GMW-3103-2006.pdf
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1、 WORLDWIDE ENGINEERING STANDARDS General Specification Electrical/Electronic GMW3103 General Specification for Electrical/Electronic Components and Subsystems, Electromagnetic Compatibility Global EMC Component/Subsystem Validation Acceptance Process Copyright 2006 General Motors Corporation All Rig
2、hts Reserved July 2006 Originating Department: North American Engineering Standards Page 1 of 23 1 Introduction Note: In the event of a conflict between the text of this specification and the documents cited herein, the text of this specification takes precedence. Note: Nothing in the specification
3、supersedes applicable laws and regulations unless a specific exemption has been obtained. 1.1 Scope. This document applies to the Electro- magnetic Compatibility (EMC) design, development and validation of electrical/electronic components and subsystems for passenger vehicles, light duty trucks and
4、medium duty trucks. This document is one out of a series of three global EMC documents that specify EMC test and validation requirements. The complete series consists of the following documents: GMW3091, GMW3097 and GMW3103 (All three documents of equal revision carry the same release date). Note: E
5、arlier versions of GMW12003, GMW12004, and GMW3106, have been integrated into GMW3103 for ease of use. 1.2 Mission/Theme. This document specifies the Global Electromagnetic Compatibility Component/Subsystem Validation Acceptance Process to ensure components and subsystems are properly designed, deve
6、loped and validated prior to vehicle validation. 1.3 Classification. Not applicable. 2 References Note: Only the latest approved standards are applicable unless otherwise specified. 2.1 External Standards/Specifications. SAE J1850 2.2 GM Standards/Specifications. GMW3059 GMW3097 GMW3089 GMW3122 GMW3
7、091 2.3 Additional References. Production Part Approval Process (PPAP), Copyright 1993, 1995, Chrysler Corporation, Ford Motor Corporation, General Motors Corporation, ISO Guide 25 and Automotive EMC Lab Recognition Program. 3 Requirements 3.1 Requirements. The Global EMC Component/Subsystem Validat
8、ion Acceptance Process defined within this document shall be followed for all EMC component/subsystem design, development and validation. The Appendix B: EMC Lessons Learned should be reviewed and considered prior to the first electrical design and layout of the product. The Appendix A: Component EM
9、C Test Plan shall be completed by the supplier and submitted in an electronic format to vehicle manufacturer for approval 60 days prior to the start of EMC testing. An editable version of all Appendices can be obtained on request from the applicable vehicle manufacturer EMC department. 3.2 Process.
10、3.2.1 Design, Build, and Validate Design Iteration. The objectives of the Design, Build and Validate Design Iteration phase shown in Figure 1, include component/subsystem design, development and validation. Design validation shall occur during this phase to confirm all Electromagnetic Compatibility
11、technical requirements contained in the Component/Subsystem Technical Specification are met. An EMC Detailed Design Review, shown in Figure 1, should be conducted for all new components and subsystems and applications, and for revisions to existing components and subsystems that could affect Electro
12、magnetic Compatibility compliance. This process does not apply to carryover components or subsystems. The term carryover means that the product qualified for a prior program and is exactly the same product being used for the future program. Modifications, -,-,- GMW3103 GM WORLDWIDE ENGINEERING STAND
13、ARDS Copyright 2006 General Motors Corporation All Rights Reserved Page 2 of 23 July 2006 alterations, internal part swaps, hardware and software changes are not considered carryover and must be validated according to the requirements. Detailed Design Review(s) shall be scheduled and led by the supp
14、lier, and attended by the EMC Design Review Team if the supplier desires EMC design guidance. The vehicle manufacturer Responsible Engineer must be consulted on scheduling and informed of all design review results and supplier action plans. The vehicle manufacturer Responsible Engineers acceptance o
15、f review results and supplier action plans does not relieve the supplier of the obligation to meet contracted performance requirements. The objectives of the Detailed Design Review should be to: Review component/subsystem schematic design and circuit board layout Examine any prior relevant analysis,
16、 calculations and test results Evaluate potential changes to the component/subsystem design Propose solutions to problems and appropriate revalidation Verify that the proposed design and circuit board layout satisfies component/subsystem EMC technical and validation requirements The vehicle manufact
17、urer Responsible Engineer may also schedule a design review on his/her own initiative, or upon the advice of a vehicle manufacturer EMC engineer. The vehicle manufacturer Responsible Engineer may make any appropriate arrangement for leadership of such a review or delegate the actual review activity
18、to other team members. Supplier Deliverables: Documentation required to be delivered, as one package, to vehicle manufacturer EMC design review team at least 10 working days ahead of the scheduled meeting: PCB Layout Components list Hardware Schematic drawing Component placement drawing Functional d
19、escription Interface description EMC math simulation results (if available) EMC test reports (if available) EMC Component Test Plan (Appendix A of GMW3103), in electronic editable format Note: Actual hardware samples or physical mock- up for visual examination is desirable but not required. Electron
20、ic documents must be in an editable format compatible with Microsoft Office. Design Analysis end of EMC, continue to Production Part Approval Process a must. Should: Denotes preferences when specifying alternatives or desired conformance with objectives, standards, etc. Via: A plated thru-hole on a
21、printed circuit board to route a signal between layers. 6.2 Acronyms, Abbreviations, and Symbols. A/D Analog to Digital AC Alternating Current BCI Bulk Current Injection CAN Controller Area Network CE Conducted Transient Emissions CI Conducted Transient Immunity CTS Component Technical Specification
22、 DBCI Differential Bulk Current Injection DC Direct Current DUT Device Under Test DV Design Validation DWCAN Dual Wire CAN EICD Electrical Interface Control Document EMC Electromagnetic Compatibility EMI Electromagnetic Interference ESD Electrostatic Discharge ESR Effective Series Resistance FET Fie
23、ld-Effect Transistor FOT Fiber Optic Transmitter GM General Motors HS High Speed I/O Input/Output IC Integrated Circuit IEC International Electrotechnical Commission ISO International Organization for Standardization ITDC International Technical Development Center LISN Line Impedance Stabilization N
24、etwork LC Inductive/Capacitive LED Light-Emitting Diode LF Low Frequency LS Low Speed MOST A Specific Communication Protocol MOV Metal Oxide Varistor NA North America OTP One Time Programmable PCB Printed Circuit Board PLL Phase Locked Loop -,-,- GM WORLDWIDE ENGINEERING STANDARDS GMW3103 Copyright
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