ESD STM5.3.1-1999充电设备模型(CDM) 元器件等级.pdf
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1、ESD STM5.3.1-1999 for Electrostatic Discharge Sensitivity Testing Charged Device Model (CDM) Component Level Electrostatic Discharge Association 7900 Turin Road, Bldg.3, Suite 2 Rome, NY 13440-2069 An American National Standard ? Approved May 2, 2001 ESD-STM5.3.1-1999 ESD Association Standard Test M
2、ethod for Electrostatic Discharge Sensitivity Testing Charged Device Model (CDM) - Component Level Approved September 26, 1999 ESD Association ESD Association standards and publications are designed to serve the public interest by eliminating misunderstandings between manufacturers and purchasers, f
3、acilitating the interchangeability and improvement of products and assisting the purchaser in selecting and obtaining the proper product for his particular needs. The existence of such standards and publications shall not in any respect preclude any member or non-member of the Association from manuf
4、acturing or selling products not conforming to such standards and publications. Nor shall the fact that a standard or publication is published by the Association preclude its voluntary use by non-members of the Association whether the document is to be used either domestically or internationally. Re
5、commended standards and publications are adopted by the ESD Association in accordance with the ANSI Patent policy. Interpretation of ESD Association Standards: The interpretation of standards in- so-far as it may relate to a specific product or manufacturer is a proper matter for the individual comp
6、any concerned and cannot be undertaken by any person acting for the ESD Association. The ESD Association Standards Chairman may make comments limited to an explanation or clarification of the technical language or provisions in a standard, but not related to its application to specific products and
7、manufacturers. No other person is authorized to comment on behalf of the ESD Association on any ESD Association Standard. Published by: Electrostatic Discharge Association 7900 Turin Road, Building 3, Suite 2 Rome, NY 13440-2069 Copyright 1999 by ESD Association All rights reserved No part of this p
8、ublication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission of the publisher. Printed in the United States of America ISBN: 1-58537-011-8 Caution Notice (This foreword is not part of ESD Association Standard Test Method STM5.3.1-1999
9、) i Foreword Existing electrostatic discharge (ESD) test models and standards model a charged object approaching a component and discharging through the component. However, with the increasing use of automated component handling systems another potentially destructive discharge mechanism, the Charge
10、d Device Model (CDM), becomes increasingly important. In the charged device model the component itself becomes charged - usually by sliding on a surface - and is rapidly discharged by (an ESD event) as it approaches a conductive object. Accurately quantifying the CDM discharge event is very difficul
11、t, if not impossible, due to the limitations of the measuring equipment and its influence on the discharge itself. The CDM discharge is generally completed in a few nanoseconds, and peak currents of tens of amperes have been observed. The peak current into the component will vary considerably depend
12、ing on a large number of factors such as: package type and parasitics. The typical failure mechanism for the CDM model, observed in MOS components, is dielectric damage, although other damage has been noted. The CDM sensitivity of a given component is very package dependent. The same integrated circ
