JIS-C-6691-2003-ENG.pdf
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1、J IS JAPANESE I NDUSTRIAL STANDARD Translated and Published by Japanese Standards Association Thermal-links-Requirements and application guide ICs 29.120.50 Reference number : JIS C 6691 : 2003 (E) PROTECTED BY COPYRIGHT 15 s C 6691 : 2003 Foreword This translation has been made based on the origina
2、l Japanese Industrial Standard revised by the Minister of Economy, Trade and Industry through deliberations at the Japanese Industrial Standards Committee, as the result of proposal for revision of Japanese Industrial Standard submitted by Japan Electrical Safety to prepare Japanese Industrial Stand
3、ard conforming with International Standard; and to propose a draft of an International Standard which is based on Japanese Industrial Standard. Attention is drawn to the possibility that some parts of this Standard may conflict with a patent right, application for a patent after opening to the publi
4、c, utility model right or application for registration of utility model after opening to the public which have technical properties. The relevant Minister and the Japanese Industrial Standards Committee are not responsible for identifying the patent right, application for a patent after opening to t
5、he public, utility model right or application for registration of utility model after opening to the public which have the said technical properties. Date of Establishment: 2000-03-20 Date of Revision: 2003-12-20 Date of Public Notice in Official Gazette: 2003-12-22 Investigated by: Japanese Industr
6、ial Standards Committee Standards Board Technical Committee on Electricity Technology JIS C 6691 : 2003, First English edition published in 2004-08 Translated and published by: Japanese Standards Association 4-1-24, Akasaka, Minato-ku, Tokyo, 107-8440 JAPAN In the event of any doubts arising as to t
7、he contents, the original JIS is to be the final authority. 0 JSA2004 Ali rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing
8、from the publisher. Printed in Japan PROTECTED BY COPYRIGHT -,-,- C 6691 : 2003 Contents Page Introduction . 1 1 2 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 Scope and object Normative references Definitions thermal-link (TL) . rated functioning temperature (Tf) . holding temperature (T, ) maximum temper
9、ature limit (T, ) . rated current (I, ) interrupting current (Id . transient overload current (I, ) rated voltage (U, ) . creepage distance . 1 2 3 3 3 3 3 3 3 3 3 4 3.10 clearance 4 3.11 heat capacity 4 3.12 type test (of a product) . 4 3.13 homogeneous series (of thermal-links) 4 3.14 portable equ
10、ipment . 4 4 5 6 7 8 9 10 General requirements . 4 General notes on tests 5 Classification 6 Marking . 8 Documentation . 8 Mechanical requirements . 9 Electrical requirements 10 (i 1 PROTECTED BY COPYRIGHT -,-,- C 6691 : 2003 10.1 10.2 10.3 10.4 10.5 10.6 10.7 Creepage distances and clearances Humid
11、ity test . Dielectric strength . Insulation resistance . Resistance to tracking Interrupting current . Transient overload current 11 Temperature tests . 11.1 Holding temperature (T, ) . 11.2 11.3 Rated functioning temperature (Tf) Maximum temperature limit (T, ) 11.4 Ageing 12 Soldering test . 13 Re
12、sistance to rusting Annex A (normative) Application guide . Annex B (normative) Alternate ageing for TL with T. greater than 250 “C . Annex C (informative) Indelibility of marking Annex 1 (informative) Comparison table between JIS and corresponding International Standard . 11 12 12 13 13 14 14 14 15
13、 15 15 15 16 16 17 18 19 20 (ii) PROTECTED BY COPYRIGHT -,-,- JAPANESE INDUSTRIAL STANDARD JIS C 6691 : 2003 Thermal-links-Requirements and application guide Introduction This Japanese Industrial Standard has been prepared based on the second edition of IEC 60691 : 1993 Thermal-links-Requirements an
14、d application guide, Amendment 1 (1995) and Amendment 2 (2000) with modifying the technical contents. In addition, the amendments were edited to be integrated. The portions with dotted underlines are the matters which are altered the con- tents of the original International Standard. Annex 1 (inform
15、ative) shows the list of alteration with explanation. 1 Scope and object 1.1 This Standard is applicable to thermal-links, intended for incorporation in elec- trical appliances, electronic equipment and component parts thereof, normally in- tended for use indoors, in order to protect them against ex
16、cessive temperatures under abnormal conditions. NOTES 1 The equipment need not be designed to generate heat. 2 The effectiveness of the protection against excessive temperatures logi- cally depends upon the position and method of mounting of the ther- mal-link7 as well as upon the current which it i
17、s carrying. 3 Attention is drawn to the fact that the external creepage distances and clearances specified in table 3 may in some cases be smaller than those required by certain appliance or equipment standards. In such cases, additional means should be provided when a thermal-link is mounted in the
18、 equipment in order to adjust the creepage distances and clearances to the values required by the relevant equipment stan- dard. 1.2 This Standard may be applicable to thermal-links for use under other than in- door conditions, provided that the climatic and other circumstances in the immedi- ate su
19、rroundings of such thermal-links are comparable with those in this Standard. 1.3 This Standard may be applicable to thermal-links in their simplest forms (e.g. melting strips or wires), provided that molten materials, expelled during function, cannot adversely interfere with the safe use of the equi
20、pment, especially in the case of hand-held or portable equipment irrespective of its attitude. 1.4 ing 690 V a.c. or d.c. and a rated current not exceeding 63 A. 1.5 such as corrosive or explosive atmospheres. This Standard is applicable to thermal-links with a rated voltage not exceed- This Standar
21、d is not applicable to thermal-links used under extreme conditions 1.6 with a frequency lower than 45 Hz or higher than 62 Hz. This Standard is not applicable to thermal-links to be used in circuits on a.c. PROTECTED BY COPYRIGHT -,-,- 2 C 6691 : 2003 1 . 7 a) b) c) The object of this Standard is: t
22、o establish uniform requirements for thermal-links; to define methods of test; to provide useful information for the application of thermal-links in equipment. NOTE : The International Standard corresponding to this Standard is given below. In addition, symbols which denote the degree of corresponde
23、nce in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified). and NEQ (not eauivalent) according , . I 1. . to ISO/IEC Guide 21. IEC 60691 : 1993 Thermal-links-Requirements and application guide, Amendment 1 (1995) and Amendment 2 (2000) (MOD) . 2 Norma
24、tive references The following standards contain provisions which, through reference in this Standard, constitute provisions of this Standard. If the indication of the year of coming into effect or the year of publication is given to these referred standards, only the edition of the indicated year co
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