BS-EN-60191-6-3-2001 IEC-60191-6-3-2001.pdf
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1、BRITISH STANDARD BS EN 60191-6-3:2001 IEC 60191-6-3:2000 Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP) The European
2、 Standard EN 60191-6-3:2000 has the status of a British Standard ICS 31.080.01; 31.240 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW Licensed Copy: sheffieldun sheffieldun, na, Wed Nov 08 01:58:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 60191-6-3:2001 This British S
3、tandard, having been prepared under the direction of the Electrotechnical Sector Committee, was published under the authority of the Standards Committee and comes into effect on 15 May 2001 BSI 05-2001 ISBN 0 580 37243 X National foreword This British Standard is the official English language versio
4、n of EN 60191-6-3:2000. It is identical with IEC 60191-6-3:2000. The UK participation in its preparation was entrusted by Technical Committee EPL/47, Mechanical standardization, to Subcommittee EPL/47/4, Semiconductors, which has the responsibility to: A list of organizations represented on this sub
5、committee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publications
6、may contain identifiers from both systems. Cross-references Attention is drawn to the fact that CEN and CENELEC Standards normally include an annex which lists normative references to international publications with their corresponding European publications. The British Standards which implement the
7、se international or European publications may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary
8、 provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enq
9、uiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 17 and a back
10、 cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. DateComments Licensed Copy: sheffieldun sheffieldun, na, Wed Nov 08 01:58:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARDEN 60191-6-3 NO
11、RME EUROPENNE EUROPISCHE NORMDecember 2000 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2000 CENELEC -All rights of exploitat
12、ion in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60191-6-3:2000 E ICS 31.080.01 English version Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - M
13、easuring methods for package dimensions of quad flat packs (QFP) (IEC 60191-6-3:2000) Normalisation mcanique des dispositifs semiconducteurs Partie 6-3 : Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface - Mthodes de mesure pour les botiers
14、 plats quadrangulaires (QFP) (CEI 60191-6-3:2000) Mechanische Normung von Halbleiterbauelemente Teil 6-3: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitegehusen - Meverfahren fr QFP-Gehusemae (IEC 60191-6-3:2000) This European Standard was approved by CENELEC on 2000-11-0
15、1. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtain
16、ed on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Centra
17、l Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and
18、United Kingdom. Licensed Copy: sheffieldun sheffieldun, na, Wed Nov 08 01:58:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Foreword The text of document 47D/370/FDIS, future edition 1 of IEC 60191-6-3, prepared by SC 47D, Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconduct
19、or devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-3 on 2000-11-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement(dop) 2001-08-01
20、 latest date by which the national standards conflicting with the EN have to be withdrawn(dow) 2003-11-01 Annexes designated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the Internation
21、al Standard IEC 60191-6-3:2000 was approved by CENELEC as a European Standard without any modification. _ Page 2 EN 6019163:2000 Licensed Copy: sheffieldun sheffieldun, na, Wed Nov 08 01:58:13 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BSI 05-2001 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
22、Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP) 1 Scope This part of IEC 60191 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified in
23、to Form E. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 60191. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. However, parties to
24、agreements based on this part of IEC 60191 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and ISO maintain register
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