BS-EN-123800-1997.pdf

BRITISH STANDARD BS EN 123800:1997 Harmonized system of quality assessment for electronic components Sectional specification: Flexible multilayer printed boards with through connections The European Standard EN 123800:1996 has the status of a British Standard ICS 31.180 Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 15:41:02 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 123800:1997 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 May 1997 © BSI 03-1999 The following BSI references relate to the work on this standard: Committee reference EPL/52 Draft for comment 91/03619 DC ISBN 0 580 27429 2 Committees responsible for this British Standard The preparation of this British Standard was entrusted by Technical Committee EPL/52, Printed circuits, upon which the following bodies were represented: British Telecommunications plc Federation of the Electronics Industry GAMBICA (BEAMA Ltd.) National Supervising Inspectorate (BSI-PC) Printed Circuit Interconnection Federation Surface Mount and Related Technologies (SMART Group) Ltd. Amendments issued since publication Amd. No.DateComments Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 15:41:02 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 123800:1997 © BSI 03-1999i Contents Page Committees responsibleInside front cover National forewordii Foreword2 Text of EN 1238003 List of referencesInside back cover Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 15:41:02 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 123800:1997 ii © BSI 03-1999 National foreword This British Standard has been prepared by Technical Committee EPL/52, and is the English language version of EN 123800:1996 Sectional specification: Flexible multilayer printed boards with through connections, published by the European Committee for Electrotechnical Standardization (CENELEC). A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Cross-references Publication referred toCorresponding British Standard EN 123000:1991BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: Printed boards BS 2011 Environmental testing IEC 68-2-3:1969Part 2.1Ca:1977 Test Ca. Damp heat, steady state IEC 68-2-20:1979Part 2.1T:1981 Test T. Soldering IEC 68-2-38:1974Part 2.1Z/AD:1977 Tests Z/AD. Composite temperature/humidity cyclic test IEC 194:1988BS 4727 Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1 Terms common to power, telecommunications and electronics Group 11:1991 Printed circuits BS 6221 Printed wiring boards IEC 326-2:1990Part 2:1991 Methods of test IEC 326-3:1991Part 3:1991 Guide for the design and use of printed wiring boards Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the EN title page, pages 2 to 44, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 15:41:02 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM EN 123800 December 1996 Descriptors: Multilayer printed boards, with through connections, capability test, quality conformance inspection, test patterns English version Sectional specification: Flexible multilayer printed boards with through connections Spécification intermédiaire: Cartes imprimées multicouches souples avec connexions transversales Rahmenspezifikation: Flexible Mehrlagen-Leiterplatten mit Durchverbindungen This European Standard was approved by CENELEC on 1992-05-22. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels © 1996 Copyright reserved to CENELEC members Ref. No. EN 123800:1996 E Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 15:41:02 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123800:1996 © BSI 03-1999 2 Foreword This European Standard was prepared by CLC/TC CECC/SC 52, Printed boards (former WG 23). It is based, wherever possible, on the Publications of the International Electrotechnical Commission, and in particular on IEC 326-9, Printed boards, Part 9: Specification for flexible multilayer printed boards with through connections. The text of the draft based on document CECC(Secretariat)2865 was submitted to the formal vote; together with the voting report, circulated as document CECC(Secretariat)3092, it was approved as EN 123800 on 1992-05-22. The following dates were fixed: Contents Page Foreword2 1Introduction3 1.1Scope and object3 1.2Related documents3 2General3 3Test specimen3 3.1Capability Approval3 3.2Quality conformance inspection3 4Relevant specification4 5Characteristics of the printed board4 6Capability test programme17 7Quality conformance inspection18 8Test pattern Test boards18 8.1General18 8.2Application of test patterns and test boards22 8.3Structure of test boards22 8.4Multiple arrangements of the composite test pattern22 8.4.1 Examples of multiple arrangements23 Page Figure 1 Length of defect21 Figure 223 Figure 3a Layer 125 Figure 3b Layer 226 Figure 3c Layer 327 Figure 3d Layer 428 Figure 3e Layer 529 Figure 3f Layer 630 Figure 3g31 Figure 3h32 Figure 4 L specimen40 Figure 5 Examples of delamination41 Figure 6a Methods of reinforcing lands42 Figure 6b Examples relating to access holes43 Figure 7 Examples of soldered holes44 Table I Basic characteristics 5 Table II Additional characteristics 14 Table III17 Table IV19 Table V22 Table VI Test board structure24 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement(dop) 1997-07-01 latest date by which the national standards conflicting with the EN have to be withdrawn(dow) 2003-08-12 Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 15:41:02 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123800:1996 © BSI 03-19993 1 Introduction IEC 326-9 is the IEC Standard for flexible multilayer printed boards with through connections. The following document comprises this IEC Standard and in accordance with the Generic Specification EN 123000, the information additionally necessary for printed boards intended to be handled within the CENELEC system for electronic components of assessed quality. 1.1 Scope and object This document is a Sectional Specification (SS) relating to flexible multilayer printed boards with through connections irrespective of their method of manufacture, when they are ready for the mounting of the components. It defines the characteristics to be assessed and the test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection). 1.2 Related documents IEC 68, Basic environmental testing procedures. IEC 97, Grid system for printed circuits. IEC 194, Terms and definitions for printed circuits. IEC 249, Metal-clad base materials for printed circuits. IEC 326-1, Printed boards, instructions for the specification writer. IEC 326-2, Test methods for printed boards. IEC 326-3, Recommendations for the design and the use of printed boards. IEC 326-9, Specification for flexible multilayer printed boards with through-connections. 