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1、5 5 4 4 3 3 2 2 1 1 DD CC BB AA CPU SIGNAL DDR3 MEMORY eMMC, SPI NOR FLASH SD CARD, SATA LVDS, HDMI EPCD EXP PORTS CAMERA, EXP PORT SENSORS AUDIO USB EHTERNET JTAG, DEBUG mPCIe CONN AUX SDIO CONN, CAN GPS MODULE AUX VOLT REG Table of Content TITLE PAGE CPU POWER Page 1 Page 2 Page 3 Page 4 Page 5 Pa
2、ge 6 Page 7 Page 8 Page 9 Page 10 Page 11 Page 12 Page 13 Page 14 Page 15 Page 16 Page 17 Page 18 i.MX6 SMART DEVICE SYSTEM X1 Revision History Rev. CodeDateDescription 11/02/2011Rev X1 Draft GENERAL DESIGN NOTES DC Voltage Output: 5VDC - + AC ADAPTER SPECIFICATIONS Outer Diameter: 5.5mm Inner Diame
3、ter: 2.1mm Polarity: Current Output: 5A (depending on application) Page 19 Page 20 Page 21 BATTERY CHARGER PF0100 PMIC BOOT SELECT BUILD OPTION TABLES Page 22 Page 23 PIN MUX TABLEPage 24 COMM CHANNEL STEERING MCIMX6Q-SDB A12/15/2011Release to Prototype Phase AX102/09/12 Draft Rev B Respin: - Change
4、d Audio CODEC to WM8962 per Marketing Request. - Removed two digital microphones. Changed mics to Wolfson WM2730 per Marketing. - Connected NVCC_JTAG rail to GEN_3V3. - Added PFET Switch to SWBST supply to isolate it from System power. - Changed HDMI Media guard to CM2020 IC to correct I2C HDMI issu
5、e. - Changed voltage sides on U9 level shifter. - Changed SW4 to 3.15V output. Moved audio 1.8V to GEN_1V8. - Changed camera 1V5 supply to VGEN2, other 1V5 loads moved to VGEN1. - Added isolation PFETs to Audio voltage supplies. - Switched USB_OTG_ID to pin ENET_RX_ER, USBOTG_OC to pin EIM2 and USBH
6、1_OC to pin EIM_D30 to match pinmux functionality. - Added parallel termination resistors to PCIe differential clock traces. - Added next generation DEVSLP option for SATA connection. - Moved DISP0_PWR_EN to NANDF_WP_B to correct pull up voltage issue. - Deleted auxiliary 3.15V voltage regulator. -
7、Designated several capacitors on processor core power rails as DNP. Validation proved unnecessary. - Moved I2C3 SDA from GPIO_16. This pin must be unconnected for Ethernet 1588 (time stamp) functionality to work. - Added shield ground pins to LVDS connectors. - Changed extrnal speaker capacitors to
8、higher voltage rating. - Changed external regulator to supply 3.0V power to VSNVS. - Changed PF0100 microprocessor program circuit to DNP. - Added 5V supply to LCD expansion headers. - Connected HPOUTFB directly to Audio GND. - Connected VDDOTP to ground to boot PMIC from program settings. - Added i
9、solation to prevent back powering board from USB when no battery present. - Back annotated Schematic to Layout. REFDES may have changed from Rev A. - Populated optional “PWRON“ button circuit for use with Android. - Removed write protect on NOR Flash. - Removed LC filter circuit from external speake
10、rs. - Added an additional 2 100uF capacitors to MPCIE_3V3 next to connector. - Updated Power Rail, IOMUX, and Configuration Tables. TEMPORARY DEVIATIONSPage 25 Release to Production - Depopulated Q512 because of schematic error. - Cut trace to U12 pin 5 to prevent false USB plug in detects. - Added
