IEC-62047-4-2008.pdf
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1、 IEC 62047-4 Edition 1.0 2008-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 4: Generic specification for MEMS Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 4: Spcification gnrique pour les MEMS IEC 62047-4:2008 Copyrig
2、ht International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 09/21/2008 19:33:55 MDTNo reproduction or networking permitted without license from IHS -,-,- THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2008 IEC, Geneva, Switzerla
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17、 Fax: +41 22 919 03 00 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 09/21/2008 19:33:55 MDTNo reproduction or networking permitted without license from IHS -,-,- IEC 62047-4 Edition 1.0 2008-08 INTERNATIONAL S
18、TANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 4: Generic specification for MEMS Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 4: Spcification gnrique pour les MEMS INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE IN
19、TERNATIONALE R ICS 31.080.99 PRICE CODE CODE PRIX ISBN 2-8318-9968-0 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=
20、Boeing Co/5910770001 Not for Resale, 09/21/2008 19:33:55 MDTNo reproduction or networking permitted without license from IHS -,-,- 2 62047-4 IEC:2008 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references .5 3 Terms, definitions, units and symbols.6 4 Standard environmental conditions.7 5 Marking 7 5.
21、1 Device identification 7 5.2 Device traceability.7 5.3 Packing .7 6 Quality assessment procedures7 6.1 General.7 6.1.1 Eligibility for qualification and/or capability approval7 6.1.2 Primary stage of manufacture7 6.1.3 Formation of inspection lots.7 6.1.4 Structurally similar device7 6.1.5 Subcontr
22、acting 8 6.1.6 Incorporated components 8 6.1.7 Validity of release8 6.2 Qualification approval procedure .8 6.2.1 Qualification approval testing.8 6.2.2 Environmental and climatic tests .8 6.2.3 Granting of qualification approval 8 6.2.4 Statistical sampling procedures .11 6.2.5 Endurance tests 11 6
23、.2.6 Endurance tests where the failure rate is specified 11 6.2.7 Accelerated test procedures 12 7 Test and measurement procedures.12 7.1 Standard conditions and general precautions 12 7.1.1 Standard conditions.12 7.1.2 General precautions 13 7.1.3 Precision of measurements .13 7.2 Physical examinat
24、ion.13 7.2.1 Visual examination 13 7.2.2 Dimensions .13 7.3 Climatic and mechanical tests .13 7.4 Alternative test methods13 Annex A (normative) Sampling procedures 14 Annex B (informative) Classification for MEMS technologies and devices 15 Bibliography19 Table 1 MEMS categories and terms6 Table 2
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