GEIA-GEIA-STD-0005-1-2006.pdf
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1、 GEIA STANDARD Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder GEIA-STD-0005-1 June 2006 GOVERNMENT ELECTRONICS AND INFORMATION TECHNOLOGY ASSOCIATION GEIA-STD-0005-1 ANSI/GEIA-STD-0005-1 Approved: February, 07 2007 Copyright Government Electron
2、ics and was balloted and approved by GEIA G-12 (Solid State Subcommittee) and the GEIA Avionics Process Management Committee This standard is intended to work in concert with GEIA-HB-0005-1, GEIA-HB-0005-2, and GEIA-STD-0005-2. Figure 1 shows a schematic representation of their relationships with ea
3、ch other, and with information about lead-free (Pb-free) electronics from sources external to the AHP industries. This standard may be referenced in proposals, requests for proposals, work statements, contracts, and other aerospace and high performance industry documents. Introduction The European U
4、nion (EU) has enacted two directives; 2002/95/EC Restriction of Hazardous Substances (RoHS) and 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) that restrict or eliminate the use of various substances in a variety of products that are put on the market after July 2006. One of the key mat
5、erials restricted is lead, which is widely used in electronic solder and electronic piece part terminations. These regulations may appear to affect only products for sale in the EU; however, due to the reduced market share of the AHP industries, many of the lower tier suppliers to those industries w
6、ill change their products to serve their primary, non-AHP markets. Additionally, several U.S. states have enacted similar “green” laws and many Asian electronics manufacturers have recently announced completely green product lines. Since AHP is one of the few major industrial sectors that still repa
7、ir Circuit Card Assemblies (CCAs) and the lead-free materials and processes are relatively immature and poorly understood, an aerospace-wide approach to their application is desired. AHP industries products may be in one of a number of stages of the incorporation of Pb-free electronics, including: (
8、1) Products that have been designed and qualified with traditional tin-lead (SnPb) electronic piece parts, materials, and assembly processes, and that will need to be maintained in the SnPb configuration. (2) Products that have been designed and qualified with traditional SnPb electronic piece parts
9、, materials and assembly processes, and have incorporated Pb-free electronic piece parts; (3) Products that have been designed and qualified with SnPb materials, and are incorporating Pb-free materials; (4) New products designed with Pb-free materials. ii Copyright Government Electronics and is inte
10、nded to address issues that are unique to those industries. Some applications may have unique requirements that exceed the scope of this standard, and should be covered separately. 2. Normative References IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. IPC/EIA J-STD-00
11、2, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires. IPC/EIA J-STD-0003, Solderability Tests for Printed Boards. IPC/EIA J-STD-005, Requirements for Soldering Pastes. IPC/EIA J-STD-006, Requirements for Electronic Grade Solder Alloys and Fluxed and Non- Fluxed Solid
12、Solders for Electronic Soldering Applications. IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices. IPC/EIA J-STD-028, Performance Standard for FlipChip/Chip Scale Bumps. IPC/JEDEC J-STD-033, Standard for Handling, Packing, and Shipping
13、and Use of Moisture/Reflow Sensitive Surface Mount Devices. ARINC Project Paper 671: Guidelines for Lead-free Soldering, Repair, and Rework, draft 1, 31 March 2005. GEIA-HB-0005-1, Program Managers Handbook for Managing the Transition to Lead-free Electronics (in draft). 1 This standard was develope
14、d primarily for aerospace products; however, it also may be applicable, at the discretion of the user, to other products with similar characteristics, e.g., low-volume, rugged environments, high reliability, long lifetime, and repairability. Other industries may use this standard by substituting the
15、 name of their industry for the word “aerospace” in this standard. 1 Copyright Government Electronics examples include circuit cards and wire harnesses. Critical item or function, if defective, will result in the systems inability to retain operational capability, meet primary objective, or affect s
16、afety. Customer refers to an entity or organization that (a) integrates a piece part, soldered assembly, unit, or system into a higher level system, (b) operates the higher level system, or (c) certifies the system for use. For example, this may include end item users, integrators, regulatory agenci
17、es, operators, original equipment manufacturers (OEMs), and subcontractors. 2 Copyright Government Electronics Piece parts supplied with solder ball technology; Solder alloys containing bismuth; 7 Copyright Government Electronics and Assure that repair, rework, and maintenance documents issued by th
18、e system design authority are consistent with the design authoritys Plan. Assure that sufficient information is provided to enable the repair and rework facility to use alloys, materials, finishes, and processes that are compatible with the item being repaired or reworked. NOTE 1: AT THE TIME OF PUB
19、LICATION OF THIS STANDARD, THE TIN-SILVER-COPPER (SAC) SYSTEM IS ONE OF THE MORE LIKELY PB-FREE ALLOYS THAT WILL BE USED TO REPLACE SNPB ALLOYS FOR ASSEMBLY OF HIGH-RELIABILITY ELECTRONIC SYSTEMS. BASED ON THE BEST CURRENT TECHNICAL INFORMATION, THE SAC SYSTEM IS A LIKELY ALLOY OF CHOICE FOR REPAIR
20、AND REWORK FACILITIES, AND WITH PROPER UNDERSTANDING AND CONTROL, CAN BE COMPATIBLE WITH SNPB ALLOYS. THEREFORE, IT IS RECOMMENDED THAT EQUIPMENT DESIGNED WITH PB-FREE SOLDER AND FINISHES BE REPARABLE WITH ALLOYS BASED ON THE SAC SYSTEM. USERS OF THIS STANDARD ARE ADVISED TO VERIFY THIS OBSERVATION,
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