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1、NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 61163-2 Premire dition First edition 1998-11 Dverminage sous contraintes Partie 2: Composants lectroniques Reliability stress screening Part 2: Electronic components Numro de rfrence Reference number CEI/IEC 61163-2:1998 Copyright International Ele
2、ctrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/08/2007 20:37:55 MSTNo reproduction or networking permitted without license from IHS -,-,- Numros des publications Depuis le 1er janvier 1997, les publications de la
3、 CEI sont numrotes partir de 60000. Publications consolides Les versions consolides de certaines publications de la CEI incorporant les amendements sont disponibles. Par exemple, les numros ddition 1.0, 1.1 et 1.2 indiquent respectivement la publication de base, la publication de base incorporant la
4、mendement 1, et la publication de base incorporant les amendements 1 et 2. Validit de la prsente publication Le contenu technique des publications de la CEI est constamment revu par la CEI afin quil reflte ltat actuel de la technique. Des renseignements relatifs la date de reconfirmation de la publi
5、cation sont disponibles dans le Catalogue de la CEI. Les renseignements relatifs des questions ltude et des travaux en cours entrepris par le comit technique qui a tabli cette publication, ainsi que la liste des publications tablies, se trouvent dans les documents ci- dessous: Site web de la CEI* Ca
6、talogue des publications de la CEI Publi annuellement et mis jour rgulirement (Catalogue en ligne)* Bulletin de la CEI Disponible la fois au site web de la CEI* et comme priodique imprim Terminologie, symboles graphiques et littraux En ce qui concerne la terminologie gnrale, le lecteur se reportera
7、la CEI 60050: Vocabulaire Electro- technique International (VEI). Pour les symboles graphiques, les symboles littraux et les signes dusage gnral approuvs par la CEI, le lecteur consultera la CEI 60027: Symboles littraux utiliser en lectrotechnique, la CEI 60417: Symboles graphiques utilisables sur l
8、e matriel. Index, relev et compilation des feuilles individuelles, et la CEI 60617: Symboles graphiques pour schmas. * Voir adresse site web sur la page de titre. Numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series. Consolidated publications Consol
9、idated versions of some IEC publications including amendments are available. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the base publication incorporating amendment 1 and the base publication incorporating amendments 1 and 2. Validity of this publicat
10、ion The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current technology. Information relating to the date of the reconfirmation of the publication is available in the IEC catalogue. Information on the subjects under considera
11、tion and work in progress undertaken by the technical committee which has prepared this publication, as well as the list of publications issued, is to be found at the following IEC sources: IEC web site* Catalogue of IEC publications Published yearly with regular updates (On-line catalogue)* IEC Bul
12、letin Available both at the IEC web site* and as a printed periodical Terminology, graphical and letter symbols For general terminology, readers are referred to IEC 60050: International Electrotechnical Vocabulary (IEV). For graphical symbols, and letter symbols and signs approved by the IEC for gen
13、eral use, readers are referred to publications IEC 60027: Letter symbols to be used in electrical technology, IEC 60417: Graphical symbols for use on equipment. Index, survey and compilation of the single sheets and IEC 60617: Graphical symbols for diagrams. * See web site address on title page. Cop
14、yright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/08/2007 20:37:55 MSTNo reproduction or networking permitted without license from IHS -,-,- NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDAR
15、D 61163-2 Premire dition First edition 1998-11 Dverminage sous contraintes Partie 2: Composants lectroniques Reliability stress screening Part 2: Electronic components Commission Electrotechnique Internationale International Electrotechnical Commission Pour prix, voir catalogue en vigueur For price,
16、 see current catalogue IEC 1998 Droits de reproduction rservs Copyright - all rights reserved Aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photo- copie et les microfilms, sans laccord cri
17、t de lditeur. No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission3, rue de Varemb Geneva, Switzerland Telefax
18、: +41 22 919 0300e-mail: inmailiec.ch IEC web site http: /www.iec.ch CODE PRIX PRICE CODEV Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/08/2007 20:37:55 MSTNo reproduction or networki
19、ng permitted without license from IHS -,-,- 2 61163-2 CEI:1998 SOMMAIRE Pages AVANT-PROPOS 4 INTRODUCTION .6 Articles 1 Domaine dapplication .8 2 Rfrences normatives8 3 Dfinitions.10 4 Procdure .12 4.1 Gnralits 12 4.2 Dfinition du programme 16 4.3 Etablir le contact entre les deux parties impliques.
