BS-EN-160200-2-1998.pdf

BRITISH STANDARD BS EN 160200-2:1998 Harmonized system of quality assessment for electronic components Sectional specification: Microwave modular electronic units of assessed quality Part 2: Index of test methods The European Standard EN 160200-2:1997 has the status of a British Standard ICS 31.020 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:20:24 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 160200-2:1998 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 March 1998 © BSI 04-1999 ISBN 0 580 28453 0 National foreword This British Standard is the English language version of EN 160200-2:1997 published by the European Electronic Components Committee (CECC) of the European Committee for Electrotechnical Standardization (CENELEC). The UK participation in its preparation was entrusted to Technical Committee EPL/500, Modular Electronic Units (MEUs), which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index” or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the EN title page, pages 2 to 50 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No.DateComments Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:20:24 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 160200-2:1998 © BSI 04-1999i Contents Page National forewordInside front cover Foreword2 Text of EN 160200-23 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:20:24 GMT+00:00 2006, Uncontrolled Copy, (c) BSI ii blank Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:20:24 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM EN 160200-2 December 1997 ICS 31.020 Descriptors: Modular electronic units, microwave, assessed quality, test, measurement procedures, index of special test methods English version Sectional specification: Microwave modular electronic units of assessed quality Part 2: Index of test methods Rahmenspezifikation: Elektronische Mikrowellenmodule mit bewerteter Qualität Teil 2: Verzeichnis der Prüfverfahren This European Standard was approved by CENELEC on 1997-07-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels © 1997 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 160200-2:1997 E Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:20:24 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 160200-2:1997 © BSI 04-1999 2 Foreword This sectional specification has been prepared by the United Kingdom under the single originator procedure for approval and publication of CECC specifications (see RP 11-V). It is to be used for the assessment of Microwave Modular Electronic Units (MMEUs) within the CECC capability approval scheme. The content is in accordance with the generic specification for Modular Electronic Units (MEUs) EN 160000 and meets the requirements of Rules of Procedure 14 (RP 14). This part 2 is to be read in conjunction with Part 1 of EN 160200, which details the requirements for obtaining Capability Approval and Specification of MMEUs. It is based wherever possible, on the publications of the International Electrotechnical Commission. The text of the draft was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 160200-2 on 1997-07-01. The following dates were fixed: Contents Page Foreword2 Section 1. General matters3 1.1Scope3 1.2Related documents3 Section 2. Test and measurement procedures4 2.1General4 2.2Special conditions for testing4 2.3Selection guide5 2.4Standard test methods6 2.5Special test methods8 2.6Alternative test methods50 Figure 110 Figure 211 Page Figure 312 Figure 413 Figure 514 Figure 6 15 Figure 716 Figure 817 Figure 918 Figure 1019 Figure 1120 Figure 1220 Figure 1322 Figure 1423 Figure 1525 Figure 1626 Figure 1728 Figure 1830 Figure 1932 Figure 2033 Figure 2135 Figure 2236 Figure 2337 Figure 2438 Figure 2539 Figure 2639 Figure 2740 Figure 2841 Figure 2942 Figure 3043 Figure 3145 Figure 3246 Figure 3347 Figure 3449 Figure 3550 Table 1 Test group selection matrix6 Table 2 Index of special test methods9 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement(dop)1998-06-01 latest date by which the national standards conflicting with the EN have to be withdrawn(dow)1998-06-01 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:20:24 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 160200-2:1997 © BSI 04-19993 Section 1. General matters 1.1 Scope This Part 2 of the Sectional Specification EN 160200 defines standard/reference test methods for Electrical, Mechanical and Visual Inspection as prescribed in Part 1 of the Sectional Specification EN 160200 and Blank Detail Specification EN 160201 for Microwave Modular Electronic Units (MMEUs). Section 3 of EN 160200-1 details general requirements for test and measurement procedures (including environmental test requirements). This Standard specifies a wide range of documents which relate to microwave test methods. Many of which are not covered by IEC or CECC specifications. Although a number of test methods are under preparation by IEC and CECC they are considered acceptable for use in this Standard. Where test methods have been considered suitable for insertion into this Standard they are either referenced under clause 2.4 Standard Test Methods or detailed in full under clause 2.5 Special Test Methods. Examples of MMEUs which are covered by these test methods are: Guidance on the prime electrical characteristics to be measured is given in Annex C of the Blank Detail Specification (BDS) EN 160201. This Part 2 of EN 160200 will be reviewed as other test methods become available. 