BS-EN-61192-3-2003.pdf
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1、BRITISH STANDARD BS EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies The European Standard EN 61192-3:2003 has the status of a British Standard ICS 31.190 ? Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006
2、, Uncontrolled Copy, (c) BSI BS EN 61192-3:2003 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 7 April 2003 BSI 7 April 2003 ISBN 0 580 41544 9 National foreword This British Standard is the official English language version of EN 61192-3:20
3、03. It is identical with IEC 61192-3:2002. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-r
4、eferences The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of Bri
5、tish Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; prese
6、nt to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an i
7、nside front cover, the EN title page, pages 2 to 47 and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. DateComments Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 200
8、6, Uncontrolled Copy, (c) BSI EUROPEAN STANDARDEN 61192-3 NORME EUROPENNE EUROPISCHE NORMFebruary 2003 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart
9、 35, B - 1050 Brussels 2003 CENELEC -All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61192-3:2003 E ICS 31.190 English version Workmanship requirements for soldered electronic assemblies Part 3: Through-hole mount assemblies (IEC 61192-3:20
10、02) Exigences relatives la qualit dexcution des assemblages lectroniques brass Partie 3: Assemblage au moyen de trous transversants (CEI 61192-3:2002) Anforderungen an die Ausfhrungsqualitt von Ltbaugruppen Teil 3: Baugruppen in Durchsteckmontage (IEC 61192-3:2002) This European Standard was approve
11、d by CENELEC on 2003-02-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such nationa
12、l standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language a
13、nd notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway,
14、Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Foreword The text of document 91/334/FDIS, future edition 1 of IEC 61192-3, prepared by IEC TC 91, Electronics assembly techno
15、logy, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 61192-3 on 2003-02-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement(dop)2003-11-01 latest d
16、ate by which the national standards conflicting with the EN have to be withdrawn(dow)2006-02-01 This standard should be used in conjunction with the following parts of EN 61192, under the general title Workmanship requirements for soldered electronic assemblies: Part 1: General Part 2: Surface-mount
17、 assemblies Part 4: Terminal assemblies Annexes designated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61192-3:2002 was approved by CENELEC as a European
18、 Standard without any modification. _ Page 2 EN 611923:2003 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CONTENTS INTRODUCTION.6 1 Scope.7 2 Normative references7 3 Terms and definitions .8 4 General requirements .8 4.1 Classification.8 4
19、.2 Conflict8 4.3 Inspection techniques 8 4.4 Interpretation of requirements8 5 Component preparation processes9 5.1 Lead forming .9 5.2 Lead protrusion and clinching 10 5.3 Lead cutting/cropping 12 5.4 Pre-tinning.13 6 Masking attributes 13 6.1 Misalignment .13 6.2 Improper adhesion.13 6.3 Thermal c
20、apability .15 7 Insertion of through-hole components .16 7.1 General requirements 16 7.2 Orientation and mounting criteria .17 7.3 Missing component27 7.4 Wrong component .27 7.5 Damaged component.27 8 Soldering process attributes31 8.1 General requirements 31 8.2 Misalignment .34 8.3 Damaged compon
21、ents.34 8.4 Solder joint characteristics.34 9 Cleaning attributes40 9.1 Flux residues.41 9.2 Other residues.42 10 Rework/replacement attributes46 Annex ZA (normative) Normative references to international publications with their corresponding European publications47 Figure 1 Lead forming, lead exten
22、sion 9 Figure 2 Lead forming, bend radius 9 Figure 3 Straight and partially clinched leads 10 Figure 4 Lead protrusion 10 Figure 5 Lead protrusion, clinched11 Figure 6 Lead protrusion, partially clinched.11 Figure 7 Clinched lead Nonconforming 12 Page 3 EN 611923:2003 Licensed Copy: sheffieldun shef
23、fieldun, na, Fri Nov 10 17:58:00 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Figure 8 Lead cutting, target.12 Figure 9 Lead cutting Acceptable.12 Figure 10 Lead cutting Nonconforming.13 Figure 11 Acceptable solder mask14 Figure 12 Solder mask Cracking or blistered14 Figure 13 Solder mask Loose partic
24、les 14 Figure 14 Permanent solder-mask blisters or wrinkling .15 Figure 15 Permanent solder-mask failure .15 Figure 16 Solder-mask degradation16 Figure 17 Component orientation Target17 Figure 18 Component orientation Acceptable.17 Figure 19 Component orientation Nonconforming.18 Figure 20 Radial le
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