IEEE-1156.1-1993-R2003.pdf
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1、IEEE Std 1156.1-1993(R2003) IEEE Standard Microcomputer Environmental Specifications for Computer Modules Sponsor Microprocessor and Microcomputer Committee of the IEEE Computer Society Approved June 17, 1993 IEEE Standards Board Abstract: Fundamental information on minimum environmental withstand c
2、onditions is provided. The information is intended to be used in those cases in which a generic or detail specification for a certain module has been prepared. The intent is to achieve uniformity and reproducibility in the test conditions for all modules that may make up larger systems and are purpo
3、rted to have a rated environmental performance level. The specifications pertain to both the natural and artificial environments to which modules may be exposed. These conditions include, but are not limited to, thermal, mechanical, electrical, and atmospheric stresses. Keywords: environmental withs
4、tand conditions, performance level qualification The Institute of Electrical and Electronics Engineers, Inc. 345 East 47th Street, New York, NY 10017-2394, USA Copyright 1993 by the Institute of Electrical and Electronics Engineers, Inc. All rights reserved. Published 1993. Printed in the United Sta
5、tes of America ISBN 1-55937-351-2 No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission of the publisher. Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under license with
6、 IEEELicensee=IHS Employees/1111111001, User=OConnor, Maurice Not for Resale, 04/28/2007 21:23:12 MDTNo reproduction or networking permitted without license from IHS -,-,- Reaffirmed September 11, 2003 Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under licens
7、e with IEEELicensee=IHS Employees/1111111001, User=OConnor, Maurice Not for Resale, 04/28/2007 21:23:12 MDTNo reproduction or networking permitted without license from IHS -,-,- iii Introduction (This introduction is not part of IEEE Std 1156.1-1993, IEEE Standard for Microcomputer Environmental Spe
8、cifications for Computer Modules.) With the introduction of numerous standards for computer hardware, components, circuit packs, backplanes, etc., the Microprocessor and Microcomputer Standards Subcommittee of the IEEE Computer Society found it appropriate to write a separate standard for core envir
9、onmental withstand conditions for computers. This standard provides design engineers and system engineers with requirements for core environmental withstand conditions that all components and modules used in computers should be able to withstand. These conditions include (but are not limited to) the
10、rmal, atmospheric, shock, vibration, and corrosion during storage and operation. At the time that this standard was approved, the working group had the following membership: Rudolf Schubert, Chair Andrew J. Brough, Vice Chair H. A. Andreas K. Clohessy P. D. Cook E. Crocker R. Fluhrer S. Kabayashi R.
11、 Lawrence B. Montegomery D. Moore R. A. Mosquera C. Olsen B. Panter E.D. Parsons J. Rosenberg F. Sauer G. Schramm J. F. Simon A. J. Simonoff N. Sugiura M. Thompson J. Toy J. Trainer D. VanDeWalker E. Waltz D. Wilson D. Young The following persons were on the balloting committee: J. C. Brightwell K.
12、Clohessy S. Duncan S. Dutta W. P. Evertz G. Force D. B. Gustavson F. Hom E. Jacques D. V. James R. Krishnaiyer E. H. Kristiansen R. Linser E. Parsons D. Pavlovich W. T. Rhoades G. S. Robinson E. U. Rosenberger R. Schubert B. Stoppe, Jr. D. Su J. Toy R. J. Voigt A. Wilson J. Witt J. Zalewski Special
13、thanks for their extra efforts in making this document one that engineers will specify go to: H. A. Andreas, E. Crocker, J. F. Simon, D. VanDeWalker, D. Young, K. Clohessy, R. Fluher, A. J. Simonoff, J. Toy, P. D. Cook, D. Moore, and F. Sauer. Copyright The Institute of Electrical and Electronics En
14、gineers, Inc. Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=OConnor, Maurice Not for Resale, 04/28/2007 21:23:12 MDTNo reproduction or networking permitted without license from IHS -,-,- iv When the IEEE Standards Board approved this standard on June 17, 1993, it had
15、 the following membership: Wallace S. Read, Chair Donald C. Loughry, Vice Chair Andrew G. Salem, Secretary Gilles A. Baril Clyde R. Camp Donald C. Fleckenstein Jay Forster* David F. Franklin Ramiro Garcia Donald N. Heirman Jim Isaak Ben C. Johnson Walter J. Karplus Lorraine C. Kevra E.G. “Al” Kiener
16、 Ivor N. Knight Joseph L. Koepfinger* D. N. “Jim” Logothetis Don T. Michael* Marco W. Migliaro L. John Rankine Arthur K. Reilly Ronald H. Reimer Gary S. Robinson Leonard L. Tripp Donald W. Zipse *Member Emeritus Also included are the following nonvoting IEEE Standards Board liaisons: Satish K. Aggar
17、wal James Beall Richard B. EngelmanDavid E. Soffrin Stanley I. Warshaw Adam Sicker IEEE Standards Project Editor Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=OConnor, Maurice Not for Resale, 04/28
18、/2007 21:23:12 MDTNo reproduction or networking permitted without license from IHS -,-,- v CLAUSEPAGE 1. Overview.1 2. Scope.1 3. Purpose2 4. References.2 5. Terminology3 5.1 Performance level 4 5.2 Sheltered applications 4 5.3 Performance level qualification. 4 5.4 Normal operation . 5 5.5 Module.
19、5 5.6 Component. 5 5.7 Maximum power 5 5.8 Mounting 5 5.9 Test duration 5 5.10 Initial and final measurements. 5 5.11 Relevant specification 6 6. Nonoperating environmental conditions.6 6.1 Low temperature (nonoperating/storage). 6 6.2 High temperature (nonoperating/storage) 7 6.3 Thermal Shock (non
20、operating/storage) 7 6.4 Humidity (nonoperating/storage). 7 6.5 Shock (nonoperating/storage) 9 6.6 Salt fog corrosion (nonoperating/storage) 9 6.7 Mixed flowing gas corrosion (nonoperating/storage) 9 6.8 Fungus (nonoperating/storage) 9 6.9 Flammability 10 6.10 Electrostatic discharge (ESD) (nonopera
21、ting/storage). 10 7. Operating environmental conditions.10 7.1 Low temperature (operating) . 10 7.2 High Temperature (operating) . 11 7.3 Sinusoidal vibration (operating). 11 7.4 Random vibration (operating) 12 7.5 Shock (operating). 12 7.6 Low air pressure (operating) 14 7.7 Electrostatic discharge
22、 (ESD) (operating) . 14 7.8 Electromagnetic interference (EMI) (operating) 14 7.9 Life test (operating) 14 8. Test sequence15 8.1 Testing after failure 15 8.2 Module changes. 15 8.3 Test groups. 15 Annex A (informative) Shock and vibration fixtures .16 Annex B (informative)Thermal testing of forced
23、convection-cooled modules18 Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=OConnor, Maurice Not for Resale, 04/28/2007 21:23:12 MDTNo reproduction or networking permitted without license from IHS -,
24、-,- Copyright The Institute of Electrical and Electronics Engineers, Inc. Provided by IHS under license with IEEELicensee=IHS Employees/1111111001, User=OConnor, Maurice Not for Resale, 04/28/2007 21:23:12 MDTNo reproduction or networking permitted without license from IHS -,-,- This page is intenti
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