BS-EN-61190-1-2-2002.pdf
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1、BRITISH STANDARD BS EN 61190-1-2:2002 Attachment materials for electronic assembly Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly The European Standard EN 61190-1-2:2002 has the status of a British Standard ICS 31.190 ? Licensed Copy: sheffieldun sh
2、effieldun, na, Fri Nov 10 16:57:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 61190-1-2:2002 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Comm
3、ittee on 12 August 2002 BSI 12 August 2002 ISBN 0 580 40233 9 National foreword This British Standard is the official English language version of EN 61190-1-2:2002. It is identical with IEC 61190-1-2:2002. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electron
4、ic assembly technology, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027
5、-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue
6、 under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standard Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for their correc
7、t application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests infor
8、med; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 19 and a back cover. The BSI copyright date displayed in this document indicates when the document
9、was last issued. Amendments issued since publication Amd. No. DateComments Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:57:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARDEN 61190-1-2 NORME EUROPENNE EUROPISCHE NORMJune 2002 CENELEC European Committee for Electrotechnical
10、 Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2002 CENELEC -All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61190
11、-1-2:2002 E ICS 31.190 English version Attachment materials for electronic assembly Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (IEC 61190-1-2:2002) Matriaux de fixation pour les assemblages lectroniques Partie 1-2: Exigences relatives aux crmes
12、 de brasage pour les interconnexions de haute qualit dans les assemblages de composants lectroniques (CEI 61190-1-2:2002) Verbindungsmaterialien fr Baugruppen der Elektronik Teil 1-2: Anforderungen an Lotpaste fr hochwertige Verbindungen in der Elektronikmontage (IEC 61190-1-2:2002) This European St
13、andard was approved by CENELEC on 2002-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references conce
14、rning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into
15、its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Net
16、herlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:57:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Foreword The text of document 91/278/FDIS, future edition 1 of IEC 61190-1-2, prepared by IEC TC 91, Electro
17、nics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61190-1-2 on 2002-06-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement(d
18、op) 2003-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn(dow) 2005-06-01 Annexes designated “normative“ are part of the body of the standard. In this standard, annexes A and ZA are normative. Annex ZA has been added by CENELEC. _ Endorsement notice The
19、text of the International Standard IEC 61190-1-2:2002 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 61191-1NOTEHarmonized as EN 61191-1:1998 (not modified). IEC
20、 61191-2NOTEHarmonized as EN 61191-2:1998 (not modified). IEC 61191-3NOTEHarmonized as EN 61191-3:1998 (not modified). IEC 61191-4NOTEHarmonized as EN 61191-4:1998 (not modified). ISO 9000NOTEHarmonized as EN ISO 9000:2000 (not modified). ISO 9001NOTEHarmonized as EN ISO 9001:2000 (not modified). _
21、Page 2 EN 6119012:2002 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 16:57:40 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CONTENTS INTRODUCTION.5 1Scope.6 2Normative references .6 3Terms and definitions .7 4Requirements.7 4.1Conflict7 4.2Standardized description for products7 4.2.1Alloy comp
22、osition 8 4.2.2Flux characterization and inspection8 4.2.3Shelf life8 4.3Solder powder particle size .8 4.3.1Powder size determination.8 4.3.2Powder size.8 4.3.3Solder powder particle shape 9 4.4Metal per cent .9 4.5Viscosity10 4.5.1Methods of determining viscosity.10 4.6Slump and smear test10 4.6.1
23、Test with 0,2 mm thick stencil10 4.6.2Test with 0,1 mm thick stencil11 4.7Solder ball test 12 4.7.1Type 1-4 powder12 4.7.2Type 5-6 powder12 4.8Tack test .12 4.9Wetting13 4.10 Labelling .13 5Quality assurance provisions14 5.1Responsibility for inspection14 5.1.1Responsibility for compliance 14 5.1.2T
24、est equipment and inspection facilities 14 5.1.3Inspection conditions.14 5.2Classification for inspections .14 5.3Inspection report form .14 5.4Qualification inspection .15 5.4.1Sample size.15 5.4.2Inspection routine15 5.5Quality conformance15 5.5.1Sampling plan15 5.5.2Rejected lots .15 6Preparation
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