BS-EN-60068-2-69-2007.pdf
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1、BRITISH STANDARD BS EN 60068-2-69: 2007 Environmental testing Part 2-69: Tests Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method The European Standard EN 60068-2-69:2007 has the status of a British Standard ICS 19.040; 31.190 ? L
2、icensed Copy: London South Bank University, London South Bank University, Wed Aug 08 03:54:53 GMT+00:00 2007, Uncontrolled Copy, (c) BSI BS EN 60068-2-69:2007 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2007 BSI 2007 ISBN 978 0 58
3、0 55860 3 National foreword This British Standard is the UK implementation of EN 60068-2-69:2007. It is identical to IEC 60068-2-69:2007. It supersedes BS EN 60068-2-69:1996 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly
4、technology. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot confer
5、immunity from legal obligations. Amendments issued since publication Amd. No. DateComments Licensed Copy: London South Bank University, London South Bank University, Wed Aug 08 03:54:53 GMT+00:00 2007, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD EN 60068-2-69 NORME EUROPENNE EUROPISCHE NORM June 20
6、07 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserv
7、ed worldwide for CENELEC members. Ref. No. EN 60068-2-69:2007 E ICS 19.040; 31.190 Supersedes EN 60068-2-69:1996 English version Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (IEC 60
8、068-2-69:2007) Essais denvironnement - Partie 2-69: Essais - Essai Te: Essai de brasabilit des composants lectroniques pour les composants pour montage en surface (CMS) par la mthode de la balance de mouillage (CEI 60068-2-69:2007) Umgebungseinflsse - Teil 2-69: Prfungen - Prfung Te: Prfung der Ltba
9、rkeit von Bauelementen der Elektronik fr Oberflchenmontage (SMD) mit der Benetzungswaage (IEC 60068-2-69:2007) This European Standard was approved by CENELEC on 2007-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this Eu
10、ropean Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (E
11、nglish, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austri
12、a, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. Lic
13、ensed Copy: London South Bank University, London South Bank University, Wed Aug 08 03:54:53 GMT+00:00 2007, Uncontrolled Copy, (c) BSI EN 60068-2-69:2007 2 Foreword The text of document 91/648/FDIS, future edition 2 of IEC 60068-2-69, prepared by IEC TC 91, Electronics assembly technology, was submi
14、tted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60068-2-69 on 2007-06-01. This European Standard supersedes EN 60068-2-69:1996. The main changes from EN 60068-2-69:1996 are as follows: inclusion of lead-free alloy test conditions; inclusion of new fluxes for testing, reflecti
15、ng development of fluxes that have happened in the industry in the past 20 years; inclusion of new component types, and updating test parameters for the whole component list. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an iden
16、tical national standard or by endorsement (dop) 2008-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-06-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60068-2-69:2007 was approved by CEN
17、ELEC as a European Standard without any modification. _ Licensed Copy: London South Bank University, London South Bank University, Wed Aug 08 03:54:53 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 3 EN 60068-2-69:2007 CONTENTS 1 Scope 4 2 Normative references .4 3 Terms and definitions .5 4 General des
18、cription of the method 5 5 Description of the test apparatus.5 6 Preconditioning 6 6.1 Preparation of specimens 6 6.2 Ageing.6 7 Materials 6 7.1 Solder .6 7.2 Flux.7 8 Procedures.7 8.1 Test temperature .7 8.2 Solder bath wetting balance procedure.7 8.3 Solder globule wetting balance procedure 10 9 P
19、resentation of results13 9.1 Form of force versus time trace13 9.2 Test requirements14 10 Information to be given in the relevant specification.14 Annex A (normative) Equipment specification .15 Annex B (informative) Use of the wetting balance for SMD solderability testing .17 Annex ZA (normative) N
20、ormative references to international publications with their corresponding European publications25 Bibliography .24 Figure 1 Test apparatus .5 Figure 2 Typical wetting balance trace13 Table 1 Recommended solder bath wetting balance test conditions.9 Table 2 Time sequence of the test (solder bath) .1
21、0 Table 3 Recommended solder globule wetting balance test conditions 11 Table 4 Time sequence of the test (Solder globule) 12 Licensed Copy: London South Bank University, London South Bank University, Wed Aug 08 03:54:53 GMT+00:00 2007, Uncontrolled Copy, (c) BSI EN 60068-2-69:2007 4 ENVIRONMENTAL T
22、ESTING Part 2-69: Tests Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method 1 Scope This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mount
23、ing devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globul
24、e wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. 2 Normative references The following referenced documents are i
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