IEC-60191-6-2-2001.pdf
《IEC-60191-6-2-2001.pdf》由会员分享,可在线阅读,更多相关《IEC-60191-6-2-2001.pdf(20页珍藏版)》请在三一文库上搜索。
1、CE1 601 91 -6-2 (Premire dition - 2001) IEC 60191-6-2 (First edition - 2001) Normalisation mcanique des dispositifs semiconducteurs - Partie 6-2: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface - Guide de conception pour les botiers
2、broches en forme de billes et de colonnes, avec des pas de I, 50 mm, I, 27 mm et I, O0 mm Publication monolingue (anglais) Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design g
3、uide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages C O R R I G E N D U M 1 Pages5and8 Clause 4 and clause 5 Reference characters and drawings Replace the existing two figures by the following: Copyright International Electrotechnical Commission Provided by IHS under licens
4、e with IECLicensee=IHS Employees/1111111001, User=listmgr, listmgr Not for Resale, 03/06/2007 06:12:38 MSTNo reproduction or networking permitted without license from IHS -,-,- Terminal index area a 00000000000000 00000000000000 000000000000000 000000000000000 1 2 3 1 IEC 2699/01 Copyright Internati
5、onal Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=listmgr, listmgr Not for Resale, 03/06/2007 06:12:38 MSTNo reproduction or networking permitted without license from IHS -,-,- / 0000000 00 00 0 0 o o 9 o o o o 00 o 0 0 0 o 1 2 3 1 Il 1 $0
6、000 O O . 0000000000000000 0000000000000000 0000000000000000 0000000000000000 0000000000000000 00l00 000 0 00 op o o o o 0 o 000000000000003t.hti) enables you to search by a variety of criteria including text searches, technical committees and date of publication. On-line information is also availab
7、le on recently issued publications, withdrawn and replaced publications, as well as corrigenda. IEC Just Published This summary of recently issued publications (www-=i_,c!-L-.rn) is also available by email. Please contact the Customer Service Centre (see below) for further information. Customer Serv
8、ice Centre If you have any questions regarding this publication or need further assistance, please contact the Customer Service Centre: Email: eusfserv.iec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 O0 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicense
9、e=IHS Employees/1111111001, User=listmgr, listmgr Not for Resale, 03/06/2007 06:12:38 MSTNo reproduction or networking permitted without license from IHS -,-,- INTERNATIONAL STANDARD IEC 60191 -6-2 First edition 2001 -1 2 Mechanical standardization of semiconductor devices - Part 6-2: General rules
10、for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages Normalisation mcanique des dispositifs semiconducteurs - Partie 6-2: Rgles gnrales pour la prparation des dessins dencombre
11、ment des dispositifs semiconducteurs pour montage en surface - Guide de conception pour les botiers broches en forme de billes et de colonnes, avec des pas de 1,50 mm, 1,27 mm et 1,OO mm O IEC 2001 - Copyright - all rights reserved No pari of this publication may be reproduced or utilized in any for
12、m or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission Telefax: +41 22 91 9 0300 3, rue de Varemb Geneva, Switzerland IEC web site http:/www.iec.ch e-mail: inmailiec.ch Commission
13、Electrotechnique Internationale PRICECODE E International Electrotechnical Commission M e m n v H a p o n H a R K T P O T X H H C H R HOMHCCMR For price, see current catalogue O Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/111111100
14、1, User=listmgr, listmgr Not for Resale, 03/06/2007 06:12:38 MSTNo reproduction or networking permitted without license from IHS -,-,- - 2 - 60191-6-2 O IEC:2001(E) 47D1460lIFDIS INTERNATIONAL ELECTROTECHNICAL COMMISSION 47D1471lRVD MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - Part 6-2: Gen
15、eral rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages FOREWORD The IEC (International Electrotechnical Commission) is a worldwide organization for standardization com
16、prising all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes Internati
17、onal Standards. Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation.
18、 The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consens
19、us of opinion on the relevant subjects since each technical committee has representation from all interested National Committees. The documents produced have the form of recommendations for international use and are published in the form of standards, technical specifications, technical reports or g
20、uides and they are accepted by the National Committees in that sense. In order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between th
21、e IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter. The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. Attention is drawn
22、to the possibility that some of the elements of this International Standard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-2 has been prepared by subcommittee SC 47D: Mechanical standardizat
23、ion of semiconductor devices, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: I FDIS I Report on voting I Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above
24、table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 3. The committee has decided that the contents of this publication will remain unchanged until 2004. At this date, the publication will be reconfirmed ; withdrawn; amended. replaced by a revised edition, or Copy
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- IEC 60191 2001
链接地址:https://www.31doc.com/p-3769265.html