11、schematic page to detail applicable board TDAs that affect Rev B boards. - Populating CAN components U517 and U518 per Marketing Request. - Added resistor RX1 across pads for C55 to improve 24MHz clock stability. - Pull up resistors R629 and R639 have been changed to DNP. - Changed Marketing part nu
12、mber to MCIMX6Q-SDB - Changed R7 and R112 to DNP - Changed C540 to “POPULATED“ B205/04/12 Release to Production - Depopulated following pull up/down resistors on VSNVS domain to reduce current requirements: R31, R108, R585 - Updated board per configuration table on Page 23 02/24/12B B305/25/12 - Cha
13、nged DDR3 Memory to new 1.35V capable memory MT41K128M16JT. - Changed C540 to 1.0 uF per Wolfson recommendation. - Changed R183 and R189 to 2.37K pull ups to bring I2C rise time into specification. B407/18/12 - Removed buffers U500 and U520 from digital microphone data outputs. A note is added to sh
14、ow required hand wire modification. - The Battery Charge Done LED is disconnected and R522 is depopulated. New parts RX2, CX1 and UX1 are added. Traces show required hand modifications. - Optional Power On Circuit has been disabled and U511 and R578 are now DNP. A new Diode DX1 has been added to all
15、ow EIM_D29 to sense a button press. - RESET button SW2 now connects to the PWRON pin of the PMIC. - Added 10K pull down resistor RX3 to SDCKE0 trace. - SIM Card Connector CON1 is now populated by default. - Changed resistors R174 and R176 and to depopulated by default. LVDS0 EDID will not be connect
16、ed to I2C2 channel unless needed. 1. Unless Otherwise Specified: All resistors are in ohms, 5%, 1/16 Watt All capacitors are in uF, 20%, 50V All voltages are DC All polarized capacitors are Tantalum 3. Interrupted lines coded with the same letter or letter combinations are electrically connected. 4.
17、 Device type number is for reference only. The number varies with the manufacturer. 5. Special signal usage: _B or n Denotes - Active-Low Signal HIGH within electric specification. If using a CODEC other than the one used in this design, it may be possbile to switch pull up resistors back to 4.7K. I
18、2C3_SDA I2C3_SDA I2C3_SDA I2C3_SCL I2C3_SCL I2C3_SCL GEN_3V3GEN_3V3GEN_1V8 GEN_1V8GEN_3V3GEN_3V3 I2C1_SCL 3 I2C1_SDA 3 CSI0_SCL 8 CSI0_SDA 8 I2C2_SCL 3 I2C2_SDA 3 MIPI_I2C_SCL 8 MIPI_I2C_SDA 8 I2C3_SDA 3 I2C3_SCL 3 LVDS1_EDID_SCL 7 LVDS1_EDID_SDA 7 LVDS1_TOUCH_SCL7 LVDS1_TOUCH_SDA7 LVDS0_EDID_SCL7 L
19、VDS0_EDID_SDA 7 LVDS0_TOUCH_SCL7 LVDS0_TOUCH_SDA7 HDMI_DDC_CLK_IN7 HDMI_DDC_DAT_IN7 LCD_I2C_SCL 9 LCD_I2C_SDA 9 EPDC_I2C3_SCL 9 EPDC_I2C3_SDA 9 CODEC_I2C_CLK10 CODEC_I2C_DAT 10 TS_SCL 9 TS_SDA 9 ACC_SCK 14 ACC_SDA 14 DEC_SDA 14 DEC_SCK 14 ALS_SCK 14 ALS_SDA 14 BAR_SCK 14 BAR_SDA 14 PCIe_SMB_CLK 16 P
20、CIe_SMB_DATA 16 CSPI1_MOSI 3 CSPI1_CLK 3 CSPI1_CS0 3 SPINOR_MISO 5 SPINOR_CLK 5 SPINOR_MOSI 5 SPINOR_CS0 5 CSPI1_MISO 3 EPDC_MISO 9 EPDC_CSP1_CLK9EPDC_MOSI 9 EPDC_CS0 9 PMIC_SCL 20 PMIC_SDA 20 CSI2_SDA 8 CSI2_SCL 8 Drawing Title: SizeDocument NumberRev Date:Sheetof Page Title: ICAP Classification:FC
