BS-6221-1-1990 IEC-60326-1-1984.pdf
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1、BRITISH STANDARD BS 6221-1: 1990 IEC 326-1: 1984 Printed wiring boards Part 1: Guide for the specification writer Licensed Copy: sheffieldun sheffieldun, na, Tue Dec 05 07:55:26 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 6221-1:1990 This British Standard, having been prepared under the direction
2、of the Electronic Components Standards Policy Committee, was published under the authority of the Board of BSI and comes into effect on 28 February 1990 BSI 07-1999 The following BSI references relate to the work on this standard: Committee reference ECL/19 Draft for comment 89/23223 DC ISBN 0 580 1
3、8154 5 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19 upon which the following bodies were represented: British Telecommunications plc Electrical and
4、 Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Electronic Engineering Association ERA Technology Ltd. GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Institute of Metal Finishing Institution of Production Engineers Ministry of Defence National Supervis
5、ing Inspectorate Printed Circuit Association Telecommunication Engineering and Manufacturing Association (TEMA) Amendments issued since publication Amd. No.Date of issueComments Licensed Copy: sheffieldun sheffieldun, na, Tue Dec 05 07:55:26 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 6221-1:1990
6、BSI 07-1999i Contents Page Committees responsibleInside front cover National forewordii 1Introduction1 2Scope1 3Object1 4Structure of standards and specifications1 5Levels of standards and specifications3 Publications referred toInside back cover Licensed Copy: sheffieldun sheffieldun, na, Tue Dec 0
7、5 07:55:26 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 6221-1:1990 ii BSI 07-1999 National foreword This Part of BS 6221, prepared under the direction of the Electronic Components Standards Policy Committee, is identical with publication 326-1:1984, “Printed Boards, Part 1: General information for
8、 the specification writer”, published by the International Electrotechnical Commission (IEC). This publication refers to the IEC Quality Assessment System for Electronic Components (IECQ), but makes no reference to the corresponding European System of Quality Assessment or to the British System. Inf
9、ormation on these systems may be obtained by reference to BS CECC 23 000 and BS 9760 respectively. IEC 249-2:1970, to which reference has been made in the text, has been withdrawn and replaced by IEC 249-2, a new series of specifications published in 1988, which are currently being prepared for publ
10、ication as identical British Standards as Sections of BS 4584-102, to be published in 1990. IEC 194:1975 to which reference has been made in the text has been revised and reissued as IEC 194:1988. It is now subject to harmonization procedures in CENELEC and will depending on the result of these proc
11、edures be published as an identical new Group of British Standard, BS 4727-1:Group 10. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of i
12、tself confer immunity from legal obligations. Cross-references International standardCorresponding British Standard IEC 68BS 2011 Environmental testing (Most Parts are identical) IEC 97:1970BS 5830:1979 Specification for grid system for printed circuits (Identical) IEC 326BS 6221: Printed wiring boa
13、rds (Most Parts are identical) Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages 1 to 6, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in t
14、he amendment table on the inside front cover. Licensed Copy: sheffieldun sheffieldun, na, Tue Dec 05 07:55:26 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS 6221-1:1990 BSI 07-19991 1 Introduction IEC Publication 326 is applicable to printed boards, irrespective of their method of manufacture, when t
15、hey are ready for the mounting of the components. It is divided into separate parts covering information for the designer, recommendations for the specification writer, test methods and requirements for the various types of printed boards, for example single and double sided, multilayer and flexible
16、 printed boards. 1.1 Purpose of Part 1 This part contains general information on the structure of standards and specifications for printed boards including those necessary for printed boards under the IEC Quality Assessment System for Electronic Components (IECQ) and gives recommendations to the spe
17、cification writer on selecting and writing standards and specifications. 1.2 Associated IEC publications This standard shall be used in conjunction with the following IEC publications: 2 Scope This standard is applicable to printed boards, irrespective of their method of manufacture, and particularl
18、y to the standards and specifications necessary for printed boards. 3 Object To give recommendations to the specification writer on the selection and the preparation of the appropriate standards and specifications. 4 Structure of standards and specifications Printed boards may bc manufactured and ha
19、ndled: using conventional IEC standards. The manufacturer produces printed boards entirely independent from any influence or surveillance from any international or national organization. All technical and commercial details are agreed upon between manufacturer and user (or purchaser and vendor); und
20、er the IEC Quality Assessment System for Electronic Components (IECQ). The manufacturer must have a capability approval in accordance with the rules of the IECQ system which must be valid for the type of printed board under discussion. The approval will be granted by one of the national organization
21、s approved by the IECQ System; for example the National Supervising Inspectorate. The capability test programme is standardized. Quality conformance inspection of the printed board to be delivered can be chosen to purpose i.e. not below a standardized minimum programme. All technical details not sta
22、ndardized by the system and all commercial details are agreed upon between manufacturer and user (or purchaser and vendor). Both approaches (i.e. with conventional IEC standards and with standards for the IECQ System) require at least partly different standards and specifications. A comparative surv
23、ey of the standards and specifications and their classification into different levels is given in the table below. A detailed explanation of the levels, standards, and specifications is given in Clause 5. 68:Basic Environmental Testing Procedures. 97 (1970):Grid System for Printed Circuits. 194 (197
24、5):Terms and Definitions for Printed Circuits. 249-2 (1970):Base Materials for Printed Circuits, Part 2: Specifications. 326-2 (1976):Printed Boards, Part 2: Test Methods. 326-3 (1980):Part 3: Design and Use of Printed Boards. Licensed Copy: sheffieldun sheffieldun, na, Tue Dec 05 07:55:26 GMT+00:00
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