JIS Z3198-2-2003 英文版 无铅焊剂的试验方法.第2部分机械拉伸特性试验的试验方法.pdf
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1、J IS JAPANESE I NDUSTRIAL STANDARD Translated and Published by Japanese Standards Association Test methods for lead-free solders- Part 2 : Methods for testing mec hanical c haracteristics-tensi le test ICs 25.160.50 Reference number : JIS 2 3198-2 : 2003 (E) PROTECTED BY COPYRIGHT 6s Copyright Japan
2、ese Standards Association Provided by IHS under license with JSALicensee=Hong Kong Polytechnic Univ/9976803100 Not for Resale, 08/01/2009 04:29:21 MDTNo reproduction or networking permitted without license from IHS -,-,- 免费标准下载网( w w w . f r e e b z . n e t ) 免费标准下载网( w w w . f r e e b z . n e t ) 无
3、需注册, 即可下载 Z 3198-2 : 2003 Foreword This translation has been made based on the original Japanese Industrial Standard established by the Minister of Economy, Trade and Industry through deliberations at the Japanese Industrial Standards Committee according to the proposal of establishing a Japanese In
4、dustrial Standard from The Japan Welding Engineering Society (JWES), with a draft of Industrial Standard based on the provision of Article 12 Clause 1 of the Industrial Standardization Law. Soldering is called HANDAZUKE (Japanese), a technique to be used for mounting electronic and electrical machin
5、ery and apparatus, communication equipment and the like and its use field is wide and expectation for high reliability of the connection is large. Though there are standards inside and outside Japan as well as International Standards like IEC or ISO, this Standard uses results of “standardization of
6、 test methods and the like necessary for solder connection corresponding to the reduction of an environmental load“ based on the research and development by contract of New Energy and Industrial Technology Development Organization. This Standard concerns the methods for testing mechanical characteri
7、stics (tensile test) of lead-free solders which are environmentally friendly and is positioned as a standard for considering environment. Attention is drawn to the possibility that some parts of this Standard may conflict with a patent right, application for a patent after opening to the public, uti
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