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1、Draft Document Subject To Change i ESD DS5.2-2009 1 Revision and Redesignation of ANSI/ESD STM5.2-1999 2 3 4 5 6 7 8 9 10 11 For Electrostatic Discharge 12 Sensitivity Testing 13 14 Machine Model (MM) 15 Component Level 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Electrostatic Discharge
2、 Association 35 7900 Turin Road, Bldg. 3 36 Rome, NY 13440 37 38 An American National Standard 39 Approved xxxxxxxxx 40 Draft Document Subject To Change ESD DS5.2-2009 41 42 43 44 45 46 47 48 49 50 ESD Association Draft Standard 51 for Electrostatic Discharge Sensitivity Testing 52 53 Machine Model
3、(MM) 54 Component Level 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 Approved xxxxxx 72 ESD Association 73 74 75 76 77 78 Draft Document Subject To Change ESD DS5.2-2009 i Electrostatic Discharge Association (ESDA) standards and publications are designed to serve the 79 public interest by elim
4、inating misunderstandings between manufacturers and purchasers, facilitating 80 the interchangeability and improvement of products and assisting the purchaser in selecting and 81 obtaining the proper product for his particular needs. The existence of such standards and 82 publications shall not in a
5、ny respect preclude any member or non-member of the Association from 83 manufacturing or selling products not conforming to such standards and publications. Nor shall the 84 fact that a standard or publication is published by the Association preclude its voluntary use by non-85 members of the Associ
6、ation whether the document is to be used either domestically or internationally. 86 Recommended standards and publications are adopted by the ESDA in accordance with the ANSI 87 Patent policy. 88 89 Interpretation of ESDA Standards: The interpretation of standards in-so-far as it may relate to a 90
7、specific product or manufacturer is a proper matter for the individual company concerned and cannot 91 be undertaken by any person acting for the ESDA. The ESDA Standards Chairman may make 92 comments limited to an explanation or clarification of the technical language or provisions in a 93 standard
8、, but not related to its application to specific products and manufacterers. No other person is 94 authorized to comment on behalf of the ESDA on any ESDA Standard. 95 96 THE CONTENTS OF ESDAS STANDARDS AND PUBLICATIONS ARE PROVIDED “AS-IS,” AND 97 ESDA MAKES NO REPRESENTATIONS OR WARRANTIES, EXPRES
9、S OR IMPLIED, OF ANY 98 KIND WITH RESPECT TO SUCH CONTENTS. ESDA DISCLAIMS ALL REPRESENTATIONS 99 AND WARRANTIES, INCLUDING WITHOUT LIMITATION, WARRANTIES OF 100 MERCHANTABILITY, FITNESS FOR PARTICULAR PURPOSE OR USE, TITLE AND NON-101 INFRINGEMENT. 102 103 ESDA STANDARDS AND PUBLICATIONS ARE CONSID
10、ERED TECHNICALLY SOUND AT THE 104 TIME THEY ARE APPROVED FOR PUBLICATION. THEY ARE NOT A SUBSTITUTE FOR A 105 PRODUCT SELLERS OR USERS OWN JUDGEMENT WITH RESPECT TO ANY PARTICULAR 106 PRODUCT DISCUSSED, AND ESDA DOES NOT UNDERTAKE TO GUARANTY THE 107 PERFORMANCE OF ANY INDIVIDUAL MANUFACTURERS PRODU
11、CTS BY VIRTUE OF SUCH 108 STANDARDS OR PUBLICATIONS. THUS, ESDA EXPRESSLY DISLAIMS ANY RESPONSIBILITY 109 FOR DAMAGES ARISING FROM THE USE, APPLICATION, OR RELIANCE BY OTHERS ON THE 110 INFORMATION CONTAINED IN THESE STANDARDS OR PUBLICATIONS. 111 112 NEITHER ESDA, NOR ITS MEMBERS, OFFICERS, EMPLOYE
