BS-CECC-23100-003-1996.pdf

BRITISH STANDARD BS CECC 23100-003: 1996 Incorporating Amendment No. 1 Harmonized system of quality assessment for electronic components Capability detail specification: Single and double sided printed boards with plain holes ICS 31.180 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:42 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23100-003:1996 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 April 1996 © BSI 01-2000 The following BSI references relate to the work on this standard: Committee reference EPL/52 Draft announced in BSI News July 1995 ISBN 0 580 25424 0 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/52, Printed circuits, upon which the following bodies were represented: British Telecommunications plc Electrical and Electronic Insulation Association Federation of the Electronics Industry GAMBICA (BEAMA Ltd.) Institute of Metal Finishing Ministry of Defence National Supervising Inspectorate (BSI PC) Printed Circuit Interconnection Federation Surface Mount and Related Technologies (SMART) Ltd. Amendments issued since publication Amd. No.DateComments 9805February 1998 Indicated by a sideline in the margin Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:42 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23100-003:1996 © BSI 01-2000i Contents Page Cooperating organizationsInside front cover National forewordii 1General1 1.1Scope1 1.2Object1 2Capability qualifying component (CQC)1 3Capability approval3 4Capability test programme3 5Additional capability4 6Traceability4 Appendix A Test pattern for marking inks13 Appendix B Test pattern for solder masks14 Appendix C15 Figure 1 Possible equipment configuration21 Figure 2 Schematic showing undisturbed interval22 Figure 3 Schematic showing undisturbed interval; in situ method22 Figure 4 Incident wave voltage showing (2 ×) air line delay23 Figure 5 Test specimen details24 Table I Capability approval test schedule5 Table IIa Additional metallic conductor finishes8 Table IIb Additional contact finishes10 Table III Permanent organic finishes11 List of referencesInside back cover Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:42 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23100-003:1996 ii © BSI 01-2000 National foreword This British Standard has been prepared by Technical Committee EPL/52. It is a capability detail specification (CapDS) within the CECC system and should be read in conjunction with BS EN 123100. This edition includes Amendments 1 and 2 to BS CECC 23100-003:1991 and reflects industry requirements by reducing the permitted failures to zero and increasing the range of metallic finishes. It has been produced to reflect the capability levels established in the United Kingdom for the supply of printed boards to the defence, computer, communications and similar industries over many years. It is generally equivalent to that defined by BS 9000 General requirements for a system for electronic components of assessed quality, and in particular by BS EN 123100:1992 Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes. The capability level defined is enhanced compared to that described by BS EN 123100-800:1992. In particular capability has been extended to include the following: a) more surface finishes, now split into two groups and referred to the connector area and the remainder of the board respectively; b) more metallic finishes; c) solder resistant organic finishes; d) marking inks; e) bonded heatsinks; f) accelerated ageing; g) additional capability in the definition of minimum conductor and spacing widths; h) traceability. Figure 1 to Figure 4 are reproduced by kind permission of the Institute for Interconnecting and Packaging Electronic Circuits (IPC), 2215 Sanders Road, Northbrook, Illinois 60062-6135, USA. Cross-references Publication referred toCorresponding British Standard EN 123000:1991BS EN 123000:1992 Harmonized system of quality assessment for electronic components: Generic specification: Printed boards EN 123100:1992BS EN 123100:1992 Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes IEC 68 seriesBS 2011 series Environmental testing IEC 249 seriesBS EN 60249 series Base materials for printed circuits BS 5411 Methods of test for metallic and related coatings ISO 1463:1981Part 5:1984 Measurement of local thickness of metal and oxide coatings by the microscopical examination of cross-sections ISO 3543:1981Part 12:1984 Beta backscatter method for measurement of thickness Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:42 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23100-003:1996 © BSI 01-2000iii There is no British Standard equivalent to CECC 00010:1980 which comprises a list of the tests in IEC 326-2 and its supplement IEC 326-2A. A related British Standard to IEC 326-2 and its supplements is BS 6221-2 and its amendments. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i to iv, pages 1 to 24, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:42 GMT+00:00 2006, Uncontrolled Copy, (c) BSI iv blank Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:42 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23100-003:1996 © BSI 01-20001 1 General 1.1 Scope This Capability Detail Specification is based on EN 123100. It relates to single and double sided printed boards with plain holes made with materials and surface finishes as specified in 2. 1.2 Object To specify the Capability Qualifying Component “CQC”, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and extended capability. 2 Capability Qualifying Component (CQC) Test boards to be used as CQCs for basic capability shall be made of one of the copper clad base materials specified in 2.1 of this Capability Detail Specification, base material thickness of 1.6 ± 0.14 mm and 35 4m copper foil on both sides; bear the composite test pattern (CTP) specified in 8.2 of EN 123100, (or equivalent composite test pattern); have one of the surface finishes specified by groups 11, 12, 13, 14, 15, 16, 17 or 18 in 2.2 of this Capability Detail Specification. Test boards to be used as CQCs for additional capability shall be modified to demonstrate the claimed features see 5. Materials Material group designation SpecificationBase materialBase material thickness range Cu-thickness IECTypeGrademm4m 249-2-1Phenolic paperHigh electrical 249-2-2Phenolic paperEconomic A 249-2-6Phenolic paperDefined flammability (horizontal)0.2.6.418, 35, 70, 105 249-2-7Phenolic paperDefined flammability (vertical) 249-2-3Epoxide paperDefined flammability (vertical) 249-2-4Epoxide woven glass General B 249-2-5Epoxide woven glass Defined flammability (vertical) 0.2.6.418, 35, 70,105 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:42 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23100-003:1996 2 © BSI 01-2000 2.2 Surface finishes 2.2.1 Metallic finishes The demonstration of metallic finish groups 21, 22, 23 or 24 shall be combined with a finish from groups 11, 12, 13, 14, 15, 16, 17 or 18. Each claimed combination of metallic finishes shall be tested separately. 2.2.1.1 Accelerated ageing The ability of finishes from groups 11, 12, 13, 14, 15, 16, 17 or 18 to solder after extended or adverse storage conditions is demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. Each finish that has complied with the requirements of the accelerated ageing test is highlighted by the inclusion of an asterisk (“*”) adjacent to that finish in the manufacturers abstract of capability as published in the QPL. 2.2.2 Organic finishes The demonstration of organic finish groups a, b, c or d shall be over a finish from groups 11, 12, 13, 14, 15, 16, 17 or 18. All claimed types of solder resist and marking ink shall be tested separately. Finish group designation Surface finish Abbreviation for QPL 11Bare copperCu 12Copper with temporary protective coatingCu(tpc) 13Copper with oxideCu(CuO) 14Tin, tin-leadSn, SnPb 15Tin-lead (fused)SnPb(f) 16Tin-lead (dipped and levelled)SnPb(dl) 17Tin-lead (roller coated)SnPb(rt) 18Immersion Gold over electroless nickelAuNi(smt) 21Specimen K 5 4m min. gold plated on copper remainder using finish group 11 18 (see below) 5 Au/Cu, Cu, Sn, SnPb 22Specimen K 0.7 4m min. gold plate on nickel remainder using finish group 11 18 (see below) 0.7 Au/Ni, Cu, Sn, SnPb 23Specimen K 2.5 4m min. gold plated on copper remainder using finish group 11 18 (see below) 2.5 Au/Cu, Cu, Sn, SnPb 24Specimen K 2.5 4m min. gold plate on nickel remainder using finish group 11 18 (see below) 2.5 Au/Ni, Cu, Sn, SnPb Finish group designation Organic finish Abbreviation for QPL aDryfilm solder maskDSM bWet resist solder maskWSM cLiquid photo polymer solder maskLSM dMarking inksMI Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:42 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23100-003:1996 © BSI 01-20003 2.3 Variant designation The combination of any material group designated in 2.1 and any of the surface finishes as designated in 2.2 constitutes a variant. The variant is designated by the combination of material and finish group designations e.g. A12(b) or A12/21(c). 