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1、BRITISH STANDARD BS EN 165000-5:1998 Harmonized system of quality assessment for electronic components Film and hybrid integrated circuits Part 5: Procedure for qualification approval The European Standard EN 165000-5:1997 has the status of a British Standard ICS 31.200 Licensed Copy: sheffieldun sh
2、effieldun, na, Fri Nov 17 08:30:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 165000-5:1998 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 March 1998 BSI
3、04-1999 ISBN 0 580 28890 0 National foreword This British Standard is the English language version of EN 165000-5:1997 published by the European Electronic Components Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). The UK participation in its preparation wa
4、s entrusted by Technical Committee EPL/47, Semiconductor devices, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or
5、proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this subcommittee can be obtained on request to its secretary. Cross-references The British Standards which implemen
6、t international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport
7、to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover
8、, pages i and ii, the EN title page, pages 2 to 21 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No.DateComments License
9、d Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:30:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 165000-5:1998 BSI 04-1999i Contents Page National foreword Inside front cover Foreword 2 Text of EN 165000-53 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:30:25 GMT+00:00 2006, Unco
10、ntrolled Copy, (c) BSI ii blank Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:30:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 165000-5 December 1997 ICS 31.200 Descriptors: Hybrid integrated circuits, qualification approval English ve
11、rsion Film and hybrid integrated circuits Part 5: Procedure for qualification approval Integrierte Hybrid- und Schichtschaltungen Teil 5: Verfahren fr die Bauartanerkennung This European Standard was approved by CENELEC on 1997-10-01. CENELEC members are bound to comply with the CEN/CENELEC Internal
12、 Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC membe
13、r. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC
14、members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Stan
15、dardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1997 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 165000-5:1997
16、 E Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:30:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 165000-5:1997 2 BSI 04-1999 Foreword This European Standard was prepared by the Technical Committee CENELEC/TC CECC/SC 47AX, Film and hybrid integrated circuits. The text of the draft was
17、 submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 165000-5 on 1997-10-01. The following dates were fixed: This standard is intended to be read in conjunction with other parts of EN 165000 which are: Part 1: Generic specification Capability approval procedure; Part 2: In
18、ternal visual inspection and special tests; Part 4: Customer information, product assessment level schedules and blank detail specification. Part 4 is considered an essential document for all users; in particular it includes a helpful introductory section which is aimed at potential customers and se
19、eks to explain the underlying philosophy upon which the whole standard is based. Contents Page Foreword2 1Scope3 2Related documents3 3Qualification procedures3 3.1General3 3.2Marking3 3.3Validity of release for delivery3 3.4Application for Qualification Approval3 3.5Structural similarity3 3.6Materia
20、ls, piece-parts and added components3 3.7Initial Qualification Approval3 3.8Granting of Qualification Approval4 3.9Maintenance of Qualification Approval4 3.10 Procedure in the event of a failure in a periodic test4 3.11 Withdrawal of Qualification Approval4 4Qualification Product Assessment Level Sc
21、hedules 4 Q Product assessment level schedules 1 115-19 5Blank detail specification19 Table 1 920 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement(dop) 1998-09-01 latest date by which the national standards conflic
22、ting with the EN have to be withdrawn(dow) 1998-09-01 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:30:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 165000-5:1997 BSI 04-19993 1 Scope This specification applies to film and hybrid integrated circuits manufactured as catalogue products
23、or as custom built products using thick/thin film techniques and whose quality is assessed on the basis of Qualification Approval. Test methods are selected from EN 165000-1. A Blank Detail Specification (BDS) is included to assist manufacturers and users in the preparation of detail specifications.
24、 Related documents, preferred ratings and characteristics, and terminology are given in EN 165000-1. 2 Related documents Normative references are listed in EN 165000-1, to which should be added: 3 Qualification approval procedures 3.1 General The procedures in RP14 part II shall apply. 2.1 of EN 165
25、000-1 applies with the exceptions given in 3.2 to 3.11. 3.2 Marking 1.5 of EN 165000-1 applies. 3.3 Validity of release for delivery Circuits may be released under Qualification Approval subject to the following conditions: a) the circuits conform with the requirements of the detail specification. b
26、) the circuits, their added components, piece parts and materials are traceable to original manufacturers lot numbers. 3.4 Application for Qualification Approval Application shall be made to the ONH in accordance with 1.3 of RP14 part II. In addition, the manufacturer shall: a) conform with the elig
27、ibility requirements of 2.1.1 of EN 165000-1. b) conform with the relevant detail specification based on the Blank Detail Specification (see clause 5) and the Qualification Product Assessment Level Schedules (Q-PALS) (see clause 4) contained in this document. 3.5 Structural similarity For the purpos
28、es of assessment testing, structural similarity can be used if the testing of one representative type of circuit gives at least the same quality level for the rest of the types which are grouped together. The CECC System Manager shall declare to the satisfaction of the ONS the method of operating th
