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1、BRITISH STANDARD BS CECC 23200-801: 1998 Harmonized system of quality assessment for electronic components Capability detail specification: Single and double-sided printed boards with plated through holes ICS 31.180 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 0
2、9 01:23:16 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23200-801:1998 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 June 1998 BSI 05-1999 ISBN 0 580 298
3、92 2 National foreword This British Standard is the English language version of CECC 23200-801:1998 published by the European Electronic Components Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). It supersedes BS EN 123200-800:1992 which is withdrawn. This
4、standard should be read in conjunction with the most recent editions of BS EN 123000 and BS EN 123200. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to: aid enquirers to understand the text; present
5、to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be ob
6、tained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find”
7、 facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal o
8、bligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the CECC title page, pages 2 to 27 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table
9、on the inside front cover. Amendments issued since publication Amd. No.DateComments Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:16 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23200-801:1998 BSI 05-1999i Contents Page National forewordInside fron
10、t cover Foreword2 Text of CECC 23 200-8013 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:16 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ii blank Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:16 GMT+00:00 2006,
11、 Uncontrolled Copy, (c) BSI DETAIL SPECIFICATION SPCIFICATION PARTICULIRE BAUARTSPEZIFIKATION CECC 23 200-801 February 1998 Supersedes EN 123200-800:1992 English version Capability detail specification: Single and double-sided printed boards with plated-through holes Spcification particulire dAgrmen
12、t: Cartes imprimes simple ou double face trous mtalliss Bauartspezifikation zur Anerkennung der Befhigung: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten mit metallisierten Lchern This CECC Detail Specification was approved on 1997-08-06. Up-to-date lists and bibliographical refere
13、nces of other detail specifications relating to EN 123000:1991 and EN 123200:1992 may be obtained on application to the Central Secretariat or to any CENELEC member. This CECC Detail Specification exists in three official versions (English, French, German). A version in any other language made by tr
14、anslation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Gree
15、ce, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat:
16、 rue de Stassart 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. CECC 23 200-801:1998 E Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:16 GMT+00:00 2006, Uncontrolle
17、d Copy, (c) BSI CECC 23 200-801:1998 BSI 05-1999 2 Foreword This Capability Detail Specification has been prepared by CENELEC/TC CECC/SC 52, Printed Boards (formerly designated CECC Working Group 23). It was approved as CECC 23 200-801 on 1997-08-06. This Capability Detail Specification replaces EN
18、123200-800:1992. It should be read in conjunction with EN 123000:1991 and EN 123200:1992 and with the current regulations for the CECC System. Contents Page Foreword2 1General 1.1Scope3 1.2Object3 2Capability qualifying component 2.1Materials3 2.2Surface finishes4 2.2.1Metallic finishes4 2.2.1.1Acce
19、lerated ageing4 2.2.2Organic finishes4 2.3Variant designation5 3Capability approval 3.1Range of capability approval5 3.2QPL information5 4 Capability test programme 4.1Capability demonstration5 4.1.1Other metallic surface finishes5 4.1.2Organic surface finishes5 4.1.3External bonded heatsinks6 4.1.4
20、Demonstration of impedance control6 5Additional capability 6Traceability Annex A Suitable test pattern for marking inks17 Annex B Suitable test pattern for solder masks18 Annex C Suitable test pattern for bonded heatsinks19 Annex D Edge connector imperfections20 Annex E CTP subdivision for thermal s
