IEC-61188-5-4-2007.pdf
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1、 IEC 61188-5-4 Edition 1.0 2007-10 INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-4: Attachment (land/joint) considerations Components with J leads on two sides IEC 61188-5-4:2007(E) -,-,- THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, S
2、witzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the co
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4、Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical conte
5、nt of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. ? Catalogue of IEC publications: www.iec.ch/searchpub The IEC on-line Catalogue enables you to search by a variety of criteria (
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9、Edition 1.0 2007-10 INTERNATIONAL STANDARD Printed boards and printed board assemblies Design and use Part 5-4: Attachment (land/joint) considerations Components with J leads on two sides INTERNATIONAL ELECTROTECHNICAL COMMISSION P ICS 31.180 PRICE CODE ISBN 2-8318-9341-0 2 61188-5-4 IEC:2007(E) CON
10、TENTS FOREWORD.3 INTRODUCTION.5 1 Scope.6 2 Normative references .6 3 General information6 3.1 General component description .6 3.2 Marking .7 3.3 Packaging .7 3.4 Process considerations .7 4 Small outlined J packages (SOJ)7 4.1 Component description7 4.2 Component dimensions .8 4.3 Solder joint fil
11、let design .9 4.4 Land pattern dimensions .11 Bibliography15 Figure 1 SOJ construction8 Figure 2 SOJ component dimensions.9 Figure 3 Solder joint fillet design11 Figure 4 SOJ land pattern dimensions .14 61188-5-4 IEC:2007(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARDS AND PRINTED BO
12、ARD ASSEMBLIES DESIGN AND USE Part 5-4: Attachment (land/joint) considerations Components with J leads on two sides FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Commit
13、tees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Availab
14、le Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental orga
15、nizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical
16、matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC Nat
17、ional Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity,
18、 IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC pr
19、ovides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, empl
20、oyees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of th
21、e publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the
22、possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61188-5-4 has been prepared by IEC technical committee 91: Electronics assembly technology Th
23、e text of this standard is based on the following documents: FDIS Report on voting 91/703/FDIS 91/735/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/I
24、EC Directives, Part 2. A list of all parts of the IEC 61188 series, under the general title Printed boards and printed board assemblies Design and use, can be found on the IEC website. 4 61188-5-4 IEC:2007(E) The committee has decided that the contents of this publication will remain unchanged until
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