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1、Electronic Industries Alliance July 13, 2001 ERRATA TO: Recipients of the ANSUEIA-364-7 1B “Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connectors and Sockets I published in January 200 1. NOTE: Because of errors in the headers, please remove pages 2, 4 and A-1 and replace t
2、hem with the new pages 2, 4 and A-1, enclosed. Headers on pages 2, 4 and A-1 are shown as EIA-364-23B but should be EIA-364- 71B. We are sorry for any inconvenience this may have caused. Sincerely, Phil. Cotton Publications Office Technology Strategy see 1.3.2. 2.2.3 If a soldering fluid is added to
3、 the solder bath to lower the surface tension of the solder bath, then the soldering fluid used shall be either water-based or petroleum-based. 2.2.4 The flux used shall be an activated, warm flux of type ROMO (previous designation M A ) flux as found in EWIPC J-STD-004: see 1.3.1. o 3 Test specimen
4、 3.1 Description A test specimen shall consist of a connector or a socket. 3.2 Preparation 3.2.1 The specimen shall be mounted on the PWB with terminals inserted in plated-through holes. / 3.2.2 Right angle connectors shall have their mating areas or surfaces protected to avoid or prevent solder for
5、m splashing on to those areas while passing through the wave. 3.2.3 The bottom surface of the PWB shall be bathed in an activated warm flux; see 2.2.4. 4 Test procedure 4.1 Process and parameters of the test 4.1.1 The specimen and the PWB have been prepared as per 3.2. O Copyright Electronic Compone
6、nts, Assemblies e.g. board thickness, flux, etc.; may produce different results. In the instance where these variables may be significantly different fi-om those specified herein, it is recommended that they be substituted for those as specified in the referencing document. Copyright Electronic Comp
7、onents, Assemblies see 1.3.2. 2.2.3 If a soldering fluid is added to the solder bath to lower the surface tension of the solder bath, then the soldering fluid used shall be either water-based or petroleum-based. 2.2.4 The flux used shall be an activated, warm flux of type ROMO (previous designation
8、RMA) flux as found in EWIPC J-STD-004; see 1.3.1. 3 Test specimen 3.1 Description A test specimen shall consist of a connector or a socket. 3.2 Preparation 3.2.1 The specimen shall be mounted on the PWB with terminals inserted in plated-through holes. 3.2.2 Right angle connectors shall have their ma
9、ting areas or surfaces protected to avoid or prevent solder form splashing on to those areas while passing through the wave. 3.2.3 The bottom surface of the PWB shall be bathed in an activated warm flux; see 2.2.4. 4 Test procedure 4.1 Process and parameters of the test 4.1.1 The specimen and the PW
10、B have been prepared as per 3.2. Copyright Electronic Components, Assemblies the solder wave contact length shall be rom 2.5 cm to 7.6 cm (1 inch to 3 inches). 4.1.3 By a conveyor belt or other suitable means the PWB with its mounted specimen is passed uniformly through a pre-heat zone (such as betw
11、een electric heaters or globar sources) and then continues moving through the wave solder. 4.1.4 When passing through the pre-heat source, the PWB shall have the temperature of its top surface raised uniformly to a minimum of 100 O C f 5 O C (212 O F f 9 OF). 4.1.5 The PWB shall traverse the solder
12、wave immersed at a depth of 1/2 to 2/3 of the PWBs thickness and the wave contact length shall be rom 2.5 cm to 7.6 cm (1 inch to 3 inches). 4.2 Time of exposure to solder wave Time duration, in seconds, of exposure to the solder wave shall be calculated as follows: T = D/S where: T = time, in units
13、 of seconds, for a point on the PWB to traverse the wave. S = speed of PWB travel, in units of distance per second D = solder wave length, in units of distance that are the same as in S. (D is defined as the distance a point on the PWB travels within the solder wave) 4.3 Evaluation of results 4.3.1
14、Visual At the conclusion of the test, the specimens shall be disassembled and examined under 1OX magnification for any solder damage. Solder damage is defined as any solder on the contact mating surface, solder that interferes with the operation of spring pressure mechanisms, or solder that interfer
15、es in any way with the intended mating function of the contact. 4.3.2 Mechanical If the visual examination cannot be made to assess solder wicking, then the connector shall meet the mating and unmating force requirements as specified. Copyright Electronic Components, Assemblies e.g. board thickness,
16、 flux, etc.; may produce different results. In the instance where these variables may be significantly different rom those specified herein, it is recommended that they be substituted for those as specified in the referencing document. Copyright Electronic Components, Assemblies & Materials Associat
17、ion Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 00:15:25 MDTNo reproduction or networking permitted without license from IHS -,-,- Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under lice
18、nse with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 00:15:25 MDTNo reproduction or networking permitted without license from IHS -,-,- EL4 Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, h
19、ealth or technical reasons, please fill in the appropriate information below and mail or FAX to: Electronic Industries Alliance Engineering Department - Publications Office 2500 Wilson Blvd. Arlington, VA 22201 FAX: (703) 907-7501 Document No. Submitters Name: Address : _ Document Title: Telephone N
20、o.: FAX No.: e-mail: Urgency of Change: Immediate: At next revision: u Problem Area: a. Clause Number and/or Drawing: b. Recommended Changes: c. ReasonRationale for Recommendation: Additional Remarks: Signature : Date: FOR EL4 USE ONLY Responsible Committee: Chairman: Date comments forwarded to Comm
21、ittee Chairman: Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 00:15:25 MDTNo reproduction or networking permitted without license from IHS -,-,- Copyright Elec
22、tronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 00:15:25 MDTNo reproduction or networking permitted without license from IHS -,-,- Copyright Electronic Components, Assemblies
23、& Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 00:15:25 MDTNo reproduction or networking permitted without license from IHS -,-,- Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 00:15:25 MDTNo reproduction or networking permitted without license from IHS -,-,-
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