ECA-540GAAA-1993.pdf
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1、E I A 5 4 0 G A A A 93 3234600 0550593 142 Reproduced By GLOBAL ENGINEERING DOCUMENTS With ni Permission d EIA Under Royrity Apcmcnt ANSI1 EIA- 540GAAA-19 93 APPROVED: July 26, 1993 I w 0 EIA SP ECI FICATION Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings
2、 for Use in Electronic Equipment EIA-540GAAA ELECTRONIC INDUSTRIES ASSOCIATION ENGINEERING DEPARTMENT Approved For Use In Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03
3、/30/2007 01:43:52 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A 5 Y O G A A A 93 3234600 0550592 O89 i NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchas
4、ers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or non- member of EIA from
5、 manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than EIA members, whether the standard is to be used either domestically or internationally. Recommended Standa
6、rds and Publications are adopted by EIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, EIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Recommended Standard or Publication. Th
7、is EIA Specification is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Specification and the IEC document can be made. This Specification does not purpor
8、t to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Specification to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Stand
9、ards Proposal No. 2751, formulated under the cognizance of EIA CE-3.0 Committee on Sockets) Published by ELECTRONIC INDUSTRIES ASSOCIATION 1993 Engineering Department 2001 Pennsylvania Avenue N.W. Washington, D.C. 20006 PRICE: Please refer to the current Catalog of EIA & JEDEC STANDARDS & ENGINEERIN
10、G PUBLICATIONS or call Global Engineering Documents, USA and Canada (1 -800-854-71 79) International (303-792-21 81) All rights reserved Printed in U.S.A. Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, Use
11、r=Wing, Bernie Not for Resale, 03/30/2007 01:43:52 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A 540GAAA 93 3234b00 0550593 TL5 PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by the EL4 and may not be reproduced without permission Organizations may obtai
12、n permission to reproduce a limited number of copies through entering into a license agreement with the EIA. For information, contact: EIA Engineering Publications Office 2001 Pennsylvania Ave., N.W. Washington, D.C. 20006 (202)457-4963 Copyright Electronic Components, Assemblies & Materials Associa
13、tion Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 01:43:52 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A 540GAAA 93 = 3234600 0550594 951 EIA - 540GAAA Page i Detail Specification for Bum-In S
14、ockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment Information on tbe nvailabiiiy of components qualified to this specification i s given in tbe Qualifd Produds LW L Systems Standards Organiztion ELECTRONIC INDUSTRIES ASSOCIATION GENERIC SPECIFICATION NUMBER E
15、IA-5400000 SOCKETS FOR INTEGRATED CIRCUITS (IC) FOR USE IN ELECTRONIC EQUIPMENT Figure 1 Outline Drawing H Notes (1) Socket illustrated wrth handle actuators. (2) Original dimensions are in inches. Millimeter dimensions are based upon 1.0 inch = 25.4 millimeters. (3) Indicated dimension includes cov
16、er and latching hardware. Socket heighr is defined in 2.2.7. Detail Specification Number EIA-540GAAA Sectional Specification Number EIA-540G000 Blank Detail Specification Number EIA-540GA00 Product Description Sockets for Chip Carrier Packages per EINJEDEC Publication 95, M-094 for use in electronic
17、 equipment. Product Requirements The complete requirements for the socket described herein shall consist of this Detail Specification and the latest issue of EIA-54G Sectional Specification Typical Constniction MATERIALS Contact: Copper Alloy Contact Finish: See 2.2.8 Insulator: Themophstk per 2.6 A
18、ctuator and Insertion Cover: Stainless Steel o r Nickel-Plated Carbon Steel ApplicationlAssessment Level Bum-in Sockets Copyright Electronic Components, Assemblies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/3
19、0/2007 01:43:52 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A 5 4 0 G A A A 93 3234600 0550595 898 EIA - 54OGAAA Page 2 INTRODUCTION THIS DETAIL SPECIFICATION WAS PREPARED BY THE ELECTRONIC I NDUSTRI ES ASSOCIATIONS CE-3.0 SOCKET STANDARDS COMMITTEE 1. SCOPE & OBJEC
20、T 1.1 SCOPE The Burn-In Sockets of assessed quality covered by this Detail Specification shall have: a) Maximum enclosure dimensions that include insertion cover and actuator hardware as illustrated in Figure 1. b) c) 1.2 OBJECT A working voltage not exceeding 125 volts (rms) Current not exceeding 1
21、 ampere per pin The object of this detail specification is to provide all information required for the identification and quality assessment of the Bum-In Sockets for Chip Carrier Packages that are defined by EINJEDEC Publication 95, MO-094. The sockets have solder tail leads. The information contai
22、ned herein or by reference, is complete and sufficient for inspect ion purposes. 2. GENERAL 2.1 RELATED DOCUMENTS The related documents, units, symbols, terminology, standard and preferred values, and markings are prescribed in Section Two of E IA- 5 40G 000. Copyright Electronic Components, Assembl
23、ies & Materials Association Provided by IHS under license with ECA Licensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/30/2007 01:43:52 MDTNo reproduction or networking permitted without license from IHS -,-,- E I A SYOGAAA 93 3234600 0550576 724 (See 2.2.1) Generic Specification
24、 No. (See 2.2.2) Sectional Specification Designator . I - 2.2 EIA PART NUMBERS Each socket covered by this detaif specification has been assigned a discrete part number. The part number consists of: E 5 4 G A 2.2.1 2.2.2 AA xxx Blank Detail Specification Designator (See 2.2.4) Detail Speckation Desi
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