BS-CECC-123500-003-1994.pdf

BRITISH STANDARD BS CECC 123500-003: 1994 Incorporating Amendment No. 1 Specification for Harmonized system of quality assessment for electronic components: Capability detail specification: Flexible printed boards with through-connections Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:30 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 123500-003:1994 This British Standard, having been prepared under the direction of the Electronic Components Standards Policy Committee, was published under the authority of the Standards Board and comes into effect on 15 February 1994 © BSI 09-1999 The following BSI references relate to the work on this standard: Committee reference ECL/19 Draft for comment 93/206143 DC ISBN 0 580 22732 4 Committees responsible for this British Standard The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee ECL/19, upon which the following bodies were represented: British Telecommunications plc EEA (the Association of Electronics, Telecommunications and Business Equipment Industries) Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation GAMBICA (BEAMA Ltd.) Institute of Metal Finishing Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mount and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No.DateComments 9208December 1996 Indicated by a sideline in the margin Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:30 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 123500-003:1994 © BSI 09-1999i Contents Page Committees responsibleInside front cover Forewordii 1General1 2Capability qualifying component (CQC)1 3Capability approval3 4Capability test programme3 5Traceability4 Appendix A21 Appendix B23 Appendix C24 Appendix D25 Appendix E Edge connector imperfections26 Appendix F Adhesion of plating: tape method27 Appendix G Porosity of platings method of test28 Appendix H Solvent resistance of organic coatings29 Appendix J Solder resistance of organic coatings29 Figure 1a Composite test pattern for flexible printed boards with through connections21 Figure 1b Detailed dimensions of specimens shown in Figure 1a22 Figure 2 Test pattern for marking inks23 Figure 3 Test pattern for solder mask or coverlayer24 Figure 4a Assembly of test pattern for rigidizers or stiffeners25 Figure 4b Component parts of test pattern for rigidizers or stiffeners26 Table I Capability approval test schedule5 Table IIa Additional metallic conductor finishes10 Table IIb Additional contact finishes14 Table III Permanent organic finishes15 Table IV Bonded stiffeners and rigidizers18 List of referencesInside back cover Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:30 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 123500-003:1994 ii © BSI 09-1999 Foreword This British Standard has been prepared under the direction of the Electronic Components Standards Policy Committee. It is a capability detail specification (Cap DS) within the BS CECC system and should be read in conjunction with BS EN 123500. It has been produced to reflect the capability level established in the United Kingdom for the supply of printed boards to the defence, computer, communications and similar industries over many years. It is generally equivalent to that defined by BS 9000 General requirements for a system for electronic components of assessed quality and, in particular, by BS 9761 Sectional specification for capability approval of manufacturers of multilayer rigid printed wiring boards of assessed quality with plated through holes. The capability level defined is enhanced compared to that described by BS EN 123500-800. In particular capability has been extended to include the following: a) more surface finishes, now split into two groups and referred to the connector area and the remainder of the board respectively; b) more metallic finishes; c) organic finishes used as solder resist; d) marking inks; e) bonded heatsinks; f) accelerated ageing; g) additional capability in the definition of minimum conductors and spacing widths; h) traceability. There is no British Standard equivalent to CECC 00010:1980 which comprises a list of the tests in IEC 326-2 and its supplement IEC 326-2A. A related British Standard to IEC 326-2 and its supplements is BS 6221-2 and its amendments. Cross-references International StandardCorresponding British Standard EN 123000:1991BS EN 123000:1992 Harmonized system of quality assessment for electronic components. Generic specification: printed boards (Identical) EN 123500:1992BS EN 123500:1992 Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections (Identical) IEC 68BS 2011 Environmental testing (Most Parts are identical) IEC 249BS 4584 Metal-clad base materials for printed wiring boards (Most Parts are identical) ISO 1463:1982BS EN ISO 1463:1995 Metallic and oxide coatings. Measurement of coating thickness. Microscopical method (Identical) ISO 3543:1981BS EN ISO 3543:1995 Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method (Identical) Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:30 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 123500-003:1994 © BSI 09-1999iii The Technical Committee has reviewed the provisions of ISO 3542:1982, to which reference is made in the text, and has decided that they are acceptable for use in conjunction with this standard. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i to iv, pages 1 to 30, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:30 GMT+00:00 2006, Uncontrolled Copy, (c) BSI iv blank Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:30 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 123500-003:1994 © BSI 09-19991 1 General 1.1 Scope This Capability Detail Specification is based on BS EN 123500. It relates to double-sided flexible printed boards with through connections made with materials and surface finishes as specified in 2. 1.2 Object To specify the Capability Qualifying Component “CQC”, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability. 2 Capability Qualifying Component (CQC) Test boards to be used as CQCs for basic capability shall be made of one of the copper-clad base materials specified in 2.1 of this Cap DS, with a nominal base film thickness of 75 4m Polyester film or 50 4m Polyimide film, clad with 35 4m copper foil on both sides. bear the composite test pattern (CTP) specified in Appendix A of this document; have one of the surface finishes specified by groups 11, 12, 13, 14, 15, 16, 17 or 18 in 2.2 of this Capability Detail Specification. Test boards to be used as CQCs for additional capability shall be modified to demonstrate the claimed capability see 3.5.3 of BS EN 123000. 2.1 Materials Material group designations A and B cover the base materials for flexible circuits; C and D cover materials for film stiffeners; E and F cover rigid board materials used for the fabrication of rigidizers. Material group designation SpecificationMaterial (see footnote)Material thickness range 4m Cu thickness 4mIECTypeGrade A249-2-8Polyester filmGeneral purpose12.5.12518, 35, 70 B249-2-13 249-2-15 Polyimide film Polyimide film General purpose Defined flammability (vertical) 12.5.12518, 35, 70 C249-2-8Polyester filmGeneral purpose12.5.1250, 18, 35, 70 D249-2-13 249-2-15 Polyimide film Polyimide film General purpose Defined flammability (vertical) 12.5.1250, 18, 35, 70 E 249-2-1 249-2-2 249-2-6 249-2-7 249-2-14 249-2-3 Phenolic paper Phenolic paper Phenolic paper Phenolic paper Phenolic paper Epoxide paper High electrical Economic Defined flammability (horizontal) Defined flammability (vertical) Economic, Defined flammability (vertical) Defined flammability (vertical) 200.6,400 0, 18, 35, 70 F249-2-4 249-2-5 Epoxide woven glass Epoxide woven glass General purpose Defined flammability (vertical) 200.6,400 0, 18, 35, 70 Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:30 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 123500-003:1994 2 © BSI 09-1999 2.2 Surface finishes 2.2.1 Metallic finishes The demonstration of metallic finish group 21, 22, 23 or 24, if claimed, shall be combined with a finish from group 11, 12, 13, 15, 16 or 17. 2.2.1.1 Accelerated ageing The ability of finishes from group 11, 12, 13, 14, 15, 16, 17 or 18 to solder after extended or adverse storage conditions is demonstrated using accelerated ageing. This test shall be carried out on those finishes where accelerated ageing is claimed. Each finish that has complied with the requirements of the accelerated ageing test is highlighted by the inclusion of all asterisk (*) adjacent to that finish in the manufacturers abstract of capability as published in the QPL. 2.2.2 Organic finishes The demonstration of organic finish group a, b, c, d, or e shall be over one finish from group 11, 12, 13, or one from group 14, 15, 16, 17 or 18. All claimed types of solder mask/coverlayer and marking ink shall be tested separately. Film coverlayers having different adhesive types shall be tested separately. 