3 Capability approval 3.1 Range of capability approval Capability approval granted on the testing of one variant is valid within the limits specified in 3.7 of EN 123000 for metal-clad base material within one group designation, all base material thicknesses and all foil thicknesses of the material in accordance with 2.1; and all metallic surface finishes within one surface finish group as quoted in 2.2.1, that is 3.2 QPL information The QPL information shall be given in accordance with 3.4 of EN 123000 and shall contain the following details; 4 Capability test programme Each separate process shall be assessed within the test programme. 4.1 Capability demonstration Capability shall be demonstrated by using 9 composite test patterns (CTPs) of one variant from each material group claimed. Testing shall be in accordance with Table I. 4.1.1 Other metallic surface finishes If claimed, other metallic surface finishes, as designated in 2.2.1, shall be demonstrated by the manufacture of 3 CTPs plus sufficient extra A and H specimens to meet the requirements of Table II. Testing shall be in accordance with Table II. NOTE 1The maximum claimed active board size for the finish shall be demonstrated. NOTE 2Demonstration of metallic surface finishes using materials from group A apply to that group only. Demonstration of metallic surface finishes using materials from group B also covers their application to materials from group A. finish group 11 finish group 12 finish group 13 finish group 14 finish group 15 finish group 16 finish group 17 finish group 18 finish group 21 finish group 22 finish group 23 finish group 24 covers finish group 11 only covers finish group 11 and 12 covers finish group 11 and 13 covers finish group 11 and 14 covers finish group 11 and 15 covers finish group 11 and 16 covers finish group 11 and 17 covers finish group 18 only covers finish group 21 only covers finish group 22 and 24 covers finish group 21 and 23 covers finish group 24 only Reference to the CECC Generic Specification Reference to the CECC Sectional Specification Reference to the BS CECC Capability Detail Specification Base material for which approval is granted as given in 2.1 The surface finishes for which approval is granted as given in 2.2 Any additional capability, 3.5.3 of EN 123000 refers : 123000 : 123100 : BS CECC 23100-003 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:42 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 23100-003:1996 4 © BSI 01-2000 4.1.2 Organic surface finishes Each claimed organic surface finish, as designated in 2.2.2, shall be demonstrated by the manufacture of 3 CTPs using the pattern specified in Appendix A (marking inks) or Appendix B (solder masks). Testing shall be in accordance with Table III. NOTEDemonstration of organic surface finishes using material from group A apply to that group only. Demonstration of organic surface finishes using material from group B also covers their application to materials from group A. 4.1.3 Demonstration of impedance control Special CQCs shall be constructed in accordance with Figure 5 of Appendix C.5 of this Capability Detail Specification, configured as a “stripline” impedance structure. Demonstrations shall be made for the following variants, as required and defined by the approved manufacturer: each base material type (e.g. woven glass epoxide); each impedance extreme, and a 50 7 mandatory demonstration; conductor width and separation minima; each metallic surface finish. Tolerances at 50 7 and each impedance extreme shall be claimed prior to demonstration, and achieved. Where more than one permanent solder resist type and thickness is claimed, impedance value derating factors shall be declared. Impedance control shall be shown on the capability approval certificate as a separate appendix. 5 Additional capability Maximum active board size (mm)length and breadth see 8.3 of EN 123100. 6 Traceability Traceability of all test specimens to the original production panel shall be maintained. The method used to identify individual test specimens shall not affect the test result. Minimum conductor width and spacing Specimen F of CTP to be modified to provide additionally 5 conductors and 4 spacings, each of the claimed minimum. Initial foil thickness of less than 35 4m may be used for this demonstration but this thickness shall be declared. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:42 GM