21、P:FIUO:PUBI: SOURCE:SCH-27516 PDF:SPF-27516C2 MCIMX6Q-SMART DEVICE BOARD C Friday, November 09, 2012 COMM CHANNEL STEERING 2225 _ X _ Drawing Title: SizeDocument NumberRev Date:Sheetof Page Title: ICAP Classification:FCP:FIUO:PUBI: SOURCE:SCH-27516 PDF:SPF-27516C2 MCIMX6Q-SMART DEVICE BOARD C Friday
22、, November 09, 2012 COMM CHANNEL STEERING 2225 _ X _ Drawing Title: SizeDocument NumberRev Date:Sheetof Page Title: ICAP Classification:FCP:FIUO:PUBI: SOURCE:SCH-27516 PDF:SPF-27516C2 MCIMX6Q-SMART DEVICE BOARD C Friday, November 09, 2012 COMM CHANNEL STEERING 2225 _ X _ R1540 R630 R110 R1530 R1880
23、DNP R710 R1820 R189 2.37K R120 R2040 R1810 R2050 A B R5900 R5170 R1930 R2000 R5210 R2020 R390 R169 4.7K A B R5860 R1870 R1980 A B R1730DNP R2030 R5500 R183 2.37K A B R1760 DNP A B R5840 R170 4.7K A B R1770 R178 4.7K A B R1750DNP A B R5830 R6220 R179 4.7K R5800 R3060 R1170 R6210 A B R1740 DNP R230 R1
24、160 A B R1720 R530 R1900 DNP 5 5 4 4 3 3 2 2 1 1 DD CC BB AA Build Option: MCIMX6Q-SDP MCIMX6DL-SDP Build Option: MCIMX6Q-SDB Extra Bulk Capacitors not populated: C39, C54, C68, C606, C607, C608, C609, C610, C611, C612, C673, C681 3. BlueTooth Connector Isolation Resistors: R209, R210, R211, R212, R
25、213, R214, R215 4. Extra Bulk Capacitors not populated: C39, C54, C68, C606, C607, C608, C609, C610, C611, C612, C673, C681 10. BlueTooth Connector Isolation Resistors: R209, R210, R211, R212, R213, R214, R215 9. 4. 5. 6.EPDC Port Connector not populated: J508 7. Audio Block Components not populated
26、: C1, C128, C558, R569, R573, U501, U510, U521 8. Ambient Light Sensor not populated: C108, R184, R185, R188, R190, R191, U17 GPS Module not populated: C115, C118, C764, C765, J12, L22, L23, Q516, Q517, Q518, Q519, R186, R192, R194, R664, R668, R669, R671, R672, R673, U19 1. 1. CAN Output not popula
27、ted: J10 2.OverVoltage Protection circuit not populated: (OverVoltage Protection provided by battery charge ICs) D5, D500, D501, D502, D503, J501, Q1, Q6, Q503, R1, R2, R3, R303, R500, R505, R520, R524, SW3 2. Battery Charging circuit not populated: C507, C508, C510, C511, C512, C513, C514, C515, C5
28、17, C518, C520, C521, C526, C527, C528, C529, CON2, CON3, L502, L503, R512, R513, R514, R515, R516, R518, R519, R527, R528, R530, R531, R532, R533, R534, R535, R536, R537, R538, R539, R542, R565, R577, R729, RT500, RT501, U502, U503 3.SPI NOR Flash not populated: C83, R149, R643, R646, U14 MIPI Disp
29、lay/Camera Expansion Ports not populated: C28, C29, C30, C50, C116, C117, C123, C124, C585, C587, C588, C602, J11, J5, L25, R26, R165, R173, R175, R726, U10 CAN Output not populated: J10 Drawing Title: SizeDocument NumberRev Date:Sheetof Page Title: ICAP Classification:FCP:FIUO:PUBI: SOURCE:SCH-2751
30、6 PDF:SPF-27516C2 MCIMX6Q-SMART DEVICE BOARD C Friday, November 09, 2012 BUILD OPTON TABLES 2325 _ X _ Drawing Title: SizeDocument NumberRev Date:Sheetof Page Title: ICAP Classification:FCP:FIUO:PUBI: SOURCE:SCH-27516 PDF:SPF-27516C2 MCIMX6Q-SMART DEVICE BOARD C Friday, November 09, 2012 BUILD OPTON