2.3 Variant designation The combination of any material group designated in 2.1 and any of the surface finishes as designated in 2.2 constitutes a variant. The variant is designated by the combination of material and finish group designations e.g. A12(b) or A12/21(c). Finish group designation Surface finishAbbreviation for QPL 11Bare copperCu 12Copper with temporary protective coatingCu(tpc) 13Copper with oxideCu(CuO) 14Tin, tin-lead (as plated)Sn, SnPb 15Tin-lead (fused)SnPb(f) 16Tin-lead (dipped and levelled)SnPb(dl) 17Tin-lead (roller coated)SnPb(rt) 18Immersion gold over electroless nickelAuNi (Smt) 21Specimen K 5 4m min. gold plated on copper, remainder using finish group 11 17 (see below) 5 Au/Cu, Cu, Sn, SnPb 22Specimen K 0.7 4m min. gold plated on nickel, remainder using finish group 11 17 (see below) 0.7 Au/Ni Cu, Sn, SnPb 23Specimen K 2.5 4m min. gold plated on copper, remainder using finish group 11 17 (see below) 2.5 Au/Cu Cu, Sn, SnPb 24Specimen K 2.5 4m min. gold plated on nickel, remainder using finish group 11 17 (see below) 2.5 Au/Ni Cu, Sn, SnPb Finish group designation Organic finishAbbreviation for QPL aAdhesive-coated film coverlayerAFC bDry film solder maskDSM cWet resist solder mask/coverlayerWRC dLiquid photopolymer solder mask/coverlayer WPC eMarking inksMI Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:30 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 123500-003:1994 © BSI 09-19993 3 Capability approval 3.1 Range of capability approval Capability approval granted on the testing of one variant is valid within the limits specified in 3.7 of BS EN 123000 for metal-clad base material within one group designation, all base material thicknesses and all foil thicknesses in accordance with 2.1 as follows: approval for material group A covers material group A only; approval for material group B covers material groups A and B. all metallic surface finishes within one surface finish group as quoted in 2.2.1, that is: finish group 11 covers finish group 11 only finish group 12 covers finish group 11 and 12 finish group 13 covers finish group 11 and 13 finish group 13 covers finish group 11 and 14 finish group 15 covers finish group 11 and 15 finish group 16 covers finish group 11 and 16 finish group 17 covers finish group 11 and 17 finish group 18 covers finish group 18 only finish group 21 covers finish group 21 only finish group 22 cover finish group 22 and 24 finish group 23 covers finish group 21 and 23 finish group 24 covers finish group 24 only Each organic finish in 2.2.2 over a finish from group 11, 12 or 13 covers 11, 12 or 13 only. Each organic finish in 2.2.2 over a finish from group 14, 15, 16 or 17 covers 11, 12 or 13 in addition. 3.2 QPL information The QPL information shall be given in accordance with 3.4 of BS EN 123000 and shall contain the following details: 4 Capability test programme Each separate process shall be assessed within the test programme. 4.1 Capability demonstration Capability shall be demonstrated by the manufacturer using 9 composite test patterns (CTPs) of one variant from each material group claimed. Testing shall be in accordance with Table I. 4.1.1 Other metallic surface finishes If claimed, other metallic surface finishes, as designated in 2.2.1, shall be demonstrated by the manufacture of 3 CTPs which include sufficient extra specimens A and H to meet the requirements of Table II. Testing shall be in accordance with Table II. NOTE 1The maximum claimed active board size for the finish shall be demonstrated. NOTE 2Demonstration of metallic surface finishes using materials from group A or group B apply to that group only. reference to the BS EN Generic Specification: 123000 reference to the BS EN Sectional Specification: 123500 reference to this BS CECC Capability Detail Specification: 123500-003 materials for which approval is granted as given in 2.1 surface finishes for which approval is granted as given in 2.2 any additional capability, 3.5.3 of BS EN 123000 refers. Licensed Copy: London South Bank University, London South Bank University, Sat Dec 09 01:23:30 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS CECC 123500-003:1994 4 © BSI 09-1999 4.1.2 Organic surface finishes Each claimed organic surface finish, as designated in 2.2.2, shall be demonstrated by the manufacture of 3 CTPs using the pattern in Appendix B for marking inks and Appendix C for coverlayers/solder mask. Testing shall be in accordance with Table III. NOTE 1The maximum claimed active board size for the finish shall be demonstrated. NOTE 2Demonstration of organic surface finishes shall be made on each material group claimed. 4.1.3 Bonded stiffeners and rigidizers Material for stiffeners shall be selected from material group C or D, as appropriate for base mate