20、18 4.4 Identifier les dfectuosits et les modes de dfaillance possibles pour chaque composant .18 4.5 Choisir les types, les niveaux et le squencement de contraintes utiliser pour provoquer les dfaillances18 4.6 Dterminer la dure du processus de dverminage sous contraintes 20 4.7 Analyser mathmatique
21、ment les rsultats de lessai initial 20 4.8 Raliser lanalyse des dfaillances .20 4.9 Raliser des squences de contraintes sur les composants22 4.10 Dterminer les critres de rejet ou dacceptation 22 4.11 Dvelopper la boucle dactions correctives .22 4.12 Fournir un retour dinformation aux fabricants de
22、composants.26 4.13 Arrter le processus de dverminage sous contraintes .26 Figure 1 Processus de dverminage sous contraintes des composants (diagramme gnral) .14 Figure 2 Processus dactions correctives.24 Annexe A (informative) Exemples doutils pour identifier les mcanismes de dfaillances dans les co
23、mposants lectroniques .28 Annexe B (informative) Analyse des donnes 32 Annexe C (informative) Exemples dapplications des processus de dverminage sous contraintes52 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing,
24、Bernie Not for Resale, 03/08/2007 20:37:55 MSTNo reproduction or networking permitted without license from IHS -,-,- 61163-2 IEC:1998 3 CONTENTS Page FOREWORD .5 INTRODUCTION .7 Clause 1 Scope .9 2 Normative references9 3 Definitions.11 4 Procedure .13 4.1 General13 4.2 Programme definition .17 4.3
25、Establish contact between the two parties involved.19 4.4 Identify the possible flaws and failure modes for each component.19 4.5 Select stress types, stress levels and stress sequence to be used in order to precipitate failures.19 4.6 Determine the duration of the reliability stress screening proce
26、ss .21 4.7 Mathematically analyze initial test results21 4.8 Perform failure analysis21 4.9 Perform stress sequence on the components .23 4.10 Determine approval or rejection criteria 23 4.11 Develop closed-loop corrective action process23 4.12 Provide feedback to the component manufacturers.27 4.13
27、 Discontinue the reliability stress screening process 27 Figure 1 Component reliability screening process (general flow chart) .15 Figure 2 Corrective action process 25 Annex A (informative) Examples of tools for identifying failure mechanisms in electronic components 29 Annex B (informative) Data a
28、nalysis33 Annex C (informative) Examples of applications of reliability stress screening processes.53 Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/08/2007 20:37:55 MSTNo reproduction
29、or networking permitted without license from IHS -,-,- 4 61163-2 CEI:1998 COMMISSION LECTROTECHNIQUE INTERNATIONALE _ DVERMINAGE SOUS CONTRAINTES Partie 2: Composants lectroniques AVANT-PROPOS 1)La CEI (Commission Electrotechnique Internationale) est une organisation mondiale de normalisation compos
30、e de lensemble des comits lectrotechniques nationaux (Comits nationaux de la CEI). La CEI a pour objet de favoriser la coopration internationale pour toutes les questions de normalisation dans les domaines de llectricit et de llectronique. A cet effet, la CEI, entre autres activits, publie des Norme
31、s internationales. Leur laboration est confie des comits dtudes, aux travaux desquels tout Comit national intress par le sujet trait peut participer. Les organisations internationales, gouvernementales et non gouvernementales, en liaison avec la CEI, participent galement aux travaux. La CEI collabor
32、e troitement avec lOrganisation Internationale de Normalisation (ISO), selon des conditions fixes par accord entre les deux organisations. 2)Les dcisions ou accords officiels de la CEI concernant les questions techniques reprsentent, dans la mesure du possible un accord international sur les sujets
33、tudis, tant donn que les Comits nationaux intresss sont reprsents dans chaque comit dtudes. 3)Les documents produits se prsentent sous la forme de recommandations internationales. Ils sont publis comme normes, rapports techniques ou guides et agrs comme tels par les Comits nationaux. 4)Dans le but d
34、encourager lunification internationale, les Comits nationaux de la CEI sengagent appliquer de faon transparente, dans toute la mesure possible, les Normes internationales de la CEI dans leurs normes nationales et rgionales. Toute divergence entre la norme de la CEI et la norme nationale ou rgionale
35、correspondante doit tre indique en termes clairs dans cette dernire. 5)La CEI na fix aucune procdure concernant le marquage comme indication dapprobation et sa responsabilit nest pas engage quand un matriel est dclar conforme lune de ses normes. 6)Lattention est attire sur le fait que certains des l
36、ments de la prsente Norme internationale peuvent faire lobjet de droits de proprit intellectuelle ou de droits analogues. La CEI ne saurait tre tenue pour responsable de ne pas avoir identifi de tels droits de proprit et de ne pas avoir signal leur existence. La Norme internationale CEI 61163-2 a t
37、tablie par le comit dtudes 56 de la CEI: Sret de fonctionnement. Le texte de cette norme est issu des documents suivants: FDISRapport de vote 56/636/FDIS56/642/RVD Le rapport de vote indiqu dans le tableau ci-dessus donne toute information sur le vote ayant abouti lapprobation de cette norme. Les an
38、nexes A, B et C sont donnes uniquement titre dinformation. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/08/2007 20:37:55 MSTNo reproduction or networking permitted without license fro
39、m IHS -,-,- 61163-2 IEC:1998 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ RELIABILITY STRESS SCREENING Part 2: Electronic components FOREWORD 1)The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IE
40、C National Committees). The object of the IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to te
41、chnical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International
42、 Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2)The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each
43、technical committee has representation from all interested National Committees. 3)The documents produced have the form of recommendations for international use and are published in the form of standards, technical reports or guides and they are accepted by the National Committees in that sense. 4)In
44、 order to promote international unification, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard shall
45、 be clearly indicated in the latter. 5)The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6)Attention is drawn to the possibility that some of the elements of this International S
46、tandard may be the subject of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61163-2 has been prepared by IEC technical committee 56: Dependability. The text of this standard is based on the following documents: FDISRepo
47、rt on voting 56/636/FDIS56/642/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. Annexes A, B and C are for information only. Copyright International Electrotechnical Commission Provided by IHS under license with IECLicensee=IHS Employees/1111111001, User=Wing, Bernie Not for Resale, 03/08/2007 20:37:55 MSTNo reproduction or networking permitted without license from IHS -,-,- 6 61163-2 CEI:1998 INTRODUCTON Bien que dvelopp initialement comme outil dobtention de la fiabilit pour des systmes fonction
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