12、ES OR OTHER 113 REPRESENTATIVES WILL BE LIABLE FOR DAMAGES ARISING OUT OF OR IN CONNECTION 114 WITH THE USE OR MISUSE OF ESDA STANDARDS OR PUBLICATIONS, EVEN IF ADVISED OF 115 THE POSSIBILITY THEROF. THIS IS A COMPREHENSIVE LIMITATION OF LIABILITY THAT 116 APPLIES TO ALL DAMAGES OF ANY KIND, INCLUDI
13、NG WITHOUT LIMITATION, LOSS OF 117 DATA, INCOME OR PROFIT, LOSS OF OR DAMAGE TO PROPERTY AND CLAIMS OF THIRD 118 PARTIES. 119 120 121 122 Published by: 123 124 Electrostatic Discharge Association 125 7900 Turin Road, Bldg. 3 126 Rome, NY 13440 127 128 Copyright 2009 by ESD Association 129 All rights
14、 reserved 130 131 No part of this publication may be reproduced in any form, in 132 an electronic retrieval system or otherwise, without the prior 133 written permission of the publisher. 134 135 Printed in the United States of America 136 137 ISBN: 1-58537-165-3 138 CAUTION NOTICE DISCLAIMER OF WAR
15、RANTIES DISCLAIMER OF GUARANTY LIMITATION ON ESDAs LIABILITY Draft Document Subject To Change ESD DS5.2-2009 ii 139 Draft Standards contain information deemed to be of technical value to 140 industry and are published at the request of the Standards Committee 141 without necessarily following the ri
16、gorous public review and resolution of 142 comment which is a procedural part of the development of a Draft 143 Standard. Draft Standards should be reviewed on an annual basis by 144 the formulation Standards Subcommittee and a decision made on 145 whether to proceed to develop a Recommended Standar
17、d on the 146 subject. Draft Standards must be cancelled by the subcommittee and 147 removed from the Standards Catalog before their fifth year of existence. 148 149 Comments and Recommendation: This Draft Standard has been 150 developed by the Standards Committee of the ESD Association. Users 151 of
18、 this draft standard having comments or recommendation for change in 152 this proposed document are encouraged to forward their comments to 153 the Standards Committee Chair at the ESD Association address for 154 discussion at the next meeting of the committee. 155 Draft Standards Draft Document Sub
19、ject To Change ESD DS5.2-2009 i (This foreword is not part of ESD Association Draft Standard ESD DS5.2-2009) 156 157 158 FOREWORD 159 This document defines a method that simulates an electrostatic discharge (ESD) event occurring 160 from a low resistance source. Component damage caused by the machin
20、e model (MM) is often 161 similar to that caused by the human body model (HBM), but occurs at a significantly lower 162 voltage. Other forms of ESD-related component damage, such as that induced by the charged 163 device model (CDM), may result in a different failure signature for some components. 1
21、64 To fully characterize a components electrostatic discharge susceptibility, it should be tested to 165 the following three ESD test standards: 166 Human Body Model 167 Charged Device Model 168 Machine Model 169 Requirements for HBM and CDM testing are contained in the ESD Association Standards 170
22、 ANSI/ESD STM5.1 and ANSI/ESD S5.3.1, respectively. 171 Users of this standard1 should understand that the data obtained when classifying components 172 does not necessarily mean that the components will be unaffected if subjected to a lower level 173 actual ESD. This standard is intended to minimiz
23、e test data correlation problems due to 174 variations between testers. 175 This document was originally designated ESD S5.2-1994 and approved on June 22, 1994. 176 ANSI/ESD STM5.2-1999 was a revision, re-designation of ESD S5.2-1994 and was approved on 177 May 16, 1999. DS5.2-2009 is a revision, re
