ECA-EIA-540B0AA-A-2001.pdf
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1、ANSI/EIA-54OBOAA-A-200 1 Approved: October 08,2001 EIA SPECIFICATION Detail Specification for Production Ball Grid Array (BGA), High Pin Count (1089 Pins and Greater) Socket for Use in Electronic Equipment EIA-54OBOAA-A (Revision of EIA-540BOAA) OCTOBER 2001 ELECTRONIC COMPONENTS, ASSEMBLIES a) SMT
2、pad size b) SMT pad plating : 0.86 mm +/- 0.05 mm diameter (0.034 in +/- 0.002 in diameter) : Tin-Lead Notes (Plated throuph hole annlication; a) Finished PTH size b) PTH plating : Tin-Lead : 0.86 mm +/- 0.05 mm diameter (0.034 in +/- 0.002 in diameter) Figure 2 - Recommended board pattern Copyright
3、 Electronic Components, Assemblies hock - EIA 364 no. !7 Severity or condition of test Performed on unmounted sockets and devices prior to test for 24 hours at 85“CI 2C (185 “FI 3 O F ) See note 1. 20 mV 100 mA See annex C and note 1. Test cond. A 11.0 ms 3.4m/s (11.3 ft/s) Half sine wave, 18 shocks
4、 total See note 2. 50 g Measurements to be performed Visual examination LLCR Visual examination Nanosecond event detection EIA 364 no. 18 23 Requirements for performance level No damage Record 18 87 No damage 2.0 nanosecond Copyright Electronic Components, Assemblies hock zyclic mmidity EIA 364 no.
5、- 9 - 32 31 Severity or condition Df test 20 mV 100 rnA See annex C and note 1 . 20 cycles total See note 2 20 mV 100 mA See annex C l0c ycles 30 minutes at each temp. extreme -40 “C to +60 “C (-40 “F to +140 OF) 20 mV 100 mA See annex C and note 1 . Test cond.111 except 25 “C to 85 “C (77 “F to 185
6、 OF) 80% I2% RH 25 “C 47% max. RH 85 “C 1000 hours omit subcycle 7a and 7b Cycle duration: 8 h. See annex E. 20 mV 100 mA See annex C and note 1 . deasurements 3 be performed ,LCR visual xamination LLCR Visual 2xamination LLCR Visual examination LLCR measured every 168 h I y rise per contact pair Co
7、pyright Electronic Components, Assemblies hock 32 - 31 Visual 2xamination No damage 10 cycles 30 minutes at each temp. extreme -40 “C to +60 “C (-40 “F to +140 O F ) 400 Vac See note 2 ZP3 ZP4 Dielectric withstanding voltage No flashover breakdown,etc. 100 Vdc See note 2 Insulation :esistanCe 100 me
8、gohms minimum Zyclic iumidity Visual 2xamination No damage Test cond.111 except 25 “C to 85 “C (77 “F to 185 O F ) 80% I 2 % RH 25 “C 47% max. RH 85 “C 1000 hours omit subcycle 7a and b Cycle duration: 8 h. See annex E. 400 Vac See note 2 Dielectric withstanding iroltage No flashover breakdown,etc.
9、100 Vdc See note 2 nsulation resistance 100 megohms minimum VOTES 1. 2. Four unmounted/unmated sockets shall be subjected to the above tests. 25 adjacent contact pairs, randomly chosen, equally dispersed throughout the socket are tested. Copyright Electronic Components, Assemblies ee note 1 Table 1
10、solvents See note 2 Measurements to be performed Visual examination Visual examination I o evidence of deterioration to the socket housing or I NOTE- 1. 2. Two unmounted/unmated samples shall be subjected to the above tests. Four unmounted/unmated samples shall be subjected to the above tests (one c
11、onnector per solution). Copyright Electronic Components, Assemblies hock Jibration 18 ower :ycling Nodamage EIA 364 no. 27 - 28 A3 Severity or condition of test Measurements to be performed 20 mV 100 mA See annex C and note. LLCR Test Cond. A 11.0 ms 3.4m/s (11.3 ft/s) Half sine wave 18 shocks total
12、 See annex D. 50 g Test C0nd.V Test letter B 50 Hz to 2000 Hz 45 minutes/axis, 3 axis total See annex D. 7.3 grms 20 mV 100 mA and note. Visual examination Visual examination LLCR Temperature of socket/ device ranges (68 I 3) O F (203 I 7) O F Test is performed at room ambient. See annex B. 20 mV 10
13、0 mA See annex C and note. (20 I 3) O C to (95 I 5) O C . Visual examination LLCR measured every 168 hours. I y rise per contact pair VOTE-A sufficient number of sockets (minimum of 4) shall be tested to obtain a minimum of 500 daisy-chained data points (1000 contact interfaces) for low-level circui
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