31、 TABLES 2325 _ X _ Drawing Title: SizeDocument NumberRev Date:Sheetof Page Title: ICAP Classification:FCP:FIUO:PUBI: SOURCE:SCH-27516 PDF:SPF-27516C2 MCIMX6Q-SMART DEVICE BOARD C Friday, November 09, 2012 BUILD OPTON TABLES 2325 _ X _ 5 5 4 4 3 3 2 2 1 1 DD CC BB AA PIN MUX TABLES Drawing Title: Siz
32、eDocument NumberRev Date:Sheetof Page Title: ICAP Classification:FCP:FIUO:PUBI: SOURCE:SCH-27516 PDF:SPF-27516C2 MCIMX6Q-SMART DEVICE BOARD C Friday, November 09, 2012 PIN MUX TABLE 2425 _ X _ Drawing Title: SizeDocument NumberRev Date:Sheetof Page Title: ICAP Classification:FCP:FIUO:PUBI: SOURCE:SC
33、H-27516 PDF:SPF-27516C2 MCIMX6Q-SMART DEVICE BOARD C Friday, November 09, 2012 PIN MUX TABLE 2425 _ X _ Drawing Title: SizeDocument NumberRev Date:Sheetof Page Title: ICAP Classification:FCP:FIUO:PUBI: SOURCE:SCH-27516 PDF:SPF-27516C2 MCIMX6Q-SMART DEVICE BOARD C Friday, November 09, 2012 PIN MUX TA
34、BLE 2425 _ X _ 5 5 4 4 3 3 2 2 1 1 DD CC BB AA REV: Change:Reference Defect Number: B4Removed buffers U500 and U520 from digital microphone data outputs.ENGR00181056 ENGR00211969 B4The Battery Charge Done LED is disconnected and R522 is depopulated. New parts RX2, CX1 and UX1 are added. Traces show
35、required hand modifications. ENGR00211943 B4Optional Power On Circuit has been disabled and U511 and R578 are now DNP. A new Diode DX1 has been added to allow EIM_D29 to sense a button ENGR00181039 ENGR00211948 B4RESET button SW2 now connects to The PWRON pin of The PMIC.ENGR00211979 B4Added 10K pul
36、l down resistor RX3 to SDCKE0 trace.ENGR00211962 B4SIM Card Connector CON1 is now populated by default.ENGR00224087 B4Battery Connector Header CON3 is now populated by default.ENGR00224089 B4Changed resistors R174 and R176 and to depopulated by default. LVDS0 EDID will not be connected to I2C2 chann
37、el unless needed. ENGR00211965 B4Replaced digital microphones with Analog Devices ADMP421.ENGR00211964 B4Disabled USR_DEF_GRN_LED circuit. Configured GPIO_1 for WDOG_B output.ENGR00211973 CQ512 is Changed to populated.ENGR00211943 COptional Start Up Circuit has been modified.ENGR00181039 CPMIC Progr
38、amming MicroProcessor is removed.ENGR00224090 CAdd DNP Input to U13 buffer for USB_OTG_PWR_EN. Buffer now powered from GEN_3V3. ENGR00319341 CFA_ANA and VDD_FA signals now connected to ground.ENGR00213511 CAdded resistor options to EIM_DA7 trace to EPD connector.ENGR00181054 ENGR00211953 CConnected
39、EIM_DA9 to EPDC Connector J508 to supply SDCE5 if needed.ENGR00213510 COptional LDO U9 is now depopulated.ENGR00224091 CAdded Connector J13 to support BT from SDIO Card. Connector is isolated by DNP resistors on Rev C boards. ENGR00181035 ENGR00211946 CAdded GPIO control of Battery Charge Enable pin
40、s.ENGR00217643 CChanged C594 to 0.22uF, changed C31 to 47uF, added C555 as second 22uF capacitor in parallel with C546, changed C561, C562, C586 and C596 to 0.47uF. Changes made per recommendation of MMPF0100NPEP team. ENGR00224093 CAdded additional 47uF bulk capacitor C769 to SD2 socket VDD supply.
