BS-IEC-60191-1-2007.pdf
《BS-IEC-60191-1-2007.pdf》由会员分享,可在线阅读,更多相关《BS-IEC-60191-1-2007.pdf(40页珍藏版)》请在三一文库上搜索。
1、BRITISH STANDARD BS IEC 60191-1:2007 Mechanical standardization of semiconductor devices Part 1: General rules for the preparation of outline drawings of discrete devices ICS 31.080.01 ? Licensed Copy: London South Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Un
2、controlled Copy, (c) BSI BS IEC 60191-1:2007 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2007 BSI 2007 ISBN 978 0 580 50842 4 National foreword This British Standard was published by BSI. It is the UK implementation of IEC 60191-1
3、:2007. It supersedes BS 3934-1:1992 which is withdrawn. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors. A list of organizations represented on this committee can be obtained on request to its secretary. This publication does not purport to include
4、 all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard cannot confer immunity from legal obligations. Amendments issued since publication Amd. No. DateComments Licensed Copy: London South Bank University, London South Bank U
5、niversity, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI INTERNATIONAL STANDARD IEC 60191-1 Second edition 2007-04 Mechanical standardization of semiconductor devices Part 1: General rules for the preparation of outline drawings of discrete devices Reference number IEC 60191-1:2007(
6、E) BS IEC 60191-1:2007 Licensed Copy: London South Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI CONTENTS 1 Scope and object4 2 Normative references .4 3 Terms and definitions .4 4 General rules for all drawings.6 4.1 Drawing layout 6 4
7、.2 Dimensions and tolerances .6 4.3 Methods for locating the datum .8 4.4 Numbering of terminals .8 5 Additional rules 10 5.1 Rules for device and case outline drawings.10 5.2 Rules to specify the dimensions and positions of terminals10 5.3 Rules for gauge drawings11 6 Inter-conversion of inch and m
8、illimetre dimensions and rules for rounding off11 7 Rules for coding .12 Annex A (informative) Reference letter symbols.13 Annex B (normative) Standardization philosophy .16 Annex C (informative) Rules to specify the dimensions and positions of terminals on a base drawing 21 Annex D (normative) Gene
9、ral philosophy of flat base devices28 Annex E (informative) Examples of semiconductor device drawing 30 Annex F (informative) Former rules for rounding off .34 Annex G (informative) Former rules for coding.36 Bibliography37 Figure 1 Numbering of terminals of lozenge shaped bases9 Figure 2 System to
10、indicate the dimensions of the terminals 11 Figure B.1 Example of rigid lug device .19 Figure B.2 Example of flexible terminal device.20 Figure C.1 Circular base outline with no tab.25 Figure C.2 Tolerances of terminals 25 Figure C.3 Gauge for a circular base outline with no tab 26 Figure C.4 Circul
11、ar base outline with tab27 Figure C.5 Gauge for a circular base outline with tab.27 Figure D.1 Example of flat base outline29 Figure E.1 Long form package .30 Figure E.2 3 types of post/stud mount packages 30 Figure E.3 2 types of cylindric packages 31 Figure E.4 Oval package, terminals in line .32
12、BS IEC 60191-1:2007 2 Licensed Copy: London South Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI Figure E.5 Cylindric package with different terminations 32 Figure E.6 Flange mount package32 Figure E.7 Disk button package with 3 terminat
13、ions .33 Figure E.8 Special shape for bolt-fixture 33 Table A.1 Dimensions of reference letter symbols13 BS IEC 60191-1:2007 3 Licensed Copy: London South Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI MECHANICAL STANDARDIZATION OF SEMIC
14、ONDUCTOR DEVICES Part 1: General rules for the preparation of outline drawings of discrete devices 1 Scope and object This part of IEC 60191 gives guidelines on the preparation of outline drawings of discrete devices. NOTE For preparation of outline drawings of surface mounted discrete devices, IEC
15、60191-6 should be referred to as well. The primary object of these drawings is to indicate the space which should be allowed for devices in an equipment, together with other dimensional characteristics required to ensure mechanical interchangeability. It should be noted that complete interchangeabil
16、ity involves other considerations such as the electrical and thermal characteristics of the semiconductor devices concerned. The international standardization represented by these drawings therefore encourages the manufacturers of devices to comply with the tolerances shown on the drawings in order
17、to extend their range of customers internationally. It also gives equipment designers an assurance of mechanical interchangeability between the devices obtained from suppliers in different countries, provided they allow the space in their equipment that is indicated by the drawings and take note of
18、the more precise information on bases, studs, etc. NOTE Additional details on the standardization philosophy used in this standard are given in Annex B. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the ed
19、ition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-2:1966, Mechanical standardization of semiconductor devices Part 2: Dimensions (including all supplements and amendments) IEC 60191-4, Mechanical standardization o
20、f semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages ISO 370, Toleranced dimensions Conversion from inches to millimetres and vice versa (withdrawn 2000-05) 3 Terms and definitions For the purposes of this document, the fol
21、lowing definitions apply. 3.1 device outline drawing drawing which includes all dimensional characteristics required for the mechanical interchangeability of the complete device. It includes the case or body, all terminals and the locating tab if present BS IEC 60191-1:2007 4 Licensed Copy: London S
22、outh Bank University, London South Bank University, Mon Jul 16 04:12:19 GMT+00:00 2007, Uncontrolled Copy, (c) BSI 3.2 terminal that part of the semiconductor device primarily used in making an electrical, mechanical or thermal connection. Examples of terminals are flexible leads, rigid leads, pins,
23、 studs, etc. 3.3 case outline drawing drawing which includes all dimensional characteristics required for the mechanical interchangeability of the case or body. It does not include the dimensions of the terminals or the locating tab if present, but their positions are shown by dotted lines 3.4 base
24、drawing drawing which includes all dimensional characteristics required for the mechanical interchangeability of the terminals and mechanical index NOTE 1 Examples of these characteristics are: lead length, lead diameters with controlled zones, lead spacing, pitch circle diameter, thickness, width a
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- BS IEC 60191 2007
链接地址:https://www.31doc.com/p-3748232.html