2 General This Sectional Specification (SS) applies to flexible printed boards with through-connections and is intended as a basis for the preparation of a Capability Detail Specification (CapDS) applying to specific materials e.g. according to IEC 249-2, and to be used for Capability Approval Procedures. It may be necessary to have a CapDS for each type of material. A CapDS may be prepared by an international or national body or by a manufacturer (see also CECC 00 111/IV). Customer Detail Specification (CDS) for the custom built printed boards, according to clause 5 of EN 123000. The CDS will normally be written by the customer and allocated a number within his own system. Further details are also given in EN 123000 and CECC 00 114/III. Table I contains the basic characteristics that will normally be important for flexible multilayer printed boards with through connections and makes reference to the appropriate tests to verify these characteristics. Table II contains the additional characteristics that may be important for certain flexible multilayer printed boards with through connections and/or certain applications and makes reference to the appropriate tests to verify these characteristics. Where necessary, the relevant specification may quote characteristics and tests from this Table II. Where additional details for a test have to be specified in the relevant specification, this shall be indicated by “*” in the relevant column. These details shall then be specified in accordance with CECC 00 010 (IEC 326-2). Table III contains the capability test programme. A specified composite test pattern (CTP) is used as a capability qualifying component. Table IV contains the information for the quality conformance inspection. The tables are not intended to prescribe a test sequence. The tests may be carried out in any sequence, unless otherwise specified. 3 Test specimen A test specimen, which may be specifically designed for this purpose (composite test pattern), or taken from production (production board), which is used for verifying capability in accordance with the relevant Generic Specification. A suitable composite test pattern is shown in Figure 3a, Figure 3b, Figure 3c, Figure 3d, Figure 3e, Figure 3f, Figure 3g, Figure 3h, Figure 4a, and Figure 4b to this document. 3.1 Capability Approval 3.1.1 Basic capability The test shall be carried out on the composite test pattern given in clause 8. 3.1.2 Additional capability Clause 3.5.3 of EN 123000 shall apply. For multiple arrangements; see also clause 8. 3.1.3 Maintenance of capability approval Clause 3.8 of EN 123000 shall apply. 3.2 Quality conformance inspection Unless otherwise specified, production boards and/or specially designed test patterns may be used for carrying out tests for the lot-by-lot and the periodic inspection. Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 15:41:02 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123800:1996 4 © BSI 03-1999 Where specifically designed test patterns shall be used they may be included in the panel. They may be based on the appropriate pattern of the composite test pattern; see clause 8. Consultation between manufacturer and customer will usually be necessary. 4 Relevant specification The term “relevant specification” means a product specification for an actual printed board., i.e. a CDS as well as a CapDS applied to a specific material and technique, as applicable. The relevant specification shall contain all information necessary to define the printed board clearly and completely. The recommendations given in IEC 326-3 shall preferably be followed. Care should be taken to avoid unnecessary prescription. Permissible deviations should be stated where necessary, nominal values without tolerances or simple maxima or minima shall be given where sufficient. Where tolerances are necessary for certain areas or parts of the printed board only, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation of tolerance classes etc., the selections given in IEC 326-3 shall preferably be applied. In cases of discrepancy between the CDS and other pertinent specifications (e.g. BS, GS, or SS), the CDS shall prevail. 5 Characteristics of the printed board Basic characteristics, see Table I Additional Characteristics, see Table II Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 15:41:02 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123800:1996 © BSI 03-19995 Table I Basic characteristics (mandatory assessments) CharacteristicsTest No. IEC 326-2 Additional Tests Specimen of Composite Test Pattern RequirementsRemarks General Examination Visual Examination Conformity and Identification 1 a Complete printed board or composite test pattern Pattern, marking, identification, material and finishes shall comply with the relevant specification. There shall be no apparent defects. Appearance and Workmanship 1aComplete printed board or composite test pattern The boards shall appear to have been processed in a careful and workmanlike manner, in accordance with good current practice. Plated-through holes Complete printed board or composite test pattern Plated-through holes shall be clean and free from inclusions of any sort that could affect component insertion and solderability, Total area of the voids shall not exceed 10 % of the total wall area. The largest dimension shall not exceed 25 % of the hole circumference in the horizontal plane and 25 % of the thickness of the board in the vertical plane. Plated-through holes shall have no plating voids at the interface of the hole wall and the conductive pattern or internal layer ring. The interface shall be considered to extend into the hole below the surface of the board a distance of 1,5 times the total copper thickness on the surface or to be two times the inner layer thickness at the level of contact ring. a see clause 2 Licensed Copy: sheffieldun sheffieldun, na, Sat Oct 28 15:41:02 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 123800:1996 6 © BSI 03-1999 Table I Basic characteristics (mandatory assessments) CharacteristicsTest No. IEC 326-2 Additional Tests Specimen of Composite Test Pattern RequirementsRemarks 1cResin smear at the edge of the clad copper and the continuous plated copper is permitted