41、ENGR00224094 CAdded option to route HDMI DDC comms seperate from I2C2 comms channel.ENGR00215026 CC597 populated to provide debounce to RESET circuit.ENGR00224095 CDepopulated C68, C612. Populated C682, C716 closer to pins.ENGR00224096 CDepopulated C39, C606, C607, C608, C609, C610, C673 and C681.EN
42、GR00224097 CAdded DNP R302 to provide alternate 5V supply path to USB_H1_VBUS.ENGR00224098 CAdded DNP R632 to provide alternate gating of PMIC_5V source (tied to VDDSOC). ENGR00224098 CAdded DNP L25 and L26 to provide alternate 2.8V supply path to camera modules. ENGR00224099 CAdded TP31, TP32, TP50
43、9, and TP510 to bring out third data lane for both LVDS0 and LVDS1. ENGR00214325 ENGR00214502 CChange blocking capacitors C6 and C7 to Zero Ohm resistors R307 and R308. PCIe specification requires blocking capacitors to be on transmit side of ENGR00226040 C2Depopulate L10 and L17. Move Ferrite beads
44、 to L25 and L26ENGR00231769 TDA 4100 TDA 4112 TDA 4136 1. Digital microphone ANALOG DEVICES ADMP421 was used in place of WOLFSON WM7230 due to supply shortage. Affects U500 and U520. Replaced TDA 4100 1. Digital microphone ANALOG DEVICES ADMP421 was used in place of WOLFSON WM7230 due to supply shor
45、tage. Affects U500 and U520. 2. Q512 was depopulated due to schematic mistake. Removes battery charge from USB option. 3. Depopulate R30 on MCIMX6DL-SD boards only. i.MX6DL Processor configured for Smart PMIC mode. Not compatible with board design. Removes SW ability to shutdown the board. 1. Solder
46、 a 0402 2.2M Ohm resistor across pins of C55. Some i.MX6Q Processors require this resistor to stabalize the 24MHz crystal circuit, in order to start up within the required time interval. TDA 4221 (6DL) / TDA 4222 (6Q) 1. Schematic revision B3 changed DDR3 memory to MT41K128M16JT-125:K. Due to unavai
47、lability of new part, this TDA autorizes the continued use of MT41J128M16HA-15. 2. Change C540 to 1.0uF capacitor. 3. Change resistors R183 and R189 to 2.37K Ohm resistors. TDA 4275 1. Remove buffers U500 and U520 from digital Microphone data signal. Replace with hand wire mod. 2. Add WDOG_B reset c
48、apability (UX1, RX2, CX1). 3. Add diode DX1 to EIM_D19 to allow GPIO sense of power button press. 4.Change RESET button press to connect to PMIC PWRON pin. RESET press now causes global reset. 5. Add 10K pull down resistor RX3 to SDCKE0 pin. 6. Depopulate Resistors R174 and R176 to disconnect LVDS0
49、EDID from I2C2 communications channel. 7. Populate Battery Conector Header CON3. 8. Populate SIM Card Connector CON1. 9. Remove U1 from BOM (in preparation for next revision MX 6 silicon). 10. On MCIMX6DL-SDP boards, populate resistor R30 with 1K Ohm resistor. CHANGE REVISION DEFECT TRACKING HISTORY OF TEMPORARY DEVIATIONS TDA 4425 1. Depopulate ferrite beads L10 and L17. 2. Populate ferrite beads L25 and L26 (wih Murata BLM18PG121SH1). Drawing Title: SizeDocument NumberRev Date:Sheetof Page Title: ICAP Classification:FCP:
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