SAE-ARP-1332C-2007.pdf
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1、_ SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising there
2、from, is the sole responsibility of the user.” SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions. Copyright 2007 SAE International All rights reserved. No part of this publication m
3、ay be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of SAE. TO PLACE A DOCUMENT ORDER: Tel: 877-606-7323 (inside USA and Canada) Tel: 724-776-4970 (outside USA)
4、 Fax: 724-776-0790 Email: CustomerServicesae.org SAE WEB ADDRESS: http:/www.sae.org ARP1332 REV. C AEROSPACE RECOMMENDED PRACTICE Issued 1974-03 Reaffirmed 1994-07 Revised 2007-02 Superseding ARP1332B Wave Soldering Procedure RATIONALE This document revision was issued as part of the SAE Five Year R
5、eview process. 1. SCOPE 1.1 The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. 1.2 The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fa
6、bricating procedures that have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards. 1.3 In the following text, references to
7、printed circuit (PC) boards shall be construed to include printed wire (PW) boards. 1.4 Safety-Hazardous Materials While the materials, methods, applications and processes described or referenced in this procedure may involve the use of hazardous materials, this document does not address the hazards
8、 which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved. 1.5 Warning The solder used in this docu
9、ment may contain cadmium. The use of cadmium has been restricted and/or banned for use in many countries due to environmental and health concerns. The user should consult with local officials on applicable health and environmental regulations regarding its use. Copyright SAE International Provided b
10、y IHS under license with SAELicensee=Defense Supply Ctr/5913977001 Not for Resale, 12/04/2007 19:58:40 MSTNo reproduction or networking permitted without license from IHS -,-,- SAE ARP1332 Revision C - 2 - 2. APPLICABLE DOCUMENTS The issue of the following documents in effect on the date of the purc
11、hase order forms a part of this specification to the extent specified herein. The supplier may work to a subsequent revision of a document unless a specific document issue is specified. When the referenced document has been cancelled and no superseding document has been specified, the last published
12、 issue of that document shall apply. 2.1 ASTM Publications Available from ASTM International, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959, Tel: 610-832-9585, www.astm.org. ASTM D 257 DC Resistance or Conductance of Insulating Materials ASTM D 1193 Reagent Water 2.2 U.S. Government Public
13、ations Available from the Document Automation and Production Service (DAPS), Building 4/D, 700 Robbins Avenue, Philadelphia, PA 19111-5094, Tel: 215-697-6257, http:/assist.daps.dla.mil/quicksearch/. MIL-STD-202 Electronic and Electrical Component Parts 2.3 Other Publications American Society for Met
14、als Handbook 3. GENERAL 3.1 A soldered joint is formed when the molten solder “wets“ the surfaces of the substrates. Wetting creates a metallurgical bond by formation of intermetallic compounds of tin with the substrate. Penetration into re-entrant cavities and filling of space between surfaces occu
15、r by capillary action. Best soldering results are achieved when substrates and leads are wetted quickly and completely by the molten solder. The entire substrate surface should approach perfect wetting conditions. 3.2 Surface contamination will impede this metallurgical reaction. Substrate surfaces
16、should be free from oxides and other contaminants to ensure reliable, repeatable soldering conditions required for rapid reaction in the solder wave, where dwell time may be less than 2 seconds. All components and printed circuit board conductor runs should be determined, by lot acceptance test, to
17、possess the optimum surface condition for best solderability. Manipulation of fluxing and soldering often will overcome marginal solderability but can only provide minimum help to components possessing poor solderability. 3.3 The solder wave machine uses a vertical wave of molten solder usually prod
18、uced by an impeller immersed in a sump of molten solder. The impeller pumps the solder between parallel plates so that a crest of solder will exist above the quiescent solder level. Other means of producing a solder wave are acceptable. The electronic module assembly passes over the wave by means of
19、 chain-driven conveyor set at a critical angle with respect to the wave crest axis. The depth of board penetration into the solder crest is critical. Depth should be great enough to cause hydrostatic displacement of flux in holes and allow molten solder to flow through the holes by capillarity. Dept
20、h should not be so great as to cause solder to break across the component side of the PC board. Advanced soldering lines now incorporate in-line fluxing and pre-solder/post-solder cleaning systems. Copyright SAE International Provided by IHS under license with SAELicensee=Defense Supply Ctr/59139770
21、01 Not for Resale, 12/04/2007 19:58:40 MSTNo reproduction or networking permitted without license from IHS -,-,- SAE ARP1332 Revision C - 3 - 4. SOLDER BATH 4.1 The optimum composition of tin is 59.5 to 63.5% with the balance of the solder bath consisting of lead and the items in 4.2.2. 4.2 Contamin
22、ation and composition change of the solder bath will occur during operation. The solder should be sampled and analyzed on a periodic basis or when the quality of the soldering decreases. Certain metallic elements are soluble in molten solder and gradually contaminate the solder bath. 4.2.1 Extremely
23、 heavy deposits of gold plating on electronic components may alloy with molten solder to cause degradation of solidified solder fillets by formation of brittle gold-tin intermetallic compound phases. Surface dewetting will be more prevalent as gold content in the bath increases. Thin (under 120 micr
24、oinch (3 m) thickness) coatings of pure gold are extremely solderable and do not cause degradation of solder joints because all the gold is dissolved away during the soldering operation. 4.2.2 Some elements such as zinc, aluminum, and cadmium render the solder sluggish and porous. Other elements suc
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