BS-EN-61191-3-1999 IEC-61191-3-1998.pdf
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1、BRITISH STANDARD BS EN 61191-3:1999 IEC 61191-3: 1998 Printed board assemblies Part 3: Sectional specification Requirements for through-hole mount soldered assemblies The European Standard EN 61191-3:1998 has the status of a British Standard ICS 31.180 Licensed Copy: sheffieldun sheffieldun, na, Fri
2、 Nov 10 16:46:47 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 61191-3:1999 This British Standard, having been prepared under the direction of the Electrotechnical Sector Committee, was published under the authority of the Standards Committee and comes into effect on 15 January 1999 BSI 06-1999 I
3、SBN 0 580 30840 5 National foreword This British Standard is the English language version of EN 61191-3:1998. It is identical with IEC 61191-3:1998. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to:
4、aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organiz
5、ations represented on this committee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system
6、to the other, publications may contain identifiers from both systems. Cross-references Attention is drawn to the fact that CEN and CENELEC Standards normally include an annex which lists normative references to international publications with their corresponding European publications. The British St
7、andards which implement these international or European publications may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport t
8、o include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover,
9、 pages i and ii, the EN title page, pages 2 to 13 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No.DateComments Licensed
10、 Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:46:47 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 61191-3:1999 BSI 06-1999i Contents Page National forewordInside front cover Foreword2 Text of EN 61191-33 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:46:47 GMT+00:00 2006, Uncontrol
11、led Copy, (c) BSI ii blank Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:46:47 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61191-3 October 1998 ICS 31.240 English version Printed board assemblies Part 3: Sectional specification Requirem
12、ents for through-hole mount soldered assemblies (IEC 61191-3:1998) Ensembles de cartes imprimes Partie 3: Spcification intermdiaire Exigences relatives lassemblage par brasage de trous traversants (CEI 61191-3:1998) Elektronikaufbauten auf Leiterplatten Teil 3: Rahmenspezifikation Anforderungen an g
13、eltete Baugruppen in Durchsteckmontage (IEC 61191-3:1998) This European Standard was approved by CENELEC on 1998-10-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard wit
14、hout any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other langu
15、age made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France,
16、 Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Centra
17、l Secretariat: rue de Stassart 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61191-3:1998 E Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:46:47 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 611
18、91-3:1998 2 BSI 06-1999 Foreword The text of document 91/133/FDIS, future edition 1 of IEC 61191-3, prepared by IEC TC 91, Surface mounting technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61191-3 on 1998-10-01. This EN 61191-3 is to be used in conjunction
19、 with EN 61191-1:1998. The following dates were fixed: Annexes designated “normative” are part of the body of the standard. In this standard, Annex A and Annex ZA are normative. Annex ZA has been added by CENELEC. Endorsement notice The text of the International Standard IEC 61191-3:1998 was approve
20、d by CENELEC as a European Standard without any modification. Contents Page Foreword2 1General3 1.1Scope3 1.2Classification3 2Normative references3 3Through-hole technology (THT)3 4Through-hole mounting of components3 4.1Placement accuracy3 4.2Through-hole component requirements3 5Acceptance require
21、ments5 5.1Control and corrective actions5 5.2Through-hole component lead soldering5 6Rework of unsatisfactory solder connections8 Annex A (normative) Placement requirements for through-hole mount devices9 Annex ZA (normative) Normative references to international publications with their correspondin
22、g European publications13 Figure 1 Lead bands4 Figure 2 Hole obstruction6 Figure 3 Through-hole component lead soldering6 Figure 4 Lead-to-land fillet requirements for clinched leads and wires in non-plated through-holes6 Figure 5 Lead-to-land fillet requirements for clinched leads and wires in plat
23、ed through-holes7 Figure A.1 Mounting of freestanding components9 Figure A.2 Typical configuration of components with dual nonaxial-leads10 Figure A.3 Mounting of components with dual nonaxial-leads10 Figure A.4 Side mounting10 Figure A.5 End mounting11 Figure A.6 Mounting with footed stand-offs11 F
24、igure A.7 Non-resilient footed stand-offs12 Figure A.8 Acceptable lead configurations12 Figure A.9 Configuration of ribbon leads for through-hole mounting13 Table 1 Plated through-holes with component leads, minimum acceptable conditions7 Table 2 Through-hole solder joint defects8 latest date by whi
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