芯片制造工艺与芯片测试.ppt
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1、芯片制造工艺与芯片测试,展讯通信 人力资源部 培训与发展组,2020/10/21,2,芯片的制造工艺,1IC 产业链 2 Wafer 的加工过程 3 IC 的封装过程 4 芯片的测试 芯片工艺制造小结,2020/10/21,3,一、IC 产业链,IC 应用,硅片,掩膜,半导体设备 材料厂商 IP/设计服务,IC设计,IC,IC,掩膜数据,用户需求,Wafer CP,Wafer加工,封装,Test,交货,成品,中测,2020/10/21,4,半导体圆柱单晶硅的生长过程,制备Wafer,2020/10/21,5,二、Wafer加工过程,2020/10/21,6,光刻,Photolithograph
2、y,2020/10/21,7,1. Wafer prepare, deep Nwell litho and impl.,二、Wafer加工过程,2020/10/21,8,二、Wafer加工过程,2. Pad oxide, nitride deposit, diffusion litho, trench etch,2020/10/21,9,3. Trench oxide, litho, etch and CMP; Nitride remove and sac oxide,二、Wafer加工过程,2020/10/21,10,4. Pwell litho, impl., VTN impl.,二、Wa
3、fer加工过程,2020/10/21,11,5. Nwell litho, impl.; VTP photo, impl.,二、Wafer加工过程,2020/10/21,12,二、Wafer加工过程,6. Sac oxide remove, gate1 oxide and litho, gate2 oxide,2020/10/21,13,7. Poly deposit, litho, and etch; NLDD photo and impl.; PLDD photo and impl.; Spacer dep. and etch,二、Wafer加工过程,2020/10/21,14,8. N+
4、 S/D photo and impl.; P+ S/D photo and impl.,二、Wafer加工过程,2020/10/21,15,二、Wafer加工过程,9. RPO deposit, photo and etch; Salicide formation,2020/10/21,16,二、Wafer加工过程,10. ILD dep. and CMP,2020/10/21,17,二、Wafer加工过程,11. Cont photo and etch; W dep. and CMP,2020/10/21,18,二、Wafer加工过程,12. Met1 dep., photo and et
5、ch,2020/10/21,19,二、Wafer加工过程,13. Via1, Met2, Via2, Met3, Via3, Met4, CTM4, Via4, TME,2020/10/21,20,二、Wafer加工过程,14. Passivation dep., photo, and etch; Alloy,2020/10/21,21,2020/10/21,22,三、IC 封装过程,2020/10/21,23,BACK GRINDING 晶圆背面研磨,WAFER ,WAFER,TRUCK TABLE,GRINDING WHEEL,三、IC 封装过程,2020/10/21,24,WAFER,W
6、AFER SAW 晶圆切割,WAFER MOUNT,BLUE TAPE,DIE,SAW LADE 划片,三、IC 封装过程,2020/10/21,25,Die Bond(Die Attach) 上 片,BOND HEAD,EPOXY,SUBSTRATE,EPOXY CURE ( DIE BOND CURE),三、IC 封装过程,2020/10/21,26,Wire Bond,GOLD WIRE,CAPILLARY,DIE,PAD,FINGER(INNER LEAD),三、IC 封装过程,2020/10/21,27,Compound,Mold chase,Molding,Gate insert,
7、Runner,Top cull block,Cavity,Top chase,Air vent,Compound Pot Plunger,Substrate Bottom cull block,Bottom chase,三、IC 封装过程,2020/10/21,28,Marking,INK MARK,LASER MARK,SPREADTRUM Sample 20 JUN,SPREADTRUM Sample 20 JUN,SPREADTRUM Sample 20 JUN,SPREADTRUM Sample 20 JUN,三、IC 封装过程,2020/10/21,29,Ball Attach,FL
8、UX,FLUX PRINTING,BALL ATTACH TOOL,BALL ATTACH,VACUUM,SOLDER BALL,REFLOW,三、IC 封装过程,2020/10/21,30,PUNCH,Singulation,ROUTER,SPREADTRUM Sample 20 JUN,SPREADTRUM Sample 20 JUN,SPREADTRUM Sample 20 JUN,SPREADTRUM Sample 20 JUN,SAW SINGULATION,三、IC 封装过程,2020/10/21,31,封装种类,DIP 双列直插 SIP 单列直插 PQFP 塑料方型扁平式封装 B
9、GA 球栅阵列封装 PGA 针栅阵列封装 CSP 芯片尺寸封装 MCM 多芯片封装,2020/10/21,32,2020/10/21,33,四、IC 的测试,TEST OBJECTIVES 测试目的分类 Design Verification 设计验证测试 Production Tests 大生产测试 Characterization Tests 特性分析测试 Failure Analysis Tests 失效分析测试,TESTING STAGES 测试阶段分类 Wafer Sort Testing 晶园测试 (中测) Package Device Testing 成品测试 Incoming
10、Inspection Testing 入厂筛选测试,TEST ITEMS 测试内容分类 Per-Pin Testing 管脚测试 Parametric Testing 参数测试 Functional Testing 功能测试,2020/10/21,34,Wafer Process,Wafer Test,Box & Ship,Final Test,Burn In,Package Assembly,Economic Gate Tester Fault Coverage vs. cost,Wafer Test vs. Final Test,Quality Gate Tester Fault Cove
11、rage vs. Escape cost,Package cost,Process Yield,2020/10/21,35,测试程序开发流程,Device and Test Specifications,Define pinmap, test philosophy, conditions,Select ATE and required config,Develop DIB and interface,Create test waveforms, test patterns, clock/timing solutions,test procedures, simulate off-line,On
12、-Tester debug,Repeatability, correlation, and test time optimization,Test program release to Production,?,2020/10/21,36,芯片工艺过程小节,从硅片到芯片要经过一系列的氧化、光刻、扩散、离子注入、生长多晶硅、淀积氧化层、淀积金属层等等50100到工序 硅片经过一次次物理、化学过程,受到一张张掩模的约束,在硅表明形成了一个个电子器件及连线,由此构成逻辑单元乃至整个系统 简称硅表面加工工艺 芯片制造过程首先要得到的是硅表面加工工艺需要的掩模 掩模制造过程是集成电路设计生产中成本最高的
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