24、-designation of ANSI/ESD STM5.2-1999 and was 178 approved on XXXXXXXXX. 179 1 ESD Association Standard (S): A precise statement of a set of requirements to be satisfied by a material, product, system or process that also specifies the procedures for determining whether each of the requirements is sa
25、tisfied. Draft Document Subject To Change ESD DS5.2-2009 ii At the time ESD DS5.2-2009 was prepared, the 5.2 Device Testing (MM) Subcommittee had the 180 following members: 181 182 Leo G. Henry, Chair ESD Ph: 315-339-6937; FAX: 315-339-6793; www.esda.org Draft Document Subject To Change ESD DS5.2-20
26、09 2 Shorted I/O Pin. This pin is any I/O pin that is metallically connected (1.0 ohm) on the chip or 322 within the package to another I/O pin (or a set of I/O pins). 323 Spurious Current Pulses. Small machine model (MM) shaped pulses that follow the main pulse 324 and should be less than 15% of lp
27、1 and lpr. 325 Step Stress Test Hardening. A process whereby a component subjected to increasing 326 electrostatic discharge voltage stress is able to withstand higher stress levels than a similar 327 component stressed at a single lower voltage level. 328 329 4.0 PERSONNEL SAFETY 330 The procedures
28、 and equipment described in this document may expose personnel to hazardous 331 electrical conditions. Users of this document are responsible for selecting equipment that 332 complies with applicable laws, regulatory codes and both external and internal policy. Users are 333 cautioned that this docu
29、ment cannot replace or supersede any requirements for personnel safety. 334 Ground fault circuit interrupters (GFCI) and other safety protection should be considered 335 wherever personnel might come into contact with electrical sources. 336 Electrical hazard reduction practices should be exercised
30、and proper grounding instructions for 337 equipment shall be followed. 338 339 5.0 MM ESDS COMPONENT CLASSIFICATION 340 Electrostatic Discharge Sensitive (ESDS) components are classified according to their MM ESD 341 withstand voltage, regardless of polarity. The MM ESDS component classification lev
31、els are 342 shown in Table 1. 343 344 Table 1. MM ESDS Component Classification Levels 345 Class Voltage Range (Volts) M1A 25 M1B 25 to 50 M1C 50 to 100 M2 100 to 200 M3 200 to 400 M4 400 Note : Use the “M” prefix to indicate an MM classification. 346 347 6.0 REQUIRED EQUIPMENT 348 6.1 MM ESD Tester
32、 349 An acceptable tester is composed of equipment meeting the requirements of this standard 350 (schematically represented in Figure 1 and producing pulses meeting the waveform 351 characteristics represented in Figures 2 and 3 and specified in Table 4 and Table 5). 352 353 6.2 Waveform Verificatio
33、n Equipment 354 Equipment capable of verifying the pulse waveforms defined in this standard includes, but is not 355 limited to, an oscilloscope, two evaluation loads and a current transducer. 356 357 Draft Document Subject To Change ESD DS5.2-2009 3 6.2.1 Oscilloscope 358 Oscilloscope requirements:
34、 359 a. Minimum sensitivity of 100 milliamperes per major division (typically 1 cm 0.4 inches) when 360 used in conjunction with the current transducer specified in Section 6.2.3. 361 b. Minimum single shot bandwidth of 350 megahertz. 362 c. Minimum writing rate of one major division per nanosecond.