1.2 Related documents See clause 1.2 of EN 160 000 and 1.2 of EN 160200-1. Latest issue of the following documents applies unless otherwise stated: 1.2.1 IEC specifications Proposed IEC Documents Waveguides and their accessories: Prepared by IEC TC 46B Amplifiers Attenuators Couplers/Power dividers Filters Isolators/Circulators Limiters Mixers Noise Sources Oscillators Phase Shifters Switches Transmitters (e.g. Integrated Multichannel) IEC 154-1:1982Flanges for waveguides: IEC 169 (Part 1 to 22)Radio frequency connectors CECC 22000 also relates 46B(Secretariat)161Electromagnetic Compatibility Measurement to be made on Waveguide and Waveguide Assemblies 46B(Secretariat)162Measurement of Return Loss on Waveguide and Waveguide Assemblies 46B(Secretariat)163Graphical Method for the Determination of Waveguide Performance 46B(Secretariat)164Waveguide and Waveguide Assembly Attenuation 46B(Secretariat)165Waveguide Power Holding Capability 46B(Secretariat)166Variation of Group Delay 46B(Secretariat)167Level of Intermodulation Products 46B(Secretariat)168Decoupling and Rotation of the Plane of Polarization 46B(Secretariat)169Reflection Coefficient at Rectangular Waveguide Interfaces 46B(Secretariat)170RF Gaskets and Metallic Shims 46B(Secretariat)171Revised Proposal for “B” Type Flanges Employing Circular Positional Tolerancing Method of Dimensioning Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:20:24 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 160200-2:1997 4 © BSI 04-1999 1.2.2 CECC specifications 1.2.3 Specification sources IEC and CECC Specifications: for more information contact the relevant National Authorized Institution (ONH). Section 2. Test and measurement procedures 2.1 General This section contains test methods which are applicable to MMEUs. The Standard conditions of test and general requirements for environmental, visual, mechanical and electrical test methods are given in Section 3 of EN 160200-1. It is permissible to sub-contract testing to a CECC approved laboratory see clause 3.1.2 of CECC 00114-III. For the selections of other test methods not specified in this Standard see guidance given in clause 3.1 of EN 160200-1. When performing tests, the conditions of clause 3.2 of EN 160200-1 shall be met. It should be noted that basic testing procedures and measuring methods for Electromechanical Components and Component Boards (Printed Wiring Boards) are detailed in CECC 00 009 and CECC 00 010 respectively. Handling components and electronic assemblies shall be controlled to prevent contamination. As a general rule solderable surfaces shall not be handled with bare hands or fingers. Gloves, if worn, shall be changed as often as necessary to avoid handling parts with dirty or worn gloves. When components are present which may be damaged by electrical overstress (EOS) or electrostatic discharge (ESD), all handling assembly, inspection and testing shall take place at an EOS/ESD safe work station see EN 100015: Basic specification: Protection of electrostatic sensitive devices. 2.2 Special conditions for testing 2.2.1 Precautions Particular attention is drawn to the following hazards: a) RF burns. Personnel shall not be exposed to strong r.f. connectors or open waveguides that are transmitting power which may cause burns to the skin. CECC 00 009Basic specification: Basic testing procedures and measuring methods for Electromechanical Components CECC 00 010Basic specification: Printed Circuit Boards Test Methods CECC 00 803Visual Inspection of Surface Mounted Assemblies EN 135000Generic specification: Travelling Wave Amplifier Tubes EN 136000Generic specification: Magnetrons CECC 45000Generic specification: Space-Charge Controlled Tubes EN 160000Modular Electronic Units (MEUs) prEN 160100Printed Wiring Assemblies EN 160200-1Sectional Specification: Microwave Modular Electronic Units of Assessed Quality Part 1: Capability Approval EN 160201Blank Detail Specification; Microwave Modular Electronic Units of Assessed Quality Capability Approval CECC 63 000Generic specification: Film and Hybrid Integrated Circuits EN 169000Generic specification: Quartz Crystal Controlled Oscillators Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 17 08:20:24 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 160200-2:1997 © BSI 04-19995 b) RF radiation. Components shall be so designed that personnel cannot come into contact with r.f. fields, even at relatively low frequencies. Absorption of r.f. energy by the human body is dependent on frequency and, although at frequencies below 30 MHz most energy passes straight through the body with little heating effect, it still presents a hazard. To minimize leakage of r.f. energy all r.f. connectors, waveguide coupling flanges and cavities shall be correctly fitted and the transmission lines efficiently coupled to a load, before the component is energized with r.f. In particular, care has to be taken to ensure that the eyes are not subjected to r.f. radiation. c) Beryllium oxide ceramics. This material may be used in some components (usually marked with a blue band or BeO). Beryllium oxide dust, or fumes containing it, are highly toxic if inhaled or if particles enter the body via a cut or abrasion. Avoid handling beryllium oxide ceramics; if they are touched, wash the hands before smoking or eating. Do nothing to beryllium oxide ceramics that may produce dust. Cleaning information is available from the manufacturer. d) Implosion and explosion. All evacuated or pressurized components store potential energy which is released if they are broken. The energy level is low in small devices, but may be considerable in large ones. Components shall be stored and transported in their approved package. During installation or replacement any glass or ceramic seals should be treated with care and not subjected to scratching or physical force. The user shall be protected against implosion or explosion of the component when it is installed in test equipment. 2.2.2 Interface devices Interface devices are usually necessary to provide for connection of the microwave item to the test equipment and to generate specialize test stimuli. Particular care is necessary to avoid hazards when flanges are disconnected. With Automatic Test Equipment (ATE) it may be necessary to disable the source as part of the programme before an operator instruction is given for such a disconnection. Provision may also be needed for supporting and moving microwave components at the heights required for testing. Some types of short circuits and shorting loops in microwave components can sometimes be utilized for a d.c. continuity test to check system completeness. Where the power in the system is significant, an r.f. power flux density check for personnel safety should precede any other testing. 2.2.3 High power circuits In high power circuits such as those associated with transmitters,