金球推力国际标准Wire Bond Shear Test.pdf
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1、EIA/JEDEC STANDARD Wire Bond Shear Test Method EIA/JESD22-B116 JULY 1998 ELECTRONIC INDUSTRIES ALLIANCE NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Council level and subsequently reviewed and approved by the EIA General Co
2、unsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the pro
3、per product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDE
4、C does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from
5、 the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an EIA standard. No claims to be in conformance with this standard may be made unless all requirements stated in t
6、he standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC Solid State Technology Division, 2500 Wilson Boulevard, Arlington, VA 22201-3834, (703)907-7560/7559 or www.eia.orgjedec. Published by ELECTRONIC INDUS
7、TRIES ALLIANCE Engineering Department 2500 Wilson Boulevard Arlington, VA 22201-3834 Copyright does not apply to JEDEC member companies as they are free to duplicate this document in accordance with the latest revision of JEDEC Publication 21 Manual of Organization and Procedure. PRICE: Please refer
8、 to the current Catalog of JEDEC Engineering Standards and Publications or call Global Engineering Documents, USA and Canada (1-800-854-7179), International (303-397-7956) Printed in the U.S.A. All rights reserved JEDEC Standard 22-B116 Page 1 Test Method B116 WIRE BOND SHEAR TEST (From JEDEC Counci
9、l Ballot JCB-97-64, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices.) 1 Scope This test provides a means for determining the strength of the bond between a gold ball bond on a die bonding surface or an aluminum wedge or stitch bond on a pa
10、ckage bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. This measure of bond strength is extremely important in determining two features: 1) the integrity of the metallurgical bond which has been formed. 2) the quality of gold and aluminum wire bonds to die or p
11、ackage bonding surfaces. These test methods cover ball bonds made with small diameter (from 18 to 76 m, or from 0.7 to 3 mil) wire and wedge bonds made with larger diameter (minimum of 3 mil) wire, of the type used in integrated circuits and hybrid microelectronic assemblies. These test methods can
12、be used only when the ball height (at least 10.16 m or 0.4 mil) and diameter for ball bonds, or the wire height (at least 1.25 mils in height at the compressed bonded area) of the wedge bond, are large enough and adjacent interfering structures are far enough away to allow suitable placement and cle
13、arance (above the bonding pad or leadframe post and between adjacent bonds) of the shear test chisel. This test method may also apply to gold wedge or stitch bonds if the wire is thick enough to allow shearing of the wire from the bonding surface without smearing similar to a shearing skip. The wire
14、 bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance. 2 Terms and Definitions The terms and definitions shall be in accordance with the following paragraphs. 2.1 Ball Bond The adhesion or welding of a thin wire, usually gold, to
15、a die pad metallization, usually an aluminum alloy, using a thermosonic wire bond process. The ball bond includes the enlarged spherical, or nail head, portion of the wire (provided by the flame-off and first bonding operation in the thermal compression and thermosonic process, or both), the underly
16、ing bonding pad and the ball bond-bonding pad intermetallic weld interface. 2.2 Bonding Surface Either 1) the die pad metallization or 2) the package surface metallization to which the wire is ball, wedge or stitch bonded. Test Method B116 JEDEC Standard 22-B116 Page 2 2 Terms and Definitions (contd
17、) 2.3 Bond Shear A process in which an instrument uses a chisel shaped tool to shear or push a ball or wedge bond off the bond pad (see Figure 1). The force required to cause this separation is recorded and is referred to as the bond shear force. The bond shear force of a gold ball bond, when correl
18、ated to the diameter of the ball bond, is an indicator of the quality of the metallurgical bond between the gold ball bond and the bond pad metallization. The bond shear force of an aluminum wedge bond, when compared to the manufacturers tensile strength of the wire, is an indicator of the integrity
19、 of the weld between the aluminum wire and the bond pad or package surface metallization. Figure 1 Bond Shear set-up 2.4 Definition of Bond Shear Codes for Ball and Wedge Bonds (see Figure 2) 2.4.1 Type 1 - Bond Lift A separation of the entire wire bond from the bonding surface with only an imprint
20、being left on the bonding surface. There is very little evidence of intermetallic formation or welding, or disturbance of the bonding surface metallization. 2.4.2 Type 2 - Bond Shear A separation of the wire bond where 1) A thin layer of the bonding surface metallization remains with the wire bond a
21、nd an impression is left in the bonding surface, or 2) Intermetallics remain on the bonding surface and with the wire bond, or 3) A major portion of the wire bond remains on the bonding surface. JEDEC Standard 22-B116 Page 3 Test Method B116 2 Terms and Definitions (contd) 2.4 Definition of Bond She
22、ar Codes for Ball and Wedge Bonds (see Figure 2) (contd) 2.4.3 Type 3 - Cratering A condition under the die pad metallization in which the insulating layer (oxide or interlayer dielectric) and the bulk material (silicon) separate or chip out. Separation interfaces which show pits or depressions in t
23、he insulating layer (not extending into the bulk) are not considered craters. It should be noted that cratering can be caused by several factors including the wire bonding operation, the post-bonding processing, and even the act of shear testing itself. Cratering present prior to the shear test oper
24、ation is unacceptable. 2.4.4 Type 4 - Arm Contacts Specimen (Bonding Surface Contact) The shear tool contacts the bonding surface to produce an invalid shear value. This condition may be due to improper placement of the specimen, a low shear height or instrument malfunction. This bond shear type is
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