BS-EN-60352-5-1995 IEC-60352-5-1995.pdf

BRITISH STANDARD BS EN 60352-5:1995 IEC 352-5: 1995 Solderless connections Part 5: Solderless press-in connections General requirements, test methods and practical guidance The European Standard EN 60352-5:1995 has the status of a British Standard Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 07:43:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 60352-5:1995 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 September 1995 © BSI 12-1999 The following BSI references relate to the work on this standard: Committee reference EPL/48 Draft for comment 92/05110 DC ISBN 0 580 24634 5 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/48, Electromechanical components for electronic equipment, upon which the following bodies were represented: Federation of the Electronics Industry Ministry of Defence National Supervising Inspectorate The following bodies were also represented in the drafting of the standard through subcommittees: Association of Manufacturers Allied to the Electrical and Electronics Industry (BEAMA Ltd.) British Telecommunications plc Society of British Aerospace Companies Limited Amendments issued since publication Amd. No.DateComments Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 07:43:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 60352-5:1995 © BSI 12-1999i Contents Page Committees responsibleInside front cover National forewordii Foreword2 Text of EN 60352-53 List of referencesInside back cover Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 07:43:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 60352-5:1995 ii © BSI 12-1999 National foreword This British Standard has been prepared by Technical Committee EPL/48, and is the English language version of EN 60352-5:1995 Solderless connections Part 5: Solderless press-in connections General requirements, test methods and practical guidance, published by the European Committee for Electrotechnical Standardization (CENELEC). It is identical with IEC 352-5:1995, published by the International Electrotechnical Commission (IEC). Cross-references Publication referred toCorresponding British Standard IEC 50 (581):1978BS 4727 Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1 Terms common to power, telecommunications and electronics Group 13:1991 Electromechanical components for electronic equipment IEC 68-1:1988BS 2011 Environmental testing Part 1.1:1989 General and guidance HD 142 S3:1991 (IEC 194:1988) BS 4727 Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1 Terms common to power, telecommunications and electronics Group 11:1991 Printed circuits EN 60249-2-4:1994 (IEC 249-2-4:1987) BS EN 60249 Base materials for printed circuits Part 2 Specifications Section 2.4:1994 Specification for epoxide woven glass fabric copper-clad laminated sheet, general purpose grade EN 60249-2-5:1994 (IEC 249-2-5:1987) Section 5:1994 Specification No. 5 Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) EN 60249-2-11:1994 (IEC 249-2-11:1987) Section 11:1995 Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards EN 60249-2-12:1994 (IEC 249-2-12:1987) Section 12:1994 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards IEC 326-3:1991 BS 6221 Printed wiring boards Part 3:1991 Guide for the design and use of printed wiring boards IEC 326-5:1980Part 5:1982 Specification for single and double sided rigid printed boards with plated-through holes IEC 326-6:1980Part 6:1982 Specification for multilayer printed wiring boards IEC 352-1:1983BS 6516 Solderless connections Part 1:1984 Specification for solderless wrapped connections (including test methods and practical guidance) BS 5772 Specification for electromechanical components for electronic equipment: basic testing procedures and measuring methods IEC 512-4:1976Part 4:1979 Dynamic stress tests Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 07:43:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI BS EN 60352-5:1995 © BSI 12-1999iii A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Publication referred to Corresponding British Standard IEC 512-5:1992Part 5:1993 Impact tests (free components), static load tests (fixed components), endurance tests and overload tests IEC 512-6:1984Part 6:1984 Climatic tests and soldering tests Summary of pages This document comprises a front cover, an inside front cover, pages i to iv, the EN title page, pages 2 to 28, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 07:43:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI iv blank Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 07:43:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM EN 60352-5 March 1995 ICS 29.120.20 Descriptors: Solderless press-in connections, test methods English version Solderless connections Part 5: Solderless press-in connections General requirements, test methods and practical guidance (IEC 352-5:1995) Connexions sans soudure Partie 5: Connexions insérées à force sans soudure Règles générales, méthodes dessai et guide pratique (CEI 352-5:1995) Lötfreie elektrische Verbindungen Teil 5: Einpreßverbindungen Allgemeine Anforderungen, Prüfverfahren und Anwendungshinweise (IEC 352-5:1995) This European Standard was approved by CENELEC on 1995-03-06. