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1、IEEE Std 98-2002 (Revision of IEEE Std 98-1984) IEEE Standards 98 TM IEEE Standard for the Preparation of Test Procedures for the Thermal Evaluation of Solid Electrical Insulating Materials Published by The Institute of Electrical and Electronics Engineers, Inc. 3 Park Avenue, New York, NY 10016-599
2、7, USA 31 May 2002 IEEE Electrical Insulation Society Sponsored by the Standards Coordinating Committee 4 on Thermal Rating IEEE Standards Print: SH94991 PDF: SS94991 The Institute of Electrical and Electronics Engineers, Inc. 3 Park Avenue, New York, NY 10016-5997, USA Copyright 2002 by the Institu
3、te of Electrical and Electronics Engineers, Inc. All rights reserved. Published 31 May 2002. Printed in the United States of America. Print: ISBN 0-7381-3277-2 SH94991 PDF: ISBN 0-7381-3278-0 SS94991 No part of this publication may be reproduced in any form, in an electronic retrieval system or othe
4、rwise, without the prior written permission of the publisher. IEEE Std 98-2002 (R2007) (Revision of IEEE Std 98-1984) IEEE Standard for the Preparation of Test Procedures for the Thermal Evaluation of Solid Electrical Insulating Materials Sponsor Standards Coordinating Committee 4 on Thermal Rating
5、of the IEEE Electrical Insulation Society Reaffirmed 26 September 2007 Approved 13 May 2002 IEEE-SA Standards Board Abstract: Principles for the development of test procedures to evaluate the thermal endurance of solid electrical insulating materials in air are given in this standard. Keywords: diag
6、nostic test, relative temperature index, temperature index, thermal capability, thermal endurance IEEE Standards documents are developed within the IEEE Societies and the Standards Coordinating Committees of the IEEE Standards Association (IEEE-SA) Standards Board. The IEEE develops its standards th
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21、Copyright Clearance Center. Note: Attention is called to the possibility that implementation of this standard may require use of subject mat- ter covered by patent rights. By publication of this standard, no position is taken with respect to the existence or validity of any patent rights in connecti
22、on therewith. The IEEE shall not be responsible for identifying patents for which a license may be required by an IEEE standard or for conducting inquiries into the legal validity or scope of those patents that are brought to its attention. Copyright 2002 IEEE. All rights reserved. iii Introduction
23、(This introduction is not part of IEEE Std 98-2002, IEEE Standard for the Preparation of Test Procedures for the Thermal Evaluation of Solid Insulating Materials.) IEEE Std 98-1984 refl ected many of the concepts incorporated in IEC 60216-1974 while maintaining many of the practical considerations f
24、rom the initial IEEE Std 98-1972. IEEE Std 98-2002 updates IEEE Std 98-1984 to incorporate additional changes in the IEC 60216 standards and to introduce the Fixed Time Frame Method (FTFM) of sampling for the thermal evaluation of materials. Participants The revision to this standard was prepared by
25、 a working group of Standards Coordinating Committee 4 (SCC 4). Working group members were: S. J. Watson, Chair At the time this document was approved, the IEEE Standards Coordinating Committee 4 on Thermal Rating had the following membership: P. A. Payne, Chair R. J. Mayschak , Secretary The follow
26、ing persons were designated by SCC 4 as the balloting committee that approved this document for submission to the IEEE Standards Board. Balloters may have voted for approval, disapproval, or abstention. R. J. MayschakP. A. Payne E. J. Van Vooren L. B. Wagenaar E. A. Boulter G. I. Duncan S. L. Dyrnes
27、 A. M. Iversen K. N. Mathes E. J. Van Vooren L. B. Wagenaar S. J. Watson R. F. Weddleton M. Winkeler E. A. Boulter J. L. Corkran G. I. Duncan F. J. Gryszkiewicz A. M. Iversen R. P. Marek T. V. Oommen P. A. Payne L. W. Pierce L. B. Wagenaar iv Copyright 2002 IEEE. All rights reserved. When the IEEE-S
28、A Standards Board approved this standard on 13 May 2002, it had the following membership: James T. Carlo, Chair James H. Gurney, Vice Chair Judith Gorman, Secretary *Member Emeritus Also included is the following nonvoting IEEE-SA Standards Board liaison: Alan Cookson, NIST Representative Satish K.
