GEIA标准 GEIA-STD-0005-3-2008.pdf
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1、 ITAA STANDARD GEIA-STD-0005-3 Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes GEIA-STD-0005-3 June 2008 INFORMATION TECHNOLOGY ASSOCIATION OF AMERICA Copyright Government Electronics it is especially disruptive to aerospace and
2、other industries that produce electronic equipment for high performance applications. These applications, hereinafter described as AHP (Aerospace and High Performance), are characterized by severe or harsh operating environments, long service lifetimes, and high consequences of failure. In many case
3、s, AHP electronics must be repairable at the soldered assembly level. Typically, AHP industry production volumes may be low and, due to low market share, may not be able to resist the change to Pb-free. Furthermore, the reliability tests conducted by suppliers of solder materials, components, and su
4、b-assemblies cannot be assumed to assure reliability in AHP applications. This document provides guidance (and in some cases direction) to designers, manufacturers, and maintainers of AHP electronics in assessing performance of Pb-free interconnections. Over the past several decades, electronics man
5、ufacturers have developed methods to conduct and interpret results from reliability tests for lead-bearing solder alloys. Since these alloys have been used almost universally in all segments of the electronics industry, and since a large body of data, knowledge, and experience has been assembled, th
6、e reliability tests for Pb-bearing solder alloys are well-understood and widely accepted. ii Copyright Government Electronics instead, a number of alloys are being used in various segments of the electronics industry. 2. The physical, chemical, and metallurgical properties of the various Pb-free rep
7、lacement alloys vary significantly. 3. Due to the many sources of solder alloys used in electronic component termination materials or finishes, assembly processes, and repair processes, the potential number of combinations of alloy compositions is nearly unlimited. It is an enormous task to collect
8、data for all these combinations. 4. The test methods developed by other segments (References 1 and 2) are directed toward shorter service lives and more benign environments. Also, there is still a question of suitable dwell times and acceleration factors. (However, the intent of this document is to
9、provide a means of coordinating the information from References 1 and 2 into a basic approach for AHP suppliers.) 5. The data from reliability tests that have been conducted are subject to a variety of interpretations. In view of the above facts, it would be desirable for high-reliability users of P
10、b-free solder alloys to wait until a larger body of data has been collected, and methods for conducting reliability tests and interpreting the results have gained wide acceptance for high-reliability products. In the long run, this will indeed occur. However, the transition to Pb-free solder is well
11、 under way and there is an urgent need for a reliability test method, or set of methods, based on industry consensus. While acknowledging the uncertainties mentioned above, this document provides necessary information for designing and conducting performance tests for aerospace products. In addition
12、, when developing test approaches, the material in question needs to be suitably characterized. Such material properties as ultimate tensile strength, yield strength, Poissons ratio, creep rate, and stress relaxation have been shown to be key attributes in evaluating fatigue characteristics of Pb-fr
13、ee solders. Because of the dynamic nature of the transition to Pb-free electronics, this and other similar documents must be considered provisional. While this document is based on the best information and expertise available, it must be updated as future knowledge and data are obtained. It is publi
14、shed by the Pb-free Electronics in Aerospace Project Working Group, which is sponsored jointly by the Aerospace Industries Association (AIA), the Avionics Maintenance Conference (AMC), and the Government Electronics and Information Technology Association (GEIA). The intent of the document is not to
15、prescribe a certain method, but to aid avionics/defense suppliers in satisfying the reliability and/or performance requirements of GEIA-STD-0005-1 5 as well as support the expectations in GEIA-HB-0005-1 6. Accordingly, it includes 1. a default method for those companies that require a pre-defined ap
16、proach and 2. a protocol for those companies that wish to develop their own test methods. iii Copyright Government Electronics and Products newly-designed with Pb-free solder. For programs that were designed with Tin-Lead solder, and are currently not using any Pb-free solder, the traditional method
17、s may be used. It is important, however, for those programs to have processes in place to maintain the Tin-Lead configuration including those outsourced or manufactured by subcontractors. With respect to products as mentioned above, the methods presented in this document are intended to be applied a
18、t the level of assembly at which soldering occurs, i.e., circuit-card assembly level. 2 References 1. IPC-9701A, “Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments”, IPC, February 2006. 2. IPC/JEDEC-9703, “Testing Methodologies for Solder Joint Reliability
19、in Shock Conditions”, DATE TBD 3. IPC-SM-785, “Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments”, IPC, November 1992. 4. JESD22-B110A, “JEDEC STANDARD Subassembly Mechanical Shock”, November 2004. 5. GEIA-STD-0005-1, Performance Standard for Aerospace and High Perfo
20、rmance Electronic Systems Containing Pb-free Solder. Government Engineering and Information Technology Association, 2006. 6. GEIA-HB-0005-1, Program Management / Systems Engineering Guidelines For Managing The Transition To Pb-free Electronics, 2006 7. GEIA-HB-0005-2, Technical Guidelines for Aerosp
21、ace and High Performance Electronic Systems Containing Pb-free Solder, 2007 8. GEIA-STD-0005-2, Standard for Mitigating the Effects of Tin whiskers in Aerospace and High Performance Electronic Systems. Government Engineering and Information Technology Association, 2006. 9. MIL-STD-810, “DEPARTMENT O
22、F DEFENSE TEST METHOD STANDARD FOR ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS”, revision F, January 1, 2000. 10. MIL-HDBK-217F, “MILITARY HANDBOOK, RELIABILTY OF ELECTRONIC EQUIPMENT”, 2 December 1991. 11. NASA-DoD LFE Test Protocol, 19 September 2007 2 Copyright Government Electr
23、onics the latter dependency including leaded versus leadless configurations. Additional possible dependencies are discussed below. Presently documented values for c are in Annex B. For many lead-free materials, many parameters have not yet been characterized. Many references are available which disc
24、uss the fatigue ductility exponent. Annex B provides a short subset of such references. Annex B also provides properties (e.g., acceleration test parameters, fatigue ductility coefficients, etc.) for presently known materials but the user should be aware that “c” is not yet known for many Pb-free ma
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