13、uit (IC) chip in a small outline package (SOP) may be more susceptible to CDM damage than it is in a dual-in-line (DIL) package. ICs in thin small outline packages (TSOP), or a pin grid array (PGA) packages usually have the lowest CDM withstand voltage. Based on results obtained with early CDM teste
14、rs, which did not necessarily meet the waveforms specified in this standard, components with CDM sensitivities of 500 volts or less proved difficult to handle without damage. Components with CDM sensitivities of 1,500 volts or more did not experience major field problems using proper handling techni
15、ques. This document does not apply to the so-called SDM testers: socketed discharge model. Waveform parameters for the 30 pF verification module should be used for guidance only. They may be subject to change in future revisions of this document. This Standard Test Method was processed and approved
16、for submittal to the ESD Association Standards Committee and the Association Board of Directors by the Device Testing Working Group, 5.0. At the time this standard was approved the Working Group had the following members: Koen Verhaege, Chair Sarnoff Corporation Jon Barth Barth Electronics Mike Chai
17、ne Micron Technology Lou DeChairo Lucent Technologies Tom Diep Texas Instruments Leo G. Henry ORYX Instruments Corporation Ira Cohen Intel Marti Farris Intel Hugh Hyatt Hyger Physics Bob Carey Lucent Technologies Mark Kelly Delphi Delco Electronics Systems Thomas Meuse Keytek Ian Morgan AMD Scott Jo
18、hnson AMD In addition the following people made significant contributions to this document: Satoshi Isofuku Tokyo Electronics Trading Joseph Veltri Ford Terry Welsher Lucent Technologies Les Avery Sarnoff Corporation Karlheinz Bock IMEC ii Table of Contents 1. SCOPE AND PURPOSE1 1.1 SCOPE1 1.2 PURPO
19、SE1 2. REFERENCES1 3. DEFINITIONS1 3.1 CHARGED DEVICE MODEL.1 3.2 CDM ESD TESTER1 3.3 CONTACT-MODE DISCHARGE1 3.4 NON-CONTACT MODE DISCHARGE1 3.5 COMPONENT.1 3.6 COMPONENT FAILURE.1 3.7 ELECTROSTATIC DISCHARGE SENSITIVITY (ESDS).1 3.8 ESD WITHSTAND VOLTAGE.1 4. ESD COMPONENT CLASSIFICATIONS1 5. COMP
20、ONENT CHARGING AND DISCHARGING METHODS 2 5.1 DIRECT CHARGING METHOD2 5.2 FIELD-INDUCED METHOD.2 5.3 DISCHARGING METHODS.2 6. REQUIRED EQUIPMENT3 6.1 CDM ESD TESTER.3 6.2 WAVEFORM VERIFICATION EQUIPMENT.3 6.2.1 Equipment for 3.5 Gigahertz Waveform Measurement.3 6.2.2 Equipment for 1 Gigahertz Wavefor
21、m Measurement3 6.2.3 Verification Standard Test Modules for CDM Testing.3 6.2.4 Capacitance Meter 3 7. PERIODIC EQUIPMENT CALIBRATION, TESTER QUALIFICATION, WAVEFORM RECORDS, AND WAVEFORM VERIFICATION REQUIREMENTS3 7.1 EQUIPMENT CALIBRATION.3 7.1.1 Verification Modules 4 7.2 TESTER QUALIFICATION4 7.
22、3 TESTER WAVEFORM RECORDS - NEW EQUIPMENT.4 7.4 TESTER WAVEFORM VERIFICATION4 8. QUALIFICATION AND VERIFICATION PROCEDURES.4 8.1 CDM ESD TESTER QUALIFICATION PROCEDURE4 8.2 WAVEFORM VERIFICATION PROCEDURE5 9. CDM ESDS TESTING TEQUIREMENTS AND PROCEDURES6 9.1 TEST REQUIREMENTS.6 9.1.1 Handling of Com
23、ponents .6 9.1.2 ESD Stress Test Temperature.6 9.1.3 Recommended Waveform Check 6 9.1.4 Component Static and Dynamic Tests.6 9.2 CDM COMPONENT CLASSIFICATION TESTING PROCEDURE6 10. CLASSIFICATION CRITERIA.7 11. APPENDIX 1: VERIFICATION MODULES FOR CDM TESTING11 iii 12. APPENDIX 2: DISCHARGE TEST MET
24、HOD GUIDANCE 12 12.1 NON-CONTACT MODE DISCHARGE. 12 12.2 CONTACT MODE DISCHARGE.11 13. APPENDIX 3: RECOMMENDED COMPONENT, VERIFICATION MODULE AND TESTER CLEANING METHOD.13 Table of Figures FIGURE 1: CDM ESD WAVEFORM FOR THE VERIFICATION MODULES, USING A 3.5 GIGAHERTZ BANDWIDTH MEASUREMENT SYSTEM8 FI
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