BS-EN-60191-6-4-2003.pdf
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1、BRITISH STANDARD BS EN 60191-6-4:2003 Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA) The European Standard EN 60191-
2、6-4:2003 has the status of a British Standard ICS 31.080.01 ? Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:14:59 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 60191-6-4:2003 This British Standard was published under the authority of the Standards Policy and Strategy Committee on 4 Au
3、gust 2003 BSI 4 August 2003 ISBN 0 580 42356 5 National foreword This British Standard is the official English language version of EN 60191-6-4:2003. It is identical with IEC 60191-6-4:2003. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which ha
4、s the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section e
5、ntitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compli
6、ance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related
7、international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 17 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Am
8、endments issued since publication Amd. No. DateComments Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:14:59 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD EN 60191-6-4 NORME EUROPENNE EUROPISCHE NORM July 2003 CENELEC European Committee for Electrotechnical Standardization
9、Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60191-6-4:2003 E ICS
10、31.080.01 English version Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003) Normalisation mcaniq
11、ue des dispositifs semiconducteurs Partie 6-4: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface - Mthodes de mesure pour les dimensions des botiers matriciels billes (CEI 60191-6-4:2003) Mechanische Normung von Halbleiterbauelementen Teil
12、6-4: Allgemeine Regeln fr die Erstellung von Gehusezeichnungen von SMD-Halbleitergehusen - Messverfahren fr Gehusemae von Ball Grid Array (BGA) (IEC 60191-6-4:2003) This European Standard was approved by CENELEC on 2003-07-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulat
13、ions which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This
14、European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members
15、are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. Licensed Copy: sheffiel
16、dun sheffieldun, na, Fri Nov 10 17:14:59 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Foreword The text of document 47D/531/FDIS, future edition 1 of IEC 60191-6-4, prepared by SC 47D, Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CE
17、NELEC parallel vote and was approved by CENELEC as EN 60191-6-4 on 2003-07-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2004-04-01 latest date by which the national sta
18、ndards conflicting with the EN have to be withdrawn (dow) 2006-07-01 Annexes designated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60191-6-4:2003 was ap
19、proved by CENELEC as a European Standard without any modification. _ Page 2 EN 6019164:2003 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 17:14:59 GMT+00:00 2006, Uncontrolled Copy, (c) BSI CONTENTS 1 Scope 4 2 Normative references .4 3 Terms and definitions4 4 Reference character and drawi
20、ngs5 4.1 Ball grid array package (BGA) Type 1 Ball datum 5 4.2 Ball grid array package (BGA) Type 2 Body datum 6 5 Measuring method7 5.1 Datum S as pertaining to ball coplanarity .7 5.2 Datum A, B7 5.3 Definition of specified dimensions and measuring method 9 5.4 Profile of a package edge surface v
21、.11 5.5 Mounting height A12 5.6 First stand-off A1.12 5.7 Second stand-off A4 13 5.8 Ball diameter b 14 5.9 Ball centre position X.14 5.10 Ball coplanarity y.16 5.11 Package top flatness y1.16 Annex ZA (normative references to international publications with their corresponding European publications
22、 17 Figure 1 BGA package Type 1 Ball datum5 Figure 2 BGA package Type 2 Body datum6 Figure 3 Datum S.7 Figure 4 Datum A, B Type 1 8 Figure 5 Centre of ball centres (for an even number) 8 Figure 6 Centre of ball centres (for an odd number)8 Figure 7 Datum A Type 2 9 Figure 8 Datum B Type 2 9 Figure 9
23、 Tolerance w .10 Figure 10 Measuring method of tolerance w10 Figure 11 Profile of a package edge surface v 11 Figure 12 Measuring method of package edge surface v.11 Figure 13 Mounting height A 12 Figure 14 First stand-off A112 Figure 15 Measuring method of stand-off A1.13 Figure 16 Second stand-off
24、 A4 .13 Figure 17 Measuring method of stand-off A4.14 Figure 18 Ball diameter b .14 Figure 19 Ball centre position X 15 Figure 20 Theoretically correct ball centre 15 Figure 21 Measuring method of ball centre position X .15 Figure 22 Ball coplanarity y16 Figure 23 Package top flatness y116 Page 3 EN
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