29、e structural similarity plan within the manufacturing facilities and agree the representative type(s) from each structurally similar group. For the Qualification Approval procedure two or more circuits can be considered structurally similar, and thus the required numbers of specimens for a test shal
30、l be selected from the combined production, when they have the same function type, use the same design rules, materials, processes and methods (for example a range of T-cell thick film attenuators using the same line of inks; or thin film D/A convertors using the same film material and same added co
31、mponents from the same supplier). Only those tests not specifically excluded in the Q-PALS may be considered for structural similarity. 3.6 Materials, piece-parts and added components 2.1.4 of EN 165000-1 applies. 3.7 Initial Qualification Approval The schedules to be used for Qualification Approval
32、 testing on the basis of lot-by-lot and periodic testing are given in the Q-PALS tables contained in this document. The procedure for initial Qualification Approval is given below. CECC 00 114 part II (RP 14 part II) qualification approval of electronic components Licensed Copy: sheffieldun sheffiel
33、dun, na, Fri Nov 17 08:30:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 165000-5:1997 4 BSI 04-1999 The relevant Q-PALS for initial Qualification Approval, release of products (lot-by-lot tests) and maintenance of Qualification Approval (periodic tests) collectively prescribe the minimum test pro
34、gramme on completed circuits. 1) Sampling The sample shall be representative of the range of circuits for which approval is sought. (See 2.2.4 3) of EN 165000-1). The size of the sample and the criterion of acceptability depend on the relevant Q-PALS which it is intended to release against. 2) Tests
35、 The complete series of tests specified in the relevant Q-PALS contained in this document is required for the approval of circuits covered by one detail specification. The tests shall be carried out in the order given. Test and measurement procedures are given in clause 3 of EN 165000-1. Samples use
36、d for group B, C b) there has been no break exceeding two years in the manufacturers declared periodic test schedule. 3.9.2 Changes to Qualification Approval The manufacturer is required to notify the ONS of changes to his Qualification Approval in accordance with 1.9 of RP14 part II and 2.3.2 a) to
37、 h) of EN 165000-1, where applicable. NOTEAll re-verification programmes are to be agreed with the ONS. 3.10 Procedure in the event of a failure in a periodic test The procedure described in 1.8 of RP14 part II shall apply. 3.11 Withdrawal of Qualification Approval The procedures in 1.10 and 1.11 of
38、 RP 14 part II shall apply. 4 Qualification-product assessment level schedules NOTEThe following eleven Q-PALS are based upon corresponding PALS in EN 165000-4. Q-PALS 4, 5, 8, 9, 10 and 11 are structured to include subgroups C1 and C2 so that the schedules correspond to CECC 63000 Assessment Level
39、K Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:30:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 165000-5:1997 BSI 04-19995 The remaining Q-PALS corespond to CECC 63000 Assessment Levels L and M. Q-PRODUCT ASSESSMENT LEVEL SCHEDULE 1. Applicability. This assessment schedule is intende
40、d for use with solder assembled and/or bare die, non-hermetic encapsulated, unencapsulated, cavity or non-cavity devices, which are for use in benign mechanical and temperature environments. Subgroup A Tests: Device Screening 100 %EN 165000-1 Reference 1. Electrical test Tamb. Those tests in the Det
41、ail Specification which define circuit functionality. 3.4 Subgroup B Tests (lot-by-lot): Device Sample Testing. IL S4 AQL 0,4 % 1. Electrical test Tamb (other than those specified for Screening).3.4 2. External visual inspections.3.3.2 Subgroup C Tests (6 monthly period): Design Evaluation. Minimum
42、sample 8. Accept on 0 failures. 1. Electrical test. All specified parameters Tmin no adhesive or polymeric materials used for lid attach and no flux used in the final sealing process. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:30:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 165000
43、-5:1997 BSI 04-199911 Q-PRODUCT ASSESSMENT LEVEL SCHEDULE 7. Applicability. This assessment schedule is intended for use with bare die, hermetic cavity devices. This assessment is also intended for use with substrates containing solder attached added components all of which are individually hermetic
44、. These devices are for use in benign mechanical environments but with demonstration of extreme temperature operation. The assessment with the addition of the burn-in requirement is intended to give a medium level of assurance. Subgroup A Tests: Device Screening 100 % PDA = 10 %EN 165000-1 Reference
45、 1. Change of temperature. 10 cycles.3.5.8 1) 2. Burn-in 160 hours.3.5.14 3. Electrical test Tamb. Those tests in the Detail Specification which define circuit functionality.3.4 4. Sealing fine and gross.3.5.9 5. External visual inspection.3.3.2 Subgroup B Tests (lot-by-lot): Device Sample Testing.
46、IL S4 AQL 0,4 % 1. Electrical test Tamb (other than those specified for Screening).3.4 2. Electrical tests Tmin, Tmax and Tamb. Those tests in the Detail Specification which define circuit functionality. 3.4 Subgroup C Tests (6 monthly): Design Evaluation. Minimum sample 8. Accept on 0 failures. 1.
47、Electrical Endurance 1 000 h. Release after 160 h.a3.5.14 2. Dimensions.3.3.3 Subgroup D Tests (12 monthly): Design Evaluation. Minimum sample 3. Accept on 0 failures. 1. Resistance of circuits to solder heat.(D)3.5.11 2. Solderability.(ND/D)3.5.10 3. Robustness of terminations.(D)3.5.12 4. Resistan
48、ce to solvents.(ND)3.5.15 5. Damp heat steady state 56 days or Salt mist. (as specified in the Detail Specification) (D)3.5.3, 3.5.13 a Structural similarity rules do not apply. Process and Packaging requirements. 1. Substrate fabrication = class 100 000. 2. Substrate assembly (bare die) = class 100
49、 000. 3. Temperature monitored and controlled, relative humidity 3065 % prior to hermetic sealing stage. 4. E.S.D precautions (where applicable) to CECC 00015. 5. Pre-cap visual 100 %.3.3.1 6. Hermetic packaging in glass, metal, ceramic or combinations of these; no adhesive or polymeric materials used for lid attach and no flux used in the final sealing process. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:30:25 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 165000-5:1997 12 BSI 04-1999 Q-PRODUCT
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