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1、- EIA 5408000 89 3234600 0074432 3 - - - * O O O O d in I m a i ANSI/EIA-540B000-1989 APPROVED: April 11, 1989 EIA S P ECI FI CATI ON Sectional Specification Sockets for Pin Grid Array Devices With 2.54 mrn x 2.54 rnrn (0.1“ x O . “ ) . Spacing for Use in Electronic Equipment EIA-540B000 APRIL 1989
2、ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERING DEPARTMENT Aooroved For Use In The NECQ s i t i m - - Copyright Electronic Components, Assemblies degradations are not permitted. 2 . 0 GENERAL 2.1 Related Documents The following documents of t h e issue i n effect form a p a r t of t h i s specificatio
3、n t o the extent specified herein: EIA-5400000 Generic Specification for Sockets for Integrated Circuit ( I C ) Packages for Use i n Electronic Equipment. Copyright Electronic Components, Assemblies 1 cycle constitutes moving one direction i n t h e same plane from t h e original position and then r
4、eturning t o the original position. NOTE: This test s h a l l only be performed on solder tab or solderless wrap products. 4.2.8 Porosity Porosity t e s t i n g s h a l l be performed on individual contacts. When tested, the average corrosion count shall not exceed 1.0. 4.2.9 Examinat ion of Dimensi
5、on Sockets s h a l l be examined t o verify t h a t t h e dimen- sions, design and construction are in accordance with the d e t a i l Specification. 4.2.10 V i s u a l Examinations Sockets s h a l l be examined t o verify that the marking and workmanship are in accordance with the related specifica
6、tion. Electrical Tests 4.3.1 Insulation Resistance When tested i n i t i a l insulation resistance s h a l l be 1,000 M f l or greater. The insulation resistance a f t e r humidity shall be 1,000 M O or greater. The applied test voltage s h a l l be 500 Vdc. Sample preparation - see test sequence. I
7、nsulation resistance shall not be measured on the same contact pairs as contact resistance (millivolt level method). Copyright Electronic Components, Assemblies where appl i cab1 e . 4.4 Environmental Tests NOTE: A test package which has been through any environmental test should not be removed from
8、 its socket and replaced with a fresh device when performing any subsequent electrical test. 4.4.1 Solderability This test s h a l l be performed on individual contacts. The terminal s h a l l be immersed t o a depth s u f f i c i e n t t o include a l l portions of the terminal t o which solder con
9、nections would normally be made. The dipped surfaces of t h e terminal s h a l l be a t l e a s t 95% covered by a continuous new solder coating and s h a l l not have pin holes or voids which are concentrated i n one area or exceed 5% of the dipped area. Terminals s h a l l be examined using 1 0 X
10、magnification. 4.4.2 Resistance t o Soldering Heat When tested, there shall be no evidence of distor- tion of p l a s t i c or metal components or any other damage when examined under 3X magnification. sockets s h a l l be mounted t o a typical i.e., 1.57 mm (-062“ t h i c k ) printed wiring board.
11、The 4.4.3 Temperature/Humidity Sockets shall be tested a t accelerated humidity and temperature. the sockets shall be conditioned a t room ambient for a period of four hours. The sockets s h a l l meet t h e requirements of paragraphs 4.3.1, 4.3.2 and 4.3.3 of t h i s specification. Upon completion
12、of exposure period, ,-=T. Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 23:44:16 MDTNo reproduction or networking permitted without license from IHS -,-,- E I
13、A 5406000 49 m 3234b00 0074446 3 m -F I EIA-540B000 Page 11 4.4.4 Temperature Life The socket shall be mated with a teat pagkage. ghe maged socket shall be exposed to 85 C + 5 C (185 F - +9 FI for 300 hours per Method A. Upon completion of the exposure period, the socket contacts shall meet the requ
14、irements of paragraph 4.3.3 of this specifi- cation. 4.4.5 Rapid Change of Temperature (Thermal Shock) I Sockets shall be tested using a test package and the retention feature, if applicable. When tested, there shall be no evidence of physical damage and shall meet the requirements in paragraphs 4.3
15、.1, 4.3.2 and 4.3.3 of this specification. 4.4.6 Corrosive Atmosphere Upon completion of the exposure, the sockets shall pass the requirements of paragraph 4.3.3 of this specification. The mated sockets and the pin grid array, specifically the pin grid array, shallnot be disturbed during this test.
