IEC-PAS-62588-2008.pdf
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1、 IEC/PAS 62588 Edition 1.0 2008-09 PUBLICLY AVAILABLE SPECIFICATION Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes IEC/PAS 62588:2008(E) Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co
2、/5910770001 Not for Resale, 10/25/2008 03:32:02 MDTNo reproduction or networking permitted without license from IHS -,-,- THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2008 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or
3、utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining addi
4、tional rights to this publication, please contact the address below or your local IEC member National Committee for further information. IEC Central Office 3, rue de Varemb CH-1211 Geneva 20 Switzerland Email: inmailiec.ch Web: www.iec.ch About the IEC The International Electrotechnical Commission (
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7、publications. ? IEC Just Published: www.iec.ch/online_news/justpub Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available on-line and also by email. ? Electropedia: www.electropedia.org The worlds leading online dictionary of electr
8、onic and electrical terms containing more than 20 000 terms and definitions in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical Vocabulary online. ? Customer Service Centre: www.iec.ch/webstore/custserv If you wish to give us your fe
9、edback on this publication or need further assistance, please visit the Customer Service Centre FAQ or contact us: Email: csciec.ch Tel.: +41 22 919 02 11 Fax: +41 22 919 03 00 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not
10、 for Resale, 10/25/2008 03:32:02 MDTNo reproduction or networking permitted without license from IHS -,-,- IEC/PAS 62588 Edition 1.0 2008-09 PUBLICLY AVAILABLE SPECIFICATION Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes INTERNATIONAL ELECTROTEC
11、HNICAL COMMISSION P ICS 31.190 PRICE CODE ISBN 2-8318-9989-3 Registered trademark of the International Electrotechnical Commission Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:32:02 MDTNo reprodu
12、ction or networking permitted without license from IHS -,-,- Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:32:02 MDTNo reproduction or networking permitted without license from IHS -,-,- IPC/JEDEC
13、 J-STD-609 PCBs and PCBAs to Identify Lead(Pb), A joint standard developed by the Marking, Symbols and Labels for Identifi cation of Assemblies, Components and Devices Task Group (4-34b) and JEDEC Committee JC14.4 Quality Processes and Methods Users of this publication are encouraged to participate
14、in the development of future revisions. Contact: JEDEC Solid State Technology Association 2500 Wilson Boulevard Arlington, VA 22201-3834 Tel 703 907.7500 Fax 703 907.7501 IPC 3000 Lakeside Drive, Suite 309S Bannockburn, Illinois 60015-1249 Tel 847 615.7100 Fax 847 615.7105 Supersedes: JESD97 - May 2
15、004 IPC-1066 - January 2005 ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Pb-Free and Other Attributes Marking and Labeling of Components, Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:32:02 MDTNo
16、 reproduction or networking permitted without license from IHS -,-,- ii Copyright 2007, IPC/JEDEC; 2008, IEC Table of Contents IPC/JEDEC Foreword. v IEC Foreword.vii 1 SCOPE1 1.1 Purpose 1 2 REFERENCE DOCUMENTS .1 2.1 IPC 1 2.2 JEDEC 1 2.3 IEC 1 2.4 European Parliament 1 2.5 ANSI .1 3TERMS AND DEFIN
17、ITIONS .1 3.1 2D Code Label (Matrix) .1 3.2 2 Li (or 2LI) .1 3.3 2 nd Level Interconnect .2 3.4 2 nd Level Interconnect Component Label 2 3.5 2 nd Level Interconnect Terminal Finish or Material .2 3.6 Component .2 3.7 Base Materials.2 3.8 Halogen-Free Board .2 3.9 Homogeneous Material .2 3.10 intct
18、(or INTCT) .2 3.11 Linear Bar Code Label 2 3.12 Material Category 2 3.13 Maximum Component Temperature .2 3.14 Pb-Free .2 3.15 Pb-Free Symbol 2 4 SYMBOLS, LABELS AND MARKS2 4.1 Material Category Symbol 2 4.1.1 Size and Location .2 4.1.2 Color2 4.1.3 Font 2 4.2 Pb-Free Symbol.2 4.3 2 nd Level Interco
19、nnect Component Label 3 4.3.1 Size3 4.3.2 Color .3 5 MARKING/LABELING CATEGORIES .4 5.1 PCB Base Material Categories 4 5.1.1 Halogen-Free Base Material .4 5.2 PCB Surface Finish Categories .4 5.2.1 Pb-Containing . 4 5.2.2 Pb-Free .4 5.3 2 nd Level Interconnect Categories .4 5.3.1 Pb-Containing . 4 5
20、.3.2 Pb-Free .4 5.4 Conformal Coating Categories 4 6COMPONENT MARKING AND LABELING .4 6.1 Component Marking 4 6.2 Lowest Level Shipping Container Labeling . 4 7PCB/ASSEMBLY MARKING AND LABELING.5 7.1 PCB Marking5 7.1.1 PCB Shipping Container Labeling .5 7.2 Assembly Marking .5 7.2.1 Assembly Shippin
21、g Container Labeling5 7.3 Solder Category Marking Sequence . 5 7.4 Location .5 7.5 Size .5 7.6 Color .5 7.7 Font .5 7.8 Method 5 7.9 Marking Sequence 5 7.10 Re-Marking Changes in PCBA Materials . .6 8 MARKING AND/OR LABELING OF LEAD (Pb)-CONTAINING COMPONENTS, PCBs, AND PCB ASSEMBLIES 6 8.1 Marking
22、and Labeling of Components6 8.2 Marking and Labeling of PCBs.6 8.3 Marking and Labeling of PCB Assemblies . 6 9 SUMMARY OF MARKING AND LABELING REQUIREMENTS 7 Annex A Acknowledgment8 IPC/JEDEC J-STD-609May 2007 Copyright International Electrotechnical Commission Provided by IHS under license with IE
23、CLicensee=Boeing Co/5910770001 Not for Resale, 10/25/2008 03:32:02 MDTNo reproduction or networking permitted without license from IHS -,-,- Figures Figure 3-1Examples of Materials that Comprise the 2nd Level Interconnect . 2 Figure 4-1Example of Mark Indicating Material Category e2 and the Optional
24、 Circle, Ellipse, Underline or Parentheses 2 Figure 4-2Pb-Free Symbol 3 Figure 4-3Example of 2ndLevel Interconnect Component Label Indicating a Pb-Containing Material 3 Figure 4-4Example of 2ndLevel Interconnect Component Label Indicating a Pb-Free e2 Material with a Maximum Component Temperature of
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