21、hock21 Annex F Circumferential defects in plated-through holes22 Page Annex G Determination of characteristic impedance by TDR22 Figure G.1 Possible equipment configuration 25 Figure G.2 Schematic showing undisturbed interval 26 Figure G.3 Schematic showing undisturbed interval; in situ method26 Fig
22、ure G.4 Incident Wave Voltage showing (2 x) Air Line delay27 Figure G.5 Test specimen details 27 Table I Capability approval test schedule7 Table IIa Additional metallic conductor finishes11 Table IIb Additional contact finishes14 Table III Permanent organic finishes15 Table IV Bonded heatsinks16 Li
23、censed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:16 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23 200-801:1998 BSI 05-19993 1 General 1.1 Scope This Capability Detail Specification (CapDS) is based upon EN 123200. It relates to rigid single and double-si
24、ded printed boards with plated-through holes, made with materials and surface finishes as specified in clause 2. 1.2 Object To specify the Capability Qualifying Component (CQC), its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for t
25、esting basic and extended capability. 2 Capability Qualifying Component (CQC) Test boards to be used as CQCs for basic capability shall: be made from one of the copper-clad base materials specified in 2.1 of this CapDS, base material thickness of 1,6 mm 0,14 mm and 35 4m copper foil on both sides. b
26、ear the composite test pattern (CTP) specified in 8.2 of EN 123200 (or equivalent CTP). have one of the surface finishes specified by groups 11, 12, 13, 14, 15, 16, 17 or 18 in 2.2 of this CapDS. Requirements for test boards to be used as modified CQCs for the demonstration of additional capability
27、are detailed in clause 5 of this CapDS. 2.1 Materials Material Group designation SpecificationBase MaterialBase material thickness range (mm) Cu thickness (4m) TypeGrade AEN 60249-2-1Phenolic paperHigh Electrical EN 60249-2-2Phenolic PaperEconomic EN 60249-2-6Phenolic PaperDefined flammability (hori
28、zontal) 0,2 6,418, 35, 70, 105 EN 60249-2-7Phenolic PaperDefined flammability (vertical) EN 60249-2-3Epoxide PaperDefined flammability (vertical) EN 60249-2-4Epoxide Woven Glass General purpose B0,2 6,418, 35, 70, 105 EN 60249-2-5Epoxide Woven Glass Defined flammability (vertical) Licensed Copy: Lon
29、don South Bank University, London South Bank University, Sat Dec 09 01:23:16 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23 200-801:1998 4 BSI 05-1999 2.2 Surface finishes 2.2.1 Metallic finishes The demonstration of metallic group finishes 21, 22, 23 or 24 shall be combined with a finish from g
30、roups 11, 12, 13, 14, 15, 16, 17 or 18. Each claimed combination of metallic finishes shall be tested separately. Selective and non-selective finishes of the same material, where claimed, must be demonstrated separately. 2.2.1.1 Accelerated ageing The ability of finish groups 11, 12, 13, 14, 15, 16,
31、 17 or 18 to solder after extended or adverse storage conditions is demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. Each finish that has complied with the requirements of the ageing test is highlighted by the inclusion of a
32、n asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the QPL. 2.2.2 Organic finishes (where claimed) The demonstration of organic finish groups a, b, c or d shall be over a finish from groups 11, 12, 13, 14, 15, 16, 17 or 18. All claimed types of solder
33、resist shall be tested separately. Finish group Designation Surface finishAbbreviation for QPL Remarks 11Bare copperCu 12Copper with solderable organic surface protectionCu(osp) 13Copper with oxideCu(CuO) 14Tin, Tin-LeadSn, SnPb 15Tin-Lead (fused)SnPb(f) 16Tin-Lead (dipped and levelled)SnPb(dl) 17Ti
34、n-Lead (roller coated)SnPb(rt) 18Immersion Gold over Electroless NickelAuNi(smt) 19not assigned 20not assigned 21Specimen K 5 4m, gold plated on copper, remainder using finish group 11-17 (see below) 5 AuCu 22Specimen K 0,7 4m, gold plated on nickel, remainder using finish group 11-17 (see below) 0,
35、7 AuNi 23Specimen K 2,5 4m, gold plated on copper, remainder using finish group 11-17 (see below) 2,5 AuCu 24Specimen K 2,5 4m, gold plated on nickel, remainder using finish group 11-17 (see below) 2,5 AuNi Finish group designationOrganic finishAbbreviation for QPL aDry film solder maskDSM bWet resi
