IEC-PAS-62596-2009.pdf
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1、 IEC/PAS 62596 Edition 1.0 2009-01 PUBLICLY AVAILABLE SPECIFICATION PRE-STANDARD Electrotechnical products Determination of restricted substances Sampling procedure Guidelines IEC/PAS 62596:2009(E) Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=HP
2、Monitoring/1111111164 Not for Resale, 02/02/2009 02:13:48 MSTNo reproduction or networking permitted without license from IHS -,-,- THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2009 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be repr
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9、us your feedback on this publication or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=HP Monitoring/
10、1111111164 Not for Resale, 02/02/2009 02:13:48 MSTNo reproduction or networking permitted without license from IHS -,-,- IEC/PAS 62596 Edition 1.0 2009-01 PUBLICLY AVAILABLE SPECIFICATION PRE-STANDARD Electrotechnical products Determination of restricted substances Sampling procedure Guidelines INTE
11、RNATIONAL ELECTROTECHNICAL COMMISSION XA ICS13.020, 43.040.10 PRICE CODE ISBN 2-8318-1019-4 Registered trademark of the International Electrotechnical Commission Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=HP Monitoring/1111111164 Not for Resale
12、, 02/02/2009 02:13:48 MSTNo reproduction or networking permitted without license from IHS -,-,- 2 PAS 62596 IEC:2009(E) CONTENTS FOREWORD.4 INTRODUCTION.5 1 Scope.6 2 Normative references .6 3 Terms, definitions and abbreviations 6 3.1 Terms and definitions6 3.2 Abbreviations 8 4 Introduction to sam
13、pling .9 4.1 Introductory remark .9 4.2 Requirements and concerns for restricted substances.9 4.3 Complexity of electrotechnical products and related challenges 10 4.4 Strategies for sampling11 5 Sampling 13 5.1 Introductory remark .13 5.2 Partial disassembly .13 5.2.1 Example 1: Cell phone type A D
14、isassembly without tools14 5.2.2 Example 2: Cell phone type B Partial disassembly.15 5.3 Complete disassembly.16 5.4 Partial disjointment18 5.4.1 Introductory remark .18 5.5 Complete disjointment.20 5.5.1 Introductory remark .20 5.5.2 Typical examples of disjointment at the component level.20 5.5.3
15、Examples of disjointment at the base materials level Disjointment of integrated circuit (IC) chips22 5.6 Considerations of sampling and disjointment.25 5.6.1 Introductory remark .25 5.6.2 Sample size required.25 5.6.3 Sample size v. detection limit 26 5.6.4 Composite testing of disjointable samples
16、.27 5.6.5 Non-uniform “homogeneous materials” 28 5.6.6 Determination of sampling position of homogeneous materials 29 6 Conclusions and recommendations 29 Annex A (informative) Examples of procedures for sampling and disjointment .30 Annex B (informative) Probability of presence of restricted substa
17、nces40 Annex C (informative) Composite testing and sampling42 Annex D (informative) Tools used in sampling .44 Annex E (informative) Use of XRF screening techniques in sampling.45 Bibliography54 Figure 1 Generic iterative procedure for sampling11 Figure 2 Cell phone with battery charger and camera l
18、ens cap.14 Figure 3 Cell Phone with battery and back cover removed .15 Figure 4 Partial disassembly of a cell phone (type B) into its major components 16 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=HP Monitoring/1111111164 Not for Resale, 02/02/
19、2009 02:13:48 MSTNo reproduction or networking permitted without license from IHS -,-,- PAS 62596 IEC:2009(E) 3 Figure 5 Complete disassembly of the key pad 17 Figure 6 Complete disassembly of the bottom housing.17 Figure 7 Complete disassembly of the other housing/frame .18 Figure 8 Components of t
20、he TFT display of the cell phone after partial disjointment.19 Figure 9 Components of the main PWB of the cell phone after partial disjointment 19 Figure 10 Disjointment of lead frame component22 Figure 11 BGA package prior to disjointment .23 Figure 12 BGA package disjointed by the hand removal pro
21、cedure 23 Figure 13 Solder ball material collected from BGA using a hand removal procedure 24 Figure 14 BGA solder ball removal using the ball shear procedure.24 Figure 15 Cross-section of a 900 m wide lead oxide-based resistor (SMD) 28 Figure A.1 Example of methodology for sampling and disjointment
22、 31 Figure A.2 Methodology for sampling and disjointment.32 Figure A.3 Sampling of DVD player33 Figure A.4 Sampling of CRT 34 Figure A.5 Sampling of LCD TV .35 Figure A.6 Sampling of PDA/phone36 Figure A.7 Sampling of desk fan 37 Figure A.8 Compoments Example 1 thick film resistor38 Figure D.1 Hot g
23、as gun for removing the electronic components44 Figure D.2 Vacuum pin to remove the target electronic devices .44 Figure E.1 AC power cord, X-ray spectra of sampled sections .47 Figure E.2 RS232 cable and its X-ray spectra48 Figure E.3 Cell phone charger shown partially disassembled. 48 Figure E.4 P
24、WB and cable of cell phone charger .49 Figure E.5 Spots from 1,27 mm and 0,3 mm collimaters.50 Figure E.6 Examples of substance mapping on PWBs .52 Figure E.7 SEM-EDX image of Pb free solder with small intrusions of Pb (size = 30 m).53 Table 1 Possible restricted or screening substances from a cell
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