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels © 1995 Copyright reserved to CENELEC members Ref. No. EN 60352-5:1995 E Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 07:43:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 60352-5:1995 © BSI 12-1999 2 Foreword The text of document 48B(CO)254 + 254A, future edition 1 of IEC 352-5, prepared by SC 48B, Connectors, of IEC TC 48, Electromechanical components and mechanical structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60352-5 on 1995-03-06. The following dates were fixed: Annexes designated “normative” are part of the body of the standard. In this standard, Annex ZA is normative. Annex ZA has been added by CENELEC. Contents Page Foreword2 Introduction3 Section 1. General 1.1Scope and object3 1.2Normative references3 1.3Definitions4 1.4IEC type designation5 Section 2. Requirements 2.1Workmanship5 2.2Tools5 2.3Press-in terminations6 2.4Printed boards7 2.5Press-in connections7 Section 3. Tests 3.1Testing8 3.2Type tests8 3.3Test schedules12 Section 4. Practical guidance 4.1Current-carrying capacity18 4.2Tool information18 4.3Termination information19 4.4Printed-board information21 Page 4.5Connection information23 Annex ZA (normative) Other international publications quoted in this standard with the references of the relevant European publications27 Figure 1 Effective press-in length5 Figure 2 Parallelism of a solid press-in section6 Figure 3 Test arrangement, bending9 Figure 4 Test arrangement, push-out force10 Figure 5 Test arrangement, vibration10 Figure 6 Test arrangement, contact resistance11 Figure 7 Basic test schedule (see 3.3.2)16 Figure 8 Full test schedule (see 3.3.3)17 Figure 9 Examples of solid press-in sections19 Figure 10 Examples of compliant press-in sections20 Figure 11 Stacked printed board23 Figure 12 Application level a)24 Figure 13 Application level b)24 Figure 14 Application level c)25 Figure 15 Application level d)25 Figure 16 Termination extraction tool (example)26 Table 1 Finished plated-through holes7 Table 2 Vibration, preferred test severities11 Table 3 Number of sets of parts required13 Table 4 Finished plated-through holes22 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement(dop) 1996-03-01 latest date by which the national standards conflicting with the EN have to be withdrawn(dow) 1996-03-01 Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 07:43:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 60352-5:1995 © BSI 12-19993 Introduction This part of IEC 352 includes requirements, tests and practical guidance information. Two test schedules are provided. The basic test schedule applies to press-in connections which conform to all requirements of section 2. These requirements are derived from experience with successful applications of such press-in connections. The full test schedule applies to press-in connections which do not fully conform to all requirements of section 2, for example, which are manufactured using hole diameters, materials or finishes not included in section 2. This philosophy permits cost and time effective performance verification using a limited basic test schedule for established press-in connections and an expanded full test schedule for press-in connections requiring more extensive performance validation. Section 1. General 1.1 Scope and object This part of IEC 352 is applicable to solderless press-in connections where a termination having a suitable solid or compliant press-in section is inserted into a plated-through hole of a double-sided or multilayer printed board for use in telecommunication equipment and in electronic devices employing similar techniques. Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. NOTEPress-in technology, its applications and industrial experience with the technology are progressing rapidly. In order to keep pace with this progress, a revision of this document is in preparation. The object of this part is to determine the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. There are different designs for the press-in section of press-in terminations and different materials for terminations in use. For this reason solid and compliant terminations are only specified by fundamental parameters while the performance requirements of the printed board and the complete press-in connection are specified in full detail. This part aims to provide a means of comparing test results when the tools used to make the connections are of different designs or manufacture. 1.2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 352. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this part of IEC 352 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 50(581):1978, International Electrotechnical Vocabulary (IEV) Chapter 581: Electromechanical components for electronic equipment. IEC 68-1:1988, Environmental testing Part 1: General and guidance. Amendment No. 1 (1992) IEC 68-2-60 TTD:1990, Environmental testing Part 2: Tests Test Ke: Corrosion tests in artificial atmosphere at very low concentration of polluting gas(es). IEC 194:1988, Terms and definitions for printed circuits. IEC 249-2-4:1987, Base materials for printed circuits Part 2: Specifications Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade. IEC 249-2-5:1987, Base materials for printed circuits Part 2: Specifications Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test). Amendment 3 (1993) Licensed Copy: sheffieldun sheffieldun, na, Fri Nov 10 07:43:23 GMT+00:00 2006, Uncontrolled Copy, (c) BSI EN 60352-5:1995 4 © BSI 12-1999 IEC 249-2-11:1987, Base materials for printed circuits Part 2: Specifications Specification No. 11: Thin epoxide woven glass fabric copper-laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards. Amendment 2 (1993) IEC 249-2-12:1987, Base materials for printed circuits Part 2: Specifications Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards. Amendment 2 (1993) IEC 326-3:1991, Printed boards Part 3: Design and use of printed boards. IEC 326-5:1980, Printed boards Part 5: Specification for single and double-sided printed boards with plated-through holes. Amendment No. 1 (1989) IEC 326-6:1980, Printed boards Part 6: Specification for multilayer printed boards. IEC 352-1:1983, Solderless connections Part 1: Solderless wrapped connections General requirements, test methods and practical guidance. IEC 512-1:1984, Electromechanical components for electronic equipment; basic testing procedures and measuring methods Part 1: General. Amendment No. 1 (1988) IEC 512-2:1985, Electromechanical components for electronic equipment; basic testing procedures and measuring methods Part 2: General examination, electrical continuity and contact resista