IEC-TR-62017-2-2001.pdf
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1、TECHNICAL REPORT IEC TR 62017-2 First edition 2001-02 Documentation on design automation subjects Part 2: EIAJ-EDA Technology Roadmap toward 2002 Documentation sur les sujets dautomatisation de la conception Partie 2: EIAJ-EDA Technology Roadmap toward 2002 Reference number IEC/TR 62017-2:2001(E) Co
2、pyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/08/2007 19:08:04 MSTNo reproduction or networking permitted without license from IHS -,-,- Publication numbering As from 1 January 1997 all
3、IEC publications are issued with a designation in the 60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1. Consolidated editions The IEC is now publishing consolidated versions of its publications. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publi
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8、ontact the Customer Service Centre (see below) for further information. Customer Service Centre If you have any questions regarding this publication or need further assistance, please contact the Customer Service Centre: Email: custserviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00 Copyright Int
9、ernational Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/08/2007 19:08:04 MSTNo reproduction or networking permitted without license from IHS -,-,- TECHNICAL REPORT IEC TR 62017-2 First edition 2001-02 Docume
10、ntation on design automation subjects Part 2: EIAJ-EDA Technology Roadmap toward 2002 Documentation sur les sujets dautomatisation de la conception Partie 2: EIAJ-EDA Technology Roadmap toward 2002 PRICE CODE IEC 2001 Copyright - all rights reserved No part of this publication may be reproduced or u
11、tilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission3, rue de Varemb Geneva, Switzerland Telefax: +41 22 919 0300e-mail: inmailiec.ch IEC web site http:/www.iec
12、.ch W For price, see current catalogue Commission Electrotechnique Internationale International Electrotechnical Commission Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/08/2007 19:08:
13、04 MSTNo reproduction or networking permitted without license from IHS -,-,- 2 TR 62017-2 IEC:2001(E) CONTENTS Page FOREWORD . 4 Clause INTRODUCTION. 5 1.1Background. 5 1.2Objectives 6 1.3Definitions 7 1.4Audience for the Roadmap . 7 1.5Making of the Roadmap 7 1.6How to Utilize the Roadmap . 9 2.Exe
14、cutive Summary . 10 2.1Semiconductor Industry in 2002 . 10 2.1.1Overview of Design Objects in 2002. 10 2.1.2Overview of Design Environments in 2002. 12 2.2EDA Technology in 2002. 13 2.3Outline of the Roadmap 18 3.Requirements for EDA Technology 19 3.1Profile of Cyber-Giga-Chip 19 3.2Requirements for
15、 EDA Technology. 21 4.Problems and Targets of EDA Technology. 28 4.1Problems and Targets of EDA Technology in Digital Circuit Design. 28 4.1.1System Design 28 4.1.2Architecture Design. 33 4.1.3RTL/Logic Design 38 4.1.4Circuit Design 47 4.1.5Layout Design . 51 4.1.6Manufacture Interface . 55 4.2Probl
16、ems and Targets of EDA Technology in Analog Circuit Design 56 4.3Problems and Targets of EDA Technology in Software Design 59 4.4Problems and Targets of EDA Technology in Entire Design. 62 5.EDA Technology Roadmap 64 5.1EDA Technology Roadmap for Cyber-Giga-Chip. 64 5.1.1Design flow of Cyber-Giga-Ch
17、ip 64 5.1.2EDA Technology Roadmap for Cyber-Giga-Chip 68 5.2Cyber-Giga-Chip for Consumer Electronics 71 Acknowledgements.73 References74 A Glossary75 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for
18、 Resale, 03/08/2007 19:08:04 MSTNo reproduction or networking permitted without license from IHS -,-,- TR 62017-2 IEC:2001(E) 3 - Page Figure 1 Makimotos Wave (Source: IEEE Spectrum Jan. 1992)6 Figure 2 Roadmap Development Concept 9 Figure 3 Profile of Cyber-Giga-Chip in 200212 Figure 4 Design Flow
19、of Core Based System LSIs13 Figure 5 Profile of Cyber-Giga-Chip in 200219 Figure 6 Design Flow of Cyber-Giga-Chip in 199764 Figure 7 Design Flow of Cyber-Giga-Chip in 200265 Figure 8 Design Flow of CPU Cores66 Figure 9 Design Flow of Digital Signal Processing Cores .67 Figure 10 Design Flow of Contr
20、oller Cores68 Table 1 Member List of EDA Vision Working Group 8 Table 2 Institute of Systems any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate
21、 in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2)The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, a
22、n international consensus of opinion on the relevant subjects since each technical committee has representation from all interested National Committees. 3)The documents produced have the form of recommendations for international use and are published in the form of standards, technical specification
23、s, technical reports or guides and they are accepted by the National Committees in that sense. 4)In order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards
24、. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter. 5)The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its s
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