36、st solder maskWSM cLiquid photopolymer solder maskLSM dMarking inkMI eConductive inkCI Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:16 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23 200-801:1998 BSI 05-19995 2.3 Variant designation The combination o
37、f any material group designated in 2.1 and any of the surface finishes designated in 2.2 constitutes a variant. The variant is designated by the combination of both material and finish group designations. e.g. A12(b) or A12/21(c). 3 Capability approval 3.1 Range of capability approval Capability app
38、roval granted on the testing of one variant is valid within the limits specified in 3.7 of EN 123000 for metal clad base material within one group designation, all base material thicknesses and all foil thicknesses of the material in accordance with 2.1 of this CapDS; and all metallic surface finish
39、es within one surface finish group as given in 2.2.1 of this CapDS, that is: 3.2 QPL information Information for the QPL (published as CECC 00 200) shall be given in accordance with clause 3.4 of EN 123 000, and shall contain the following details relative to the CapDS: 4 Capability test programme N
40、OTEIn all cases the number of failures permitted is zero. 4.1 Capability demonstration Capability shall be demonstrated using 9 CTPs of one variant from each material group claimed. Testing shall be in accordance with Table I. 4.1.1 Other metallic surface finishes If claimed, other metallic surface
41、finishes, as designated in 2.2.1 shall be demonstrated by the manufacture and testing of 3 CTPs plus sufficient extra A and H specimens to meet the requirements of Table II. The maximum active board size for the finish shall be demonstrated. See also clause 5. 4.1.2 Organic surface finishes Each cla
42、imed organic surface finish, as designated in 2.2.2, shall be demonstrated by the manufacture and testing of 3 CTPs using the pattern specified in Annex A (marking inks) or Annex B (solder masks). Testing shall be in accordance with Table III. finish group 11Covers finish group 11 only finish group
43、12Covers finish group 11 and 12 finish group 13covers finish group 11 and 13 finish group 14covers finish group 11 and 14 finish group 15covers finish group 11 and 15 finish group 16covers finish group 11 and 16 finish group 17covers finish group 17 only finish group 18covers finish group 18 only fi
44、nish group 21covers finish group 21 only finish group 22covers finish group 22 and 24 finish group 23covers finish group 21 and 23 finish group 24covers finish group 24 only reference to the CECC Generic SpecificationEN 123000 reference to the CECC Sectional SpecificationEN 123200 reference to the C
45、ECC CapDSCECC 23 200-801 base material for which approval is grantedas given in 2.1 of this CapDS the surface finishes for which approval is grantedas given in 2.2 of this CapDS any additional capability3.5.3 of EN 123000 refers Licensed Copy: London South Bank University, London South Bank Universi
46、ty, Sat Dec 09 01:23:16 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CECC 23 200-801:1998 6 BSI 05-1999 4.1.3 External bonded heatsinks Where claimed, each bonded heatsink and adhesive system shall be demonstrated by the manufacture of three CTPs using the pattern specified in Annex C. Testing shall b
47、e in accordance with Table IV of this CapDS. 4.1.4 Demonstration of impedance control Special CQCs shall be constructed in accordance with Figure G.5, configured as either a “stripline” or “microstrip”. Demonstrations shall be made for the following variants, as required and defined by the approved
48、manufacturer: each base material type (e.g. woven glass epoxide); each impedance extreme, and a 50 7 mandatory demonstration; conductor width and lateral separation minima; each metallic surface finish. Tolerances at 50 7 and each impedance extreme shall be claimed prior to demonstration, and achiev
49、ed. For each solder resist type and thickness claimed, impedance value derating factors shall be declared. Impedance control shall be shown on the Capability Approval certificate as a separate annex. 5 Additional capability Maximum active board size see 8.3 of EN 123000 6 Traceability Traceability of all specimens to the original product shall be maintained. The method used to identify individual test specimens shall not prejudice the test result. Plated through hole diametersSpecimen C (microsection coupo
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