most recent ed
4、itions of BS EN 123000 and BS EN 123800. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquir
5、ies on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The Briti
6、sh Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British
7、 Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front c
8、over, an inside front cover, pages i and ii, the CECC title page, pages 2 to 18 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication
9、 Amd. No.DateComments Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23800-801:1998 BSI 05-1999i Contents Page National forewordInside front cover Foreword2 Text of CECC 23800-8013 Licensed Copy: Londo
10、n South Bank University, London South Bank University, Sat Dec 09 01:23:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ii blank Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI DETAIL SPECIFICATION SPCIFICATION P
11、ARTICULIRE BAUARTSPEZIFIKATION CECC 23800-801 February 1998 English version Capability Detail Specification: Flexible multilayer printed boards with through connections Spcification particulire dAgrment: Cartes imprimes multicouches souples avec connexions transversales Bauartspezifikation zur Anerk
12、ennung der Befhigung: Flexible Mehrlagen-Leiterplatten mit Durchverbindungen This Capability Detail Specification was approved on 1997-08-06. Up-to-date lists and bibliographical references of other detail specifications relating to EN 123000:1991 and EN 123800:1996 may be obtained on application to
13、 the Central Secretariat or to any CENELEC member. This CECC Detail Specification exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretaria
14、t has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingd
15、om. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved
16、worldwide for CENELEC members. Ref. No. CECC 23 800-801:1998 E Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23800-801:1998 BSI 05-1999 2 Foreword This Capability Detail Specification has been prepared b
17、y CENELEC/TC CECC/SC 52, Printed Boards (formerly designated CECC Working Group 23). It was approved as CECC 23 800-801 on 1997-08-06. It should be read in conjunction with EN 123000:1991 and EN 123800:1996 and with the current regulations for the CECC System. Contents Page Foreword2 1General3 1.1Sc
18、ope3 1.2Object3 2Capability Qualifying Component3 2.1Materials3 2.2Surface finishes4 2.2.1Metallic finishes4 2.2.1.1Accelerated ageing4 2.2.2Organic finishes4 2.3Variant designation5 3Capability approval5 3.1Range of capability approval5 3.2QPL information5 4Capability test programme5 4.1Capability
19、demonstration5 4.1.1Other metallic surface finishes5 4.1.2Organic surface finishes5 5Additional capability6 6Traceability6 Annex A Edge connector imperfections17 Annex B Circumferential defects in plated-through holes18 Table I Capability approval test schedule6 Table IIa Additional metallic conduct
20、or finishes11 Table IIb Additional contact finishes14 Table III Permanent organic finishes15 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23800-801:1998 BSI 05-19993 1 General 1.1 Scope This Capability
21、Detail Specification (CapDS) is based upon EN 123800. It relates to flexible multilayer printed boards with through connections, made with materials and surface finishes as specified in clause 2. 1.2 Object To specify the Capability Qualifying Component (CQC), its characteristics to be tested, the t
22、est methods and conditions to be applied and the requirements to be fulfilled for testing basic and extended capability. 2 Capability Qualifying Component (CQC) Test boards to be used as CQCs for basic capability shall be made from a combination of the materials specified in 2.1 of this CapDS. The c
23、onstruction shall be as given in 8.3 of EN 123800. bear the composite test pattern (CTP) specified in 8.3 of EN 123800 (or equivalent CTP), for basic and other metallic finishes. CTPs as specified in 8.2 of EN 123200 (or equivalent CTP) shall be used to demonstrate organic surface finishes and exter
24、nally bonded heat sinks. have one of the surface finishes specified by groups 11, 12, 13, 14, 15, 16, or 17 in 2.2 of this CapDS. be fabricated using a copper thickness determined by the needs of the process and parameters to be demonstrated (e.g. conductor width and separation). The CQC copper thic
25、kness shall be detailed in the capability manual. Requirements for test boards to be used as modified CQCs for the demonstration of additional capability are detailed in clause 5 of this CapDS. 2.1 Materials Material group designation SpecificationBase MaterialBase material thickness range TypeGrade
26、 EN 60249-2-13Polyimide filmGeneral purpose12,5 125 4m AEN 60249-3-15Polyimide filmDefined flammability 12,5 125 4m Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23800-801:1998 4 BSI 05-1999 2.2 Surface
27、finishes 2.2.1 Metallic finishes The demonstration of metallic group finishes 21, 22, 23 or 24 shall be combined with a finish from groups 11, 12, 13, 14, 15, 16 or 17. Each claimed combination of metallic finishes shall be tested separately. Selective and non-selective finishes of the same material
28、, where claimed, shall be demonstrated separately. 2.2.1.1 Accelerated ageing The ability of finish groups 11, 12, 13, 14, 15, 16 or 17 to solder after extended or adverse storage conditions is demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated
29、ageing is claimed. Each finish that has complied with the requirements of the ageing test is highlighted by the inclusion of an asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the QPL. 2.2.2 Organic finishes The demonstration of organic finish groups
30、a, b, c or d shall be over a finish from groups 11, 12, 13, 14, 15, 16 or 17. All claimed types of solder resist shall be tested separately. Finish group Designation Surface finishAbbreviation for QPL Remarks 11Bare copperCu 12Copper with solderable organic protective coating Cu(opc) 13Copper with o