35、 363 364 6.2.2 Evaluation Loads 365 Two evaluation loads are necessary to verify tester functionality: 366 Load 1: A solid 18 to 24 American Wire Gauge (AWG) (0.81 to 0.21 mm2 cross section) tinned 367 copper shorting wire not longer than 75 mm (3 inches) in length. 368 Load 2: A 500 ohm 1%, 1000 vo
36、lt, low inductance resistor (Caddock Industries type MG 714 or 369 equivalent). 370 The lead length of both evaluation loads should be as short as possible. The wire should span 371 the distance from the reference pin to any other pin on the test socket while passing through the 372 current transduc
37、er. 373 374 6.2.3 Current Transducer 375 Current transducer requirements: 376 a. Minimum bandwidth of 200 megahertz. 377 b. Peak pulse capability of 12 amperes. 378 c. Rise time of less than one nanosecond. 379 d. Capable of accepting at least a solid 24 AWG wire. 380 e. Provide an output voltage pe
38、r milliampere as required in Section 6.2.1.a (usually 1 to 5 381 millivolt per milliampere). 382 A Tektronix CT-2 or equivalent with a maximum cable length of one meter meets these 383 requirements. 384 385 7.0 EQUIPMENT, WAVEFORM AND QUALIFICATION REQUIREMENTS 386 7.1 Equipment Calibration 387 Cali
39、brate all equipment used to evaluate the tester periodically in accordance with the 388 manufacturers recommendation. This includes the oscilloscope, current transducer and high 389 voltage resistor load. Maximum time between calibrations is one year. Calibration shall be 390 traceable to national s
40、tandards, such as the National Institute of Standards and Technology 391 (NIST) in the United States, or international standards. 392 393 7.2 Tester Qualification and Requalification 394 Perform tester qualification procedures as part of the acceptance testing when the ESD tester is 395 delivered. R
41、efer to the manufacturers recommendations for acceptance testing procedures. 396 Perform requalification (in accordance with Section 8.2) following repairs or servicing that could 397 affect the waveform. The maximum time between full requalification tests shall be one year. 398 Retain all waveform
42、records for the life of the tester or for the duration specified by internal record 399 keeping procedures. 400 401 7.3 Test Fixture Board Qualification 402 Perform the test fixture board qualification procedure in accordance with Section 8.3 on all new 403 test fixture boards and any existing board
43、s not previously checked. 404 Draft Document Subject To Change ESD DS5.2-2009 4 The waveform check is required for positive clamp sockets each time the test fixture board is 405 changed. The waveform check is recommended for all other socket types. Refer to Section 8.1 406 for waveform capture proce
44、dures. 407 408 7.4 Daily Tester Functionality Check 409 Verify the ESD tester functionality at least once per shift (Section 8.4). Longer periods between 410 tester checks may be used if no changes in waveforms are observed for several consecutive 411 checks. However, if the waveforms no longer meet
45、 the specified limits, all ESD stress tests 412 subsequent to the previous satisfactory waveform check shall be considered invalid. 413 NOTE : If ESD stress testing is performed on consecutive shifts, tester checks at the end of one shift may 414 also serve as the initial check for the following shi
46、ft. 415 416 8.0 QUALIFICATION AND VERIFICATION PROCEDURES 417 8.1 Waveform Capture Procedure 418 Use the following procedure to verify the waveforms: 419 NOTE : This procedure applies to both single pulse and multiple pulse generation circuits. 420 421 8.1.1 The reference pin pair is defined as the
47、pin pair with the shortest and the longest path to 422 the pulse generation circuit. If the tester has more than one pulse generation circuit, a reference 423 pin pair is defined for each pulse generating circuit. This information is typically supplied by the 424 test fixture board designer or manuf
48、acturer. 425 Alternatively, the reference pin pair(s) previously identified during HBM testing may be used. 426 Refer to ANSI/ESD STM5.1. 427 428 8.1.2 To capture a waveform using a shorting wire, connect the pin with the shortest wiring path 429 to Terminal B, the ground connection. Place the short
49、ing wire through the current transducer, as 430 close to Terminal B as practical, observing the polarity shown in Figure 1. Connect the other end 431 of the wire to the pin to be tested. This pin is referred to as Terminal A. If the tester has more 432 than one pulse generation circuit, every pulse generating circuit is to be tested individually as a 433 Terminal A connection. 434 NOTE: For non-positive clamp sockets, attach the shorting wire to the wiring of the test fixture board 435 between the socket pins connected to Terminals A and B. The connection point
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