29、Aggarwal, NRC Representative Andrew D. Ickowicz IEEE Standards Project Editor Sid Bennett H. Stephen Berger Clyde R. Camp Richard DeBlasio Harold E. Epstein Julian Forster* Howard M. Frazier Toshio Fukuda Arnold M. Greenspan Raymond Hapeman Donald M. Heirman Richard H. Hulett Lowell G. Johnson Josep
30、h L. Koepfi nger* Peter H. Lips Nader Mehravari Daleep C. Mohla William J. Moylan Malcolm V. Thaden Geoffrey O. Thompson Howard L. Wolfman Don Wright Copyright 2002 IEEE. All rights reserved. v Contents 1.Overview 1 1.1 Scope 1 2.References 2 3.Definitions 2 4.General considerations. 3 4.1 Results o
31、f thermal endurance tests. 3 4.2 End-point criteria. 3 4.3 Test procedures and conditions 3 4.4 Variability 3 5.Use of thermal evaluation data 4 6.Experimental procedure guidelines 4 6.1 Selection of test methods. 4 6.2 Selection of end-points 5 6.3 Preparation of test specimens. 5 6.4 Number of tes
32、t specimens 5 6.5 Establishment of initial property value 6 6.6 Temperature exposures and times 6 6.7 Aging ovens. 6 6.8 Procedure for aging 7 7.Evaluation 8 7.1 Numerical analysis of thermal aging data 8 7.2 Times/temperatures to end-point criterion. 8 7.3 Extrapolation of the data 9 7.4 Determinat
33、ion of temperature index (TI). 10 7.5 Test report 11 Annex A (normative)Fixed time frame method (FTFM) of sampling. 12 Annex B (normative)Fixed temperature method of sampling 14 Annex C (informative)Bibliography. 16 Copyright 2002 IEEE. All rights reserved. 1 IEEE Standard for the Preparation of Tes
34、t Procedures for the Thermal Evaluation of Solid Electrical Insulating Materials 1. Overview 1.1 Scope This standard gives principles for the development of test procedures to evaluate the thermal endurance of solid electrical insulating materials in air. The results of accelerated thermal endurance
35、 tests, which are con- ducted according to prescribed procedures, shall be used to establish temperature indexes (TIs) for insulating materials. Thermal endurance tests and TIs can be used to provide relative comparisons between the thermal capability of new materials and older, more established mat
36、erials. TIs, while giving guidance on materials, should not in themselves be taken to predict the relationship between temperature and life of an insulation material in service. Thermal endurance tests provide a means for determining the rate at which important properties of insulat- ing materials d
37、eteriorate irreversibly as a function of temperature and time. Such tests and the TIs derived from them can aid in selecting insulating materials for use in electrical equipment operating under a wide variety of service conditions. The test procedures covered by this standard apply to solid insulati
38、ng materials, including processed compo- sitions of raw materials, before they are fabricated into insulating structures identifi ed with specifi c parts of electric equipment. Tests for specifi c types of insulating materials, such as wire enamel, varnish, sheet, tape, etc., are not within the scop
39、e of this standard; procedures should be developed for each specifi c type. The mechanical, chemical, and electrical properties of the materials when new should be evaluated separately by test methods not within the scope of thermal endurance test procedures. The properties so determined may indicat
40、e that one or more, or combinations of these, will be the limiting factor in a particular application rather than thermal endurance. These procedures may not apply to the aging characteristics of dielectric fl uids or of porous materials impregnated with dielectric fl uids. -,-,- IEEE Std 98-2002IEE
41、E STANDARD FOR THE PREPARATION OF TEST PROCEDURES FOR THE 2 Copyright 2002 IEEE. All rights reserved. A distinction between material tests and tests to evaluate the performance of insulation systems is necessary because the details of the particular use of a material may not be known to its manufact
42、urer. NOTEGeneral principles for designating the thermal capability of insulating systems are given in IEEE Std 1-2000 B4 1 . See also IEEE Std 99-1980 B5 and IEC 60611-1978 B2. 2. References This standard shall be used in conjunction with the following publications. When the following standards are
43、 superceded by an approved revision, the revision shall apply. ASTM D5374-93 (1999), Standard Test Methods for Forced-Convection Laboratory Ovens for Evaluation of Electrical Insulation. 2 ASTM D5423-1993 (1999), Standard Specifi cation for Forced-Convection Laboratory Ovens for Evaluation of Electr
44、ical Insulation IEC 60216-2 (1990-06), Guide for the Determination of Thermal Endurance Properties of Electrical Insulat- ing Materials. Part 2: Choice of Test Criteria. 3 IEEE Std 101-1987, IEEE Guide for the Statistical Analysis of Thermal Life Test Data. 4 UL 746B-1996, Polymeric MaterialsLong Te
45、rm Property Evaluations. 5 3. Defi nitions For the purpose of this standard, the following terms and defi nitions apply. IEEE 100 B3 should be ref- erenced for terms not defi ned in this clause. 3.1 diagnostic test: A test applied to a test specimen to determine if thermal degradation has occurred.
46、3.2 relative temperature index (RTI): The number that corresponds to the accepted temperature index of the reference electrical insulating material. (See 7.4.) 3.3 temperature index (TI): The number that corresponds to the temperature in degrees Celsius ( C) pre- sented graphically, but calculated m
47、athematically from the thermal endurance relationship of an electrical insulating material at a specifi c time. (See 7.4.) 3.4 thermal capability: The ability to withstand without failure the maximum short time operating temper- atures and the long time integrated degradative effect of temperature a
48、nd time. NOTEIt constitutes a design limitation on the use of insulating materials in electrical and electronic equipment to the extent that both thermal softening (or other short term effects) and long-term aging affect functional properties. 3.5 thermal endurance: The retention of important proper
49、ties as functions of temperature and time. 1 The numbers in brackets correspond to those of the bibliography in Annex C. 2 ASTM publications are available from the American Society for Testing and Materials, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959, USA (http:/www.astm.org/). 3 IEC publications are available from the Sales Department of the International Electrotechnical Commission, Case Postale 131, 3, rue de Varemb, CH-1211, Genve 20, Switzerland/Suisse (http:/www.iec.ch/). IEC publications are also
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