31、xideCu(CuO) 14Tin, Tin-LeadSn, SnPb 15Tin-Lead (fused)SnPb(f) 16Tin-Lead (dipped and levelled)SnPb(dI)selective and non-selective applications to be demonstrated separately where claimed 17Immersion Gold over Electroless NickelAuNi(smt) 18not assigned 19not assigned 20not assigned 21Specimen K 5 4m,
32、 gold plated on copper, remainder using finish group 11-17 (see below) 5AuCu 22Specimen K 0,7 4m, gold plated on nickel, remainder using finish group 11-17 (see below) 0,7AuNi 23Specimen K 2,5 4m, gold plated on copper, remainder using finish group 11-17 (see below) 2,5AuCu 24Specimen K 2,5 4m, gold
33、 plated on nickel, remainder using finish group 11-17 (see below) 2,5AuNi Finish group designation Organic finishAbbreviation for QPL aAdhesive coated film coverlayerAFC bDry film solder maskDSM cWet resist Solder maskWSM dLiquid photopolymer solder maskLSM eMarking inkMI fConductive inkCI Licensed
34、Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23800-801:1998 BSI 05-19995 2.3 Variant designation The combination of any material group designated in 2.1 and any of the surface finishes designated in 2.2 constitu
35、tes a variant. The variant is designated by the combination of both material and finish group designations, e.g. A12(b) or A12/21(c). 3 Capability approval 3.1 Range of capability approval Capability approval granted on the testing of one variant is valid within the limits specified in 3.7 of EN 123
36、000 for metal clad base material within one group designation, all base material thicknesses and all foil thicknesses of the material in accordance with 2.1 of this CapDS; and all metallic surface finishes within one surface finish group as given in 2.2.1 of this CapDS, that is 3.2 QPL information I
37、nformation for the QPL (published as CECC 00 200) shall be given in accordance with 3.4 of EN 123000, and shall contain the following details relative to the CapDS: 4 Capability test programme NOTEIn all cases the number of failures permitted is zero. 4.1 Capability demonstration Capability shall be
38、 demonstrated using 9 CTPs of one variant from each material group claimed. Testing shall be in accordance with Table I. 4.1.1 Other metallic surface finishes If claimed, other metallic surface finishes, as designated in 2.2.1 shall be demonstrated by the manufacture and testing of 3 CTPs plus suffi
39、cient extra A and H specimens to meet the requirements of Table II. The maximum active board size for the finish shall be demonstrated. See also clause 5. 4.1.2 Organic surface finishes Each claimed organic surface finish, as designated in 2.2.2, shall be demonstrated by the manufacture and testing
40、of 3CTPs using the pattern specified in Annex A (marking inks) or Annex B (solder masks) of CECC 23 200-801. Testing shall be in accordance with Table III of this CapDS. finish group 11 finish group 12 finish group 13 finish group 14 finish group 15 finish group 16 finish group 17 finish group 21 fi
41、nish group 22 finish group 23 finish group 24 covers finish group 11 only covers finish group 11 and 12 covers finish group 11 and 13 covers finish group 11 and 14 covers finish group 11 and 15 covers finish group 11 and 16 covers finish group 17 only covers finish group 21 only covers finish group
42、22 and 24 covers finish group 21 and 23 covers finish group 24 only reference to the CECC Generic Specification reference to the CECC Sectional Specification reference to the CECC CapDS base material for which approval is granted the surface finishes for which approval is granted any additional capa
43、bility EN 123000 EN 123800 CECC 23 800-801 as given in 2.1 of this CapDS as given in 2.2 of this CapDS 3.5.3 of EN 123000 refers Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23800-801:1998 6 BSI 05-1999
44、 5 Additional capability 6 Traceability Traceability of all specimens to the original product shall be maintained. The method used to identify individual test specimens shall not prejudice the test result. Table I Capability approval test schedule Maximum active board sizesee 8.3 of EN 123000 Minimu
45、m conductor width and spacing Specimen F of the CTP to be modified to provide additionally 5 conductors and 4 spacings, each of the claimed minimum. Initial foil thickness of less than 35 4m may be used for this demonstration, but the thickness used shall be declared. Metallic conductor finishesManu
46、facturers are permitted to demonstrate conductor finishes other than those detailed in 2.2.1. The finish shall be demonstrated in accordance with Table IIa and detailed in the manufacturers Capability Manual. CharacteristicsTest No. IEC 60326-2 Specimen of Composite Test Pattern RequirementsRemarks
47、General examination Visual examination Conformity and identification 1All CQCsPattern, marking, identification, material and finishes shall comply with this CapDS. There shall be no apparent defects. Any identification for traceability purposes shall be verified. Appearance and Workmanship 1aAll CQC
48、sThe boards shall appear to have been processed in a careful and workmanlike manner, in accordance with good current practice. The base materials, conductors, surface finishes shall be of uniform appearance and free from cracks, burns, pits, nodules and blisters. Metallic surface finishes shall be f
49、ree from scratches which penetrate to an underlying surface. Plated-through holesAll CQCsPlated-through holes shall be clean and free from inclusions of any sort that could affect component insertion and solderability, Total area of the voids shall not exceed 10 % of the total wall area. The largest dimension shall not exceed 25 % of the hole circumference in the horizontal plane, and 25 % of the thickness of the board in the vertical plane. Plated-through holes shall have no plating voids at the interface of the hole wall and the co
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