BS-CECC-90101-1980.pdf

BRITISH STANDARD BS CECC 90101:1980 Incorporating Amendment Nos. 1, 2 and 3 Specification for Harmonized system of quality assessment for electronic components Family specification Digital integrated TTL circuits Series 54, 64, 74, 84 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 © BSI 03-2000 ISBN 0 580 35961 1 Amendments issued since publication Amd. No.Date of issueComments 3945February 1982 5198August 1986 5616April 1987Indicated by a sideline in the margin Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 © BSI 03-2000i Contents Page National forewordii Forewordiii Text of CECC 901011 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 ii © BSI 03-2000 National foreword This British Standard has been prepared under the direction of the Electronic Components Standards Committee. It is identical with CENELEC Electronic Components Committee (CECC) 90101 “Family specification: Digital integrated TTL circuits Series 54, 64, 74, 84”. This standard is a harmonized specification within the CECC system. Terminology and conventions. The text of the CECC specification has been accepted as suitable for publication, without deviation, as a British Standard. Certain terminology and conventions are used, however, that are not identical with those used in British Standards. Attention is particularly drawn to the following. The comma has been used throughout as a decimal marker. In British Standards it is current practice to use a full point on the baseline as the decimal marker. Cross references. The British Standard harmonized with CECC 00100 is BS E9000 “General requirements for electronic components of assessed quality harmonized with the CENELEC Electronic Components Committee System” Part 1 “Basic rules”. The following International Standards are referred to in the text and for each there is a corresponding British Standard; these are listed below. Scope. This Standard lists the general information for ratings, characteristics and inspection requirements for a series of integrated circuits which shall be included as mandatory requirements in detail specifications in accordance with BS CECC 90000. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. International Standard Corresponding British Standard CECC 90000:1976BS CECC 90000:1977 Harmonized system of quality assessment for electronic components: Generic specification: monolithic integrated circuits (Identical) CECC 90100:1976BS CECC 90100:1977 Harmonized system of quality assessment for electronic components: Sectional specification: Digital monolithic integrated circuits (Identical) IEC 191-2:1966BS 3934:1965 Dimensions of semi-conductor devices (Related) Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the CECC title page, pages ii to iv, pages 1 to 7 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 ii © BSI 03-2000 Contents Page Forewordiii 1Limiting conditions of use for the family1 2Recommended operating conditions and associated characteristics for the family2 3Inspection requirements2 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 © BSI 03-2000iii Foreword The CENELEC Electronic Components Committee (CECC) is composed of those member countries of the European Committee for Electrotechnical Standardization (CENELEC) who wish to take part in a harmonized System for electronic components of assessed quality. The object of the System is to facilitate international trade by the harmonization of specifications and quality assessment procedures for electronic components, and by the grant of an internationally recognized Mark, or Certificate, of Conformity. The components produced under the System are thereby accepted by all member countries without further testing. This document has been formally approved by the CECC, and has been prepared for those countries taking part in the System who wish to prepare and issue detail specifications for DIGITAL INTEGRATED CIRCUITS. It should be read in conjunction with document CECC 00100: Basic Rules (1974). Preface This family specification was prepared by CECC Working Group 9: Integrated Circuits. It contains the general information for the TTL-series 54, 64, 74 and 84. Together with the device type detail specification, usually prepared nationally, it forms the complete detail specification for the device belonging to series 54, 64, 74 or 84. The text of this specification was circulated to the CECC for voting in the documents CECC(Secretariat)417 in September 1975, CECC(Secretariat)529 in August 1976 and CECC(Secretariat)625 in June 1977, and was ratified by the CECC for printing as a CECC specification. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI iv blank Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 © BSI 03-20001 Page 1 of 7 CECC-Number Date of issue ELECTRONIC COMPONENTS OF ASSESSED QUALITY IN ACCORDANCE WITH: National Number CECC 90000: Generic specific., monolithic integrated circuits and Date of issue (if appropriate) CECC 90100: Sectional Spec., Digital monolithic integr. circuits Family Specification for TTL-Circuits, series 54, 64, 74, 84 Typical construction: Silicon monolithic bipolar cavity and non-cavity package Outline and dimensions: See detail specification for specific type Terminal connections: See detail specification for specific type Assessment levels R, S, T and V 1 Limiting conditions of use for the family (not for inspection purposes) 1.1Maximum continuous supply voltage VCC 0,5 V + 7,0 V 1.2Maximum input voltages 1.2.1Max input voltageVI 0,5 V + 5,5 V (see individual detail specification) 1.2.2Max input voltage between multiple emitter transistor inputsVII+ 5,5 V 1.3Minimum and maximum operating ambient temperatures Tamb(°C)min max 54 55 + 125 64 40 + 85 74 0 + 70 84 25 + 85 1.4Minimum and maximum storage temperatures Tstg65 °C + 150 °C min max (unless otherwise prescribed in the detail specification) See the relevant Qualified Parts List for the availability of components qualified to this detail specification. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 2 © BSI 03-2000 2 Recommended operating conditions and associated characteristics for the family (not for inspection purposes) (see also relevant detail specification) These apply over the operating temperature range, unless otherwise prescribed. 3 Inspection requirements NOTE 1All tests shall be performed at Tamb= 25 °C unless otherwise prescribed. NOTE 2The paragraph numbers refer to the generic specification, unless otherwise prescribed. NOTE 3The following abbreviations are used: 2.1Positive supply voltageVCC4,5 V 5,5 V (54) 4,75 V 5,25 V (64, 74, 84) 2.2Most negative low level input voltage at an input current IIK = 12 mA VIKB1,5 V 2.3Minimum value of low level input voltageVILB0V 2.4Maximum value of low level input voltageVILA0,8 V 2.5Minimum value of high level input voltageVIHB2V 2.6Maximum value of high level input voltageVIHA5,5 V 2.7Most positive low level output voltage at an output current of 1,6 mA × the higher fanout (unless otherwise specified in the detail specification)VOLA0,4 V 2.8Most negative high level output voltage at an output current of 40 4A × the higher fanoutVOHB2,4 V 2.9Most positive high level output voltageVOHA5,5 V (54) 5,25 V(64, 74, 84) 2.10 DC noise margin at low level (VILA VOLA)VNL0,4 V 2.11 DC noise margin at high level (VOHB VIHB)VNH0,4 V 2.12 Dynamic characteristicssee relevant detail specification IL=Inspection level AQL =Acceptance Quality level n=fix sample size c=acceptance criteria D=destructive ND=non destructive P=Periodicity n.a.=not applicable Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 © BSI 03-20003 Examination or test D or ND Test Conditions Assessment level Inspection requirements See Note 2See Note 2ILAQL Limits See Note 2 Group A Inspection These tests are contained in the detail specification for the individual device type. They comprise the following sub-groups: Sub-group A1 Visual examination 4.2 ND See relevant detail specification R, S, T, VI1,5See relevant detail spec. Sub-group A2 Verification of the function ND See relevant detail specification R, S T, V II II 0,15 0,25 See relevant detail spec. Sub-group A3 Static characteristics at 25 °C ND See relevant detail specification R, S, T, VII0,65See relevant detail spec. Sub-group A4a Static characteristics at maximum operating temperature ND See relevant detail specification R S T, V S-4 S-4 n.a. 1,0 2,5 n.a. See relevant detail spec. Sub-group A4b Static characteristics at minimum operating temperature ND See relevant detail specification R S T, V S-4 S-4 n.a. 1,0 2,5 n.a. See relevant detail spec. Sub-group A5 Dynamic characteristics at 25 °C ND See relevant detail specification R S, T, V S-4 S-4 1,5 2,5 See relevant detail spec. Group B Inspection