16、Using socket assemblies mounted to the appropriate footprint (with Pin Grid Array inserted) in a fashion in which it is to be used, the socket shall be exposed to a concentrated ammonium sulfide atmosphere. The following details shall apply: (a) Concentration of ( N H ) : 22% (b) Relative humidity:
17、60%-70% (c) Exposure time: 4 hours (d) Temperature: room ambient Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 23:44:16 MDTNo reproduction or networking permit
18、ted without license from IHS -,-,- I - E I A 5408080 89 3234600 0074447 5 EIA-540B000 Page 12 4.4.7 Mold Growth (Fungus) - 2 Fungus testing not applicable i f manufacturer certifies that all external materials are non-nutrient t o fungus. performed as the last sequence of Group I V on both sample so
19、ckets. Where testing is required, t h i s shall be 5.0 PACKAGING REQUIREMENTS 5.1 Unit Packing Sockets shall be individually unit packed. In addition t o any special marking required by purchaser, each package and exterior container s h a l l be marked with EIA part number, manufacturers part number
20、 and date code. Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 23:44:16 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A 5408000
21、89 3234600 0074448 7 EIA-540B000 Page 13 ZIF: NIF: LIF: APPENDIX A TERMINOLOGY (Zero Insertion Force) Socket: A socket in which the contact surfaces do not mechanically touch until it is completely mated, thus requiring no insertion force. After mating, the contacts are actuated in some manner t o m
22、ake intimate electrical contact.* (Normal Insertion Force) Socket: A socket in . which t h e contact surfaces do mechanically touch as they are mated and unmated. Values are generally established a s a force above one . . newton. Performance acceptance levels vary by application requirements.* (Low
23、Insertion Force) Socket: A socket i n which the contact surfaces do mechanically touch as they are mated and unmated. Values are generally established as a force below one newton, but greater than 0 newtons.* *Performance acceptance levels vary by applica- tion requirements. INSULATOR BODY: An insul
24、ator body is t h a t part which holds the contacts in their proper arrangement and electrically insulates them from each other. CONTACTS : A term used i n reference t o pins or sockets when it is not necessary t o distinguish between them. The electrical conductor i n a connector. TERMINATION: That
25、part of a contact which is attached t o the wire or printed wiring board. OPERATING TEMPERATURE: The maximum ambient temperature capabilities of a socket i n continuous service. (The operating temperature of the socket does not necessarily eliminate the possibility of local hot spots when several ad
26、jacent contacts are carrying their maximum rated current.) Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 23:44:16 MDTNo reproduction or networking permitted wi
27、thout license from IHS -,-,- - - - EIA 5408000 89 W 3234600 O074449 9 W - , EIA-540B000 Page 14 DEVICE : A component designed t o serve a special purpose or perform a special function. COXTACT NORMAL FORCE : The force exerted by the contact, perpendicular t o its mating surface. INSERTION FORCE: The
28、 force requiyed to mate single contact positions. SEPARAT I ON FORCE : The force needed t o separate mated single contact positions. The force needed t o engage contact positions i n mating components. A package simulating the mechanical features of a production PGA with appropriate internal electri
29、cal connections required for the test sequence. MATING FORCE: TEST PACKAGE: Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 23:44:16 MDTNo reproduction or networ
30、king permitted without license from IHS -,-,- E I A 5408000 89 m 3234b00 0074450 5 m EIA-540B000 Page 15 w w w o w w w w 4 4 4 4 w o w W W m mmm w z o w o w a o a a a a O s W U Plm :! O 0 z I - 1 - - - - - . - . . z z O0 UV Copyright Electronic Components, Assemblies & Materials Association Provided
31、 by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 23:44:16 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A 5408000 89 m 3234600 0074453 7 m EIA-540B000 Page 16 Bi w w E-iw 9 w w w ,sg Eirn W3WGSEW EiE-iE-iEi
32、Ei 0000000 IZZEZZZ z z z z z z z 3333333 E E E E E E W E-i 3 2 5 RU, 3 . Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 23:44:16 MDTNo reproduction or networkin
33、g permitted without license from IHS -,-,- _- - E I A 540B000 89 m 3234600 0074452 i EIA-540B000 Page 17 O w H w w w w 2 a w 3 Fi Y x z . mcuw r l m m III o *e* z W W W 4 - m m m n w w 3 W m z c z w o w . . . . z z w w u) k V a : o i l O Ei 2 h O a m (v a O Ei 4 E U Y cr: n W 4 E : m Ei V a : O V !
34、2 * O i l a : 3 El k 4 X E ! W N N e u VI- w r l Ei O z Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 23:44:16 MDTNo reproduction or networking permitted witho
35、ut license from IHS -,-,- E I A 5408000 89 m 3234b00 0074453 O m EIA-540B000 Page 18 i e Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 23:44:16 MDTNo reproduct
36、ion or networking permitted without license from IHS -,-,- E I A 5408000 li9 M 3234600 0074454 2 0 L_ EIA STANDARD AND SPECIFICATION NUMBERING STANDARD A document that establishes engineering and technical requirements for authority or adopted by consensus. Standards may also be established for sele
37、ction, application and design criteria for material. - processes, procedures, practices and methods that have been decreed by Standards and other documents not in the specification format use only the EIA basic numbering system as follows: EIA-123 Original Standard EIA-123-1 Addendum to the Original
38、 Standard EIA-123-A First Revision of original Standard incorporating all Addenda SPECIFICATION A document prepared specifically to facilitate procurement which clearly and accurately describes the essential technical requirements for purchased material. Procedures necessary to determine that the re
39、quirements for the purchased material covered by the specification have been met shall also be referenced or included. EIA Specifications use the following system: v E I A 1 2 3 A A A A Standard or Generic Specification Indicator Standard Prefix for all Numbers Sectional Specification Designator Bla
40、nk Detail Specification Designator Detail Specification Designator EIA 1230000 is a Generic Specification EIA 123A000 is a Sectional Specification EIA 123AA00 is a Blank Detail Specification EIA 123AAAA is a Detail Specification EIA 12300AA is a Detail Specification for which no Sectional or Blank D
41、etail Specification was issued NOTES 1. Some older specifications may not have been converted to this numbering system. Using IECQ-System Format,“ for more detail. 2. See EP-11, “Guide for the Preparation of Specifications - Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/29/2007 23:44:16 MDTNo reproduction or networking permitted without license from IHS -,-,-
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