BS-EN-60191-6-2004.pdf
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1、BRITISH STANDARD BS EN 60191-6:2004 Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages The European Standard EN 60191-6:2004 has the status of a British Standard ICS 31.080.01 ? Licensed C
2、opy: sheffieldun sheffieldun, na, Fri Nov 10 17:40:17 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 60191-6:2004 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 18 February 2005 BSI 18 February 2005 ISBN 0 580 45493 2 National foreword Thi
3、s British Standard is the official English language version of EN 60191-6:2004. It is identical with IEC 60191-6:2004. It supersedes BS 3934-6:1992 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductor devices, which has the responsibi
4、lity to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “Interna
5、tional Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a Brit
6、ish Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international an
7、d European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 39 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Amendments issued
8、since publication Amd. No. DateComments Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:40:17 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD EN 60191-6 NORME EUROPENNE EUROPISCHE NORM December 2004 CENELEC European Committee for Electrotechnical Standardization Comit Europen
9、de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60191-6:2004 E ICS 31.080.01 Englis
10、h version Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2004) Normalisation mcanique des dispositifs semiconducteurs Partie 6: Rgles gnrales pour la prparation des dessin
11、s dencombrement des dispositifs semiconducteurs montage en surface (CEI 60191-6:2004) Mechanische Normung von Halbleiterbauelementen Teil 6: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitergehusen (IEC 60191-6:2004) This European Standard was approved by CENELEC on 2004-1
12、0-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obt
13、ained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Cen
14、tral Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherl
15、ands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:40:17 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Foreword The text of document 47D/584/FDIS, future edition 2 of IEC 60191-6, prepared by SC 47
16、D, Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6 on 2004-10-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by
17、publication of an identical national standard or by endorsement (dop) 2005-07-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2007-10-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-6:2004
18、was approved by CENELEC as a European Standard without any modification. _ Page 2 EN 601916:2004 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:40:17 GMT+00:00 2006, Uncontrolled Copy, (c) BSI 2 061-196 EI:C002(4)E CONTENTS 1 Scope.4 2 Normative references .4 3 Definitions 4 4 Design rule
19、s .6 5 Dimensions to be specified.6 6 Notes .6 Annex A (informative) Illustration of the rules10 A.1 Gull-wing lead package with two parallel rows of terminals (SOP,TSOP Type 2)12 A.2 Gull-wing lead package with two parallel rows of terminals (TSOP Type 1)15 A.3 Gull-wing lead package with one row o
20、f terminals on each of four sides (QFP) .18 A.4 J-bent lead package with two parallel rows of terminals (SOJ) .21 A.5 Folded lead package with one row of terminals on each of four sides (QFJ)24 A.6 Leadless package.28 A.7-1 Ball grid array package (BGA) Type 1.31 A.7-2 Ball grid array package (BGA)
21、Type 2.34 Annex B (informative) Optional table format37 Figure 1 Iulltsraitnoo sf etrmilan projectino zeno .21 iFugre 2 sI morteic view fo an xemaple fo gauge.21 2 60191-6 IEC:2004(E) TNOCENTS 1 Scope.4 2 oNrmative referencse .4 3 eDfinitions 4 4 eDsing rusel .6 5 iDmnesiosn ot eb specified.6 6 Nose
22、t .6 Annex A (ifnromative) Illusrtation fo htr eules11 A.1 Gu-llwikcap dael gnw egaiwt htrap or lellaows of etrmslani (SOP,TSOP Tyep )231 A.2 Gu-llwikcap dael gnw egaiwt htrap or lellaows of etrmslani (TSOP Ty)1 ep61 .A3 Gull-wign elap dcakgaiw etno he rofo w tremianls oe ncah fo fruo sidse (Q)PF .9
23、1 A.4 J-tneb kcap daelw egaiwt htrap or lellaows fo retmnisla (S)JO .22 .A5 oFdled leda packgae tiwh one rofo w retminals on each fo foru sised (QJF)52 A.6 Lldaeess apkcage.92 .A-71 Ball grid raray packgae (BGA) Type 1.23 .A-72 Ball grid raray packgae (BGA) Type 2.53 Annex B (ifnromative) Opitonal t
24、albe formta83 Figure 1 Illustrations of terminal projection zone .11 Figure 2 Isometric view of an example of gauge.11 Annex ZA (normative) Normative references to international publications with their corresponding European publications . 39 Page 3 EN 601916:2004 Licensed Copy: sheffieldun sheffiel
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