Sub-group B1 Dimensions 4.3 ND IEC outline (See IEC 191-2 and see detail-spec. for specific type) R, S, T, VS-41,0See relevant detail spec. Sub-group B2 Solderability 4.6.10.1 DSolder bath No ageing requiredR, S, T, VS-32,54.6.10.1 Sub-group B3 Sealing test (cavity packages) ND R, S, T, VII1,0 Fine leak 4.6.9.1 Gross leak 4.6.9.2 4.6.9.1 Test Qk 4.6.9.2 Test Qc 4.6.9.1 4.6.9.2 Notes on page 2 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 4 © BSI 03-2000 Examination or test D or ND Test Conditions Assessment level Inspection requirements See Note 2See Note 2ILAQL Limits See Note 2 Sub-group B4R, S, T V S-4 n.a. 2,5 n.a. Change of temperature 4.6.8.1 4.6.8.1 Test Na T = Tstg min and max (See relevant detail specification) Endpoint tests 1) for cavity packages: Fine and gross leak test NDTest Qk 4.6.9.1 and Qc 4.6.9.2 2) for non-cavity packages: Damp heat accelerated DTest Da 4.6.3.1 Electrical testsas for sub-groups A2 and A3 as for sub-gr. A2 and A3 of detail spec. Sub-group B5ND168 h + 72 hR, S, T V S-4 n.a. 1,5 n.a. 10 Electrical endurance 4.2 of CECC 90100 at Tamb = 125 °C, unless otherwise stated in the DS but not less than the max. operating temperature. (This may result in the limiting values being exceeded. It shall be ascertained during setting up the DS, if the higher temperature is permissible for the duration of the endurance test.) Endpoint test Electrical test As for Sub-groups A2, A3, A5 as for sub-gr. A2, A3, A5 of detail spec. Notes on page 2 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 © BSI 03-20005 Examination or test D or ND Test Conditions Assessment level Inspection requirements See Note 2See Note 2Pnc Limits See Note 2 Group C Inspection Sub-group C1 Dimensions 4.3 ND IEC outline All dimensions excluding those in sub-gr. B1 (see detail spec. for specific type) R, S, T, V3181 See relevant detail spec. Sub-group C2 Resistance to cleaning solvents 4.4 ND Test XA R, S, T V 3 n.a.to be included later Sub-group C3 Rebustness of terminations 4.6.12.2 DR, S, T, V3181 4.6.12.2 Force (see relevant detail spec.) 4.6.12.2 no broken terminations Sub-group C4D4.6.11R, S, T, V3432 Resistance to soldering heat followed by change of temperature 4.6.8.1 or 4.6.8.3 T = Tstgmin and max (see relevant detail specification) Endpoint tests 1)for cavity packages: Fine and gross leak test Test Qk 4.6.3.1 Test Qc 4.6.9.2 2)for non-cavity packages: Damp heat accelerated Test Da 4.6.9.2 Electrical testsas for sub-groups A2 and A3 as for sub-gr. A2 and A3 of detail spec. Notes on page 2 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 6 © BSI 03-2000 Examination or test D or ND Test Conditions Assessment level Inspection requirements See Note 2See Note 2Pnc Limits See Note 2 Sub-group C5 (cavity packages) DR, S, T, V3181 Shock 4.6.44.6.4 Peak acceleration 14 700 ms2 Pulse duration 0,5 ms Vibration, swept frequency 4.6.5 4.6.5 Applied in 3 mutual perpendicular axes, approximately 12 cycles in each direction Acceleration, steady state 4.6.7 4.6.7 196 000 ms2 axis Y1, Y2 Endpoint tests fine leak 4.6.9.1 gross leak 4.6.9.2 4.6.9.1 Test Qk 4.6.9.2 Test Qc 4.6.9.1 4.6.9.2 Electrical testsas for sub-groups A2 and A3 as for sub-gr. A2 and A3 of detail spec. Sub-groups C6 (cavity packages) DR, S, T, V3322 Damp heat, steady state 4.6.2 4.6.2 Condition 1 56 days Endpoint tests Electrical tests as for sub-groups A2 and A3 as for sub-gr. A2 and A3 of detail spec. Sub-group C7 (non-cavity packages) DBias conditions, if required, see relevant detail specification R, S T, V 3 n.a. 32 n.a. 2 n.a. Damp heat, steady state 4.6.2 4.6.2 Condition 3 21 days Endpoint tests Electrical tests as for sub-groups A2 and A3 as for sub-gr. A2, A3 of detail spec. Sub-group C8 Electrical endurance 4.2 of CECC 90100 ND 1 000 h at Tamb = 125 °C, unless otherwise stated in the DS but not less than the max. operating temperature. (This may result in the limiting values being exceeded. It shall be ascertained during setting up the DS, if the higher temperature is permissible for the duration of the endurance test.) R, S, T, V3432 Endpoint tests Electrical tests as for sub-groups A2, A3 and A5 as for sub-gr. A2 and A3 and A5 of detail spec. Notes on page 2 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:27:29 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 90101:1980 © BSI 03